Patents by Inventor Yeiji Bae

Yeiji Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11472143
    Abstract: A method of manufacturing an insole may include providing an electronic element on a support layer; connecting a connector to the support layer; providing the support layer to a lower mold frame; covering the lower mold frame with an upper mold frame; and applying a foam material between the lower mold frame and the upper mold frame.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: October 18, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se-Gon Roh, Changhyun Roh, Youngbo Shim, Byung-Kwon Choi, Haewook Ahn, Mikyung Park, Yeiji Bae, Minho Choi
  • Patent number: 11234478
    Abstract: An insole may include an insole body in a shape receivable in a shoe; an electronic element provided in the insole body; a connection line configured to electrically connect to the electronic element and including a contact terminal exposed to the outside of the insole body; and a connector including a detachable member configured to at least partially protrude outward from the insole body and configured to support the contact terminal.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: February 1, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se-Gon Roh, Changhyun Roh, Youngbo Shim, Byung-Kwon Choi, Haewook Ahn, Mikyung Park, Yeiji Bae, Minho Choi
  • Publication number: 20200060379
    Abstract: An insole may include an insole body in a shape receivable in a shoe; an electronic element provided in the insole body; a connection line configured to electrically connect to the electronic element and including a contact terminal exposed to the outside of the insole body; and a connector including a detachable member configured to at least partially protrude outward from the insole body and configured to support the contact terminal.
    Type: Application
    Filed: June 6, 2019
    Publication date: February 27, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Se-Gon ROH, Changhyun ROH, Youngbo SHIM, Byung-Kwon CHOI, Haewook AHN, Mikyung PARK, Yeiji BAE, Minho CHOI
  • Publication number: 20200060378
    Abstract: An insole may include an insole body in a shape receivable in a shoe; an electronic element provided in the insole body; a connection line configured to electrically connect to the electronic element and including a contact terminal exposed to the outside of the insole body; and a connector including a detachable member configured to at least partially protrude outward from the insole body and configured to support the contact terminal.
    Type: Application
    Filed: June 6, 2019
    Publication date: February 27, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Se-Gon Roh, Changhyun Roh, Youngbo Shim, Byung-Kwon Choi, Haewook Ahn, Mikyung Park, Yeiji Bae, Minho Choi
  • Publication number: 20200061946
    Abstract: A method of manufacturing an insole may include providing an electronic element on a support layer; connecting a connector to the support layer; providing the support layer to a lower mold frame; covering the lower mold frame with an upper mold frame; and applying a foam material between the lower mold frame and the upper mold frame.
    Type: Application
    Filed: June 6, 2019
    Publication date: February 27, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Se-Gon ROH, Changhyun ROH, Youngbo SHIM, Byung-Kwon CHOI, Haewook AHN, Mikyung PARK, Yeiji BAE, Minho CHOI