Patents by Inventor Yeh-Sheng Wang

Yeh-Sheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silver nanowire protection layer structure and manufacturing method thereof
    Patent number: 11513638
    Abstract: A silver nanowire (SNW) protection layer structure includes a substrate; a SNW layer, disposed on the substrate and covering only a partial region of a surface of the substrate, the SNW layer including a plurality of SNW channels; and a SNW protection layer, disposed on the SNW layer and covering a region corresponding to the plurality of SNW channels, the SNW protection layer including a light-resistant antioxidant. A manufacturing method for the SNW protection layer structure above is further provided. The SNW protection layer structure and the manufacturing method thereof are applicable in a touch sensor.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: November 29, 2022
    Assignee: Cambrios Film Solutions Corporation
    Inventors: Yeh-Sheng Wang, Wei-Chia Fang, Chun-Hung Chu, Chung-Chin Hsiao, Ya-Ting Lin, Shih-Ching Chen
  • SILVER NANOWIRE PROTECTION LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20220197415
    Abstract: A silver nanowire (SNW) protection layer structure includes a substrate; a SNW layer, disposed on the substrate and covering only a partial region of a surface of the substrate, the SNW layer including a plurality of SNW channels; and a SNW protection layer, disposed on the SNW layer and covering a region corresponding to the plurality of SNW channels, the SNW protection layer including a light-resistant antioxidant. A manufacturing method for the SNW protection layer structure above is further provided. The SNW protection layer structure and the manufacturing method thereof are applicable in a touch sensor.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 23, 2022
    Inventors: Yeh-Sheng Wang, Wei-Chia Fang, Chun-Hung Chu, Chung-Chin Hsiao, Ya-Ting Lin, Shih-Ching Chen