Abstract: A portable electronic device includes a base material, a fixing-cover and conductive terminals. The base material has first contact-pads and second contact-pads. The fixing-cover is disposed on a first surface and exposes the first contact-pads. The fixing-cover has a clamp portion. The terminals are disposed on the second contact-pads, wherein a first end of each the terminal extends out of the fixing-cover. A second end leans against the fixing-cover. A central portion is located between the two ends, wherein the bottom of the central portion bulges and contacts the corresponding second contact-pad, and the two ends can swing relatively to the base material around the bottom of the central portion as the pivot. The central portion has a positioning portion formed in direction facing the opening and the positioning portion is embedded in the opening.

Abstract: A portable electronic device includes a base material, a fixing-cover and conductive terminals. The base material has first contact-pads and second contact-pads. The fixing-cover is disposed on a first surface and exposes the first contact-pads. The fixing-cover has a clamp portion. The terminals are disposed on the second contact-pads, wherein a first end of each the terminal extends out of the fixing-cover. A second end leans against the fixing-cover. A central portion is located between the two ends, wherein the bottom of the central portion bulges and contacts the corresponding second contact-pad, and the two ends can swing relatively to the base material around the bottom of the central portion as the pivot. The central portion has a positioning portion formed in direction facing the opening and the positioning portion is embedded in the opening.

Abstract: An improved plating method in combination with a low-temperature thermal treatment is disclosed. The method for reducing the stress in the nickel-based alloy plating comprises the steps of: (a) adding ceramic particles into a plating bath containing soluble nickel salts; and (b) placing a substrate in the plating bath and thereafter carrying out a pulse-current electroplating in the plating bath. The method of this invention can prevent substrate softening or deformation problems. The use of a post low-temperature thermal treatment can slightly increase the hardness of the coating products. The use of the low-temperature thermal treatment can reduce the stress of the coatings since the hydrogen embrittlement resulting from exist of hydrogen in the coatings is eliminated.