Patents by Inventor Yehya M. Kasem

Yehya M. Kasem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet
    Patent number: 5139973
    Abstract: A lead frame and die sub-assembly is first manufactured by a conventional method including bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is stacked first adjacent a dielectric plastic sheet that is in turn stacked against a metal heat spreader block. The dielectric sheet has a centrally located hole registered with the die attach pad. A dollop of an uncured resin is dispensed in the gap between the die attach pad and block. This assembly is compressed between two hot platens whereby the lead fingers, dielectric sheet and the block are bonded together and the resin dollop is flattened to a controlled thickness, namely the thickness of the dielectric sheet. The thickness of the dielectric sheet controls the flattened thickness of the cured resin dollop.
    Type: Grant
    Filed: December 17, 1990
    Date of Patent: August 18, 1992
    Assignee: Allegro Microsystems, Inc.
    Inventors: Bela G. Nagy, Leonard G. Feinstein, Yehya M. Kasem