Patents by Inventor Yejin Zhang

Yejin Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12287432
    Abstract: The present disclosure provides a phased array LiDAR transmitting chip of mixed materials, a manufacturing method thereof, and a LiDAR device. The phased array LiDAR transmitting chip of mixed materials includes: a first material structure layer and an SOI silicon waveguide structure layer, the first material structure layer is optically connected to the SOI silicon waveguide structure layer through a coupling connection structure; the first material structure layer is configured to couple input light into the chip; the coupling connection structure is configured to split a light wave coupled to the chip, and couple each of split light waves into a corresponding silicon waveguide in the SOI silicon waveguide structure layer; where a non-linear refractive index of the first material in the first material structure layer is lower than a non-linear refractive index of silicon material.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 29, 2025
    Assignee: VANJEE TECHNOLOGY CO., LTD.
    Inventors: Pengfei Wang, Yang Xu, Yejin Zhang, Hongyan Yu, Jiaoqing Pan, Qingfei Wang, Linyan Tian
  • Patent number: 12072445
    Abstract: A phased array LiDAR transmitting chip of multi-layer materials includes: a first material structure layer and an SOI silicon waveguide structure layer, a rear end of the first material structure layer and a front end of the SOI silicon waveguide structure layer form a coupling connection structure. The first material structure layer includes an input coupler and a beam splitter. The input coupler is optically connected to the beam splitter. The beam splitter is optically connected to the SOI silicon waveguide structure layer through the coupling connection structure. The input coupler couples input light to the chip. The beam splitter split a light wave coupled to the chip. The coupling connection structure couples each split light wave to a silicon waveguide in the SOI silicon waveguide structure layer. A non-linear refractive index of a first material in the first material structure layer is lower than that of a silicon material.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 27, 2024
    Assignee: WUHAN VANJEE OPTOELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Pengfei Wang, Yang Xu, Yejin Zhang, Hongyan Yu, Jiaoqing Pan, Qingfei Wang, Linyan Tian
  • Patent number: 11194099
    Abstract: Embodiments of the present disclosure provide a silicon-based optical antenna with a reflective layer and a preparation method therefor. The silicon-based optical antenna comprises: an SOI substrate, the SOI substrate at least comprises a bottom silicon layer, a buried oxide layer, and a top silicon layer, the buried oxide layer is located between the bottom silicon layer and the top silicon layer, the top silicon layer is etched to form a row of waveguides, spacings between the waveguides in the row of the waveguides are in an uneven distribution, each waveguide of the row of the waveguides is etched with gratings, the bottom silicon layer is formed with a groove directly reaching a surface of the buried oxide layer facing the bottom silicon layer, and the surface of the buried oxide layer in the groove is formed with a metal reflective layer.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: December 7, 2021
    Assignee: VANJEE TECHNOLOGY CO., LTD.
    Inventors: Pengfei Wang, Yang Xu, Zhaosong Li, Zhibo Li, Yejin Zhang, Hongyan Yu, Jiaoqing Pan, Qingfei Wang, Linyan Tian
  • Publication number: 20210141063
    Abstract: A phased array LiDAR transmitting chip of multi-layer materials includes: a first material structure layer and an SOI silicon waveguide structure layer, a rear end of the first material structure layer and a front end of the SOI silicon waveguide structure layer form a coupling connection structure. The first material structure layer includes an input coupler and a beam splitter. The input coupler is optically connected to the beam splitter. The beam splitter is optically connected to the SOI silicon waveguide structure layer through the coupling connection structure. The input coupler couples input light to the chip. The beam splitter split a light wave coupled to the chip. The coupling connection structure couples each split light wave to a silicon waveguide in the SOI silicon waveguide structure layer. A non-linear refractive index of a first material in the first material structure layer is lower than that of a silicon material.
    Type: Application
    Filed: September 30, 2020
    Publication date: May 13, 2021
    Inventors: Pengfei Wang, Yang XU, Yejin ZHANG, Hongyan YU, Jiaoqing PAN, Qingfei WANG, Linyan TIAN
  • Publication number: 20210018597
    Abstract: The present disclosure provides a phased array LiDAR transmitting chip of mixed materials, a manufacturing method thereof, and a LiDAR device. The phased array LiDAR transmitting chip of mixed materials includes: a first material structure layer and an SOI silicon waveguide structure layer, the first material structure layer is optically connected to the SOI silicon waveguide structure layer through a coupling connection structure; the first material structure layer is configured to couple input light into the chip; the coupling connection structure is configured to split a light wave coupled to the chip, and couple each of split light waves into a corresponding silicon waveguide in the SOI silicon waveguide structure layer; where a non-linear refractive index of the first material in the first material structure layer is lower than a non-linear refractive index of silicon material.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 21, 2021
    Inventors: Pengfei Wang, Yang XU, Yejin ZHANG, Hongyan YU, Jiaoqing PAN, Qingfei WANG, Linyan TIAN
  • Publication number: 20200218012
    Abstract: Embodiments of the present disclosure provide a silicon-based optical antenna with a reflective layer and a preparation method therefor. The silicon-based optical antenna comprises: an SOI substrate, the SOI substrate at least comprises a bottom silicon layer, a buried oxide layer, and a top silicon layer, the buried oxide layer is located between the bottom silicon layer and the top silicon layer, the top silicon layer is etched to form a row of waveguides, spacings between the waveguides in the row of the waveguides are in an uneven distribution, each waveguide of the row of the waveguides is etched with gratings, the bottom silicon layer is formed with a groove directly reaching a surface of the buried oxide layer facing the bottom silicon layer, and the surface of the buried oxide layer in the groove is formed with a metal reflective layer.
    Type: Application
    Filed: March 20, 2020
    Publication date: July 9, 2020
    Inventors: PENGFEI WANG, Yang Xu, Zhaosong Li, Zhibo Li, Yejin Zhang, Hongyan Yu, Jiaoqing Pan, Qingfei Wang, Linyan Tian