Patents by Inventor Yekan Wang

Yekan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THROUGH SILICON VIAS IN SUBSTRATES
    Publication number: 20250218953
    Abstract: Example methods and apparatus for embedding interconnect bridges having through silicon vias in substrates are disclosed. An example semiconductor package a bridge die disposed in a recess of an underlying substrate, the bridge die including a via that electrically couples a first contact on a first side of the bridge die and a second contact on a second side of the bridge die, the recess extending to a first surface of the underlying substrate; a bond material to electrically and mechanically couple the first contact and an interconnect of the underlying substrate; and a fill material positioned between the first side of the bridge die and the first surface of the underlying substrate.
    Type: Application
    Filed: December 28, 2023
    Publication date: July 3, 2025
    Inventors: Zhixin Xie, Gang Duan, Rahul Manepalli, Srinivas Pietambaram, Andrew Jimenez, Andrey Gunawan, Jung Kyu Han, Minglu Liu, Shriya Seshadri, Yekan Wang, Hong Seung Yeon, Seyyed Yahya Mousavi
  • MOLDING SYSTEM AND MOLDING METHOD
    Publication number: 20250144857
    Abstract: Various aspects may provide a molding system. The molding system may include a molding unit which includes a first mold panel and a second mold panel. The first mold panel and the second mold panel may include a mold cavity which surrounds a semiconductor workpiece along a side surface of the semiconductor workpiece, with the first mold panel and the second mold panel engaged with the semiconductor workpiece. Various aspects may also provide a molding method which utilize the molding system.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 8, 2025
    Inventors: Zhixin XIE, Yi LI, Jesse JONES, Gang DUAN, Andrew JIMENEZ, Jung Kyu HAN, Yekan WANG
  • GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
    Publication number: 20250112136
    Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Inventors: Bohan SHAN, Jesse JONES, Zhixin XIE, Bai NIE, Shaojiang CHEN, Joshua STACEY, Mitchell PAGE, Brandon C. MARIN, Jeremy D. ECTON, Nicholas S. HAEHN, Astitva TRIPATHI, Yuqin LI, Edvin CETEGEN, Jason M. GAMBA, Jacob VEHONSKY, Jianyong MO, Makoyi WATSON, Shripad GOKHALE, Mine KAYA, Kartik SRINIVASAN, Haobo CHEN, Ziyin LIN, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Hiroki TANAKA, Ashay DANI, Praveen SREERAMAGIRI, Yi LI, Ibrahim EL KHATIB, Aaron GARELICK, Robin MCREE, Hassan AJAMI, Yekan WANG, Andrew JIMENEZ, Jung Kyu HAN, Hanyu SONG, Yonggang Yong LI, Mahdi MOHAMMADIGHALENI, Whitney BRYKS, Shuqi LAI, Jieying KONG, Thomas HEATON, Dilan SENEVIRATNE, Yiqun BAI, Bin MU, Mohit GUPTA, Xiaoying GUO
  • HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
    Publication number: 20250014954
    Abstract: Hybrid cores including adhesive promotion layers and related methods are disclosed. An example substrate core for an integrated circuit disclosed herein includes a frame including interior edge, a glass panel including an exterior edge, and an adhesion promotion layer disposed between the interior edge and the exterior edge.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 9, 2025
    Inventors: Soham Agarwal, Gang Duan, Benjamin Duong, Darko Grujicic, Kari Hernandez, Lei Jin, Jesse Cole Jones, Zheng Kang, Shayan Kaviani, Yi Li, Sandrine Lteif, Pratyush Mishra, Mahdi Mohammadighaleni, Pratyasha Mohapatra, Logan Myers, Suresh Tanaji Narute, Srinivas Venkata Ramanuja Pietambaram, Umesh Prasad, Rengarajan Shanmugam, Elham Tavakoli, Marcel Arlan Wall, Yekan Wang, Ehsan Zamani
  • Diamond on nanopatterned substrate
    Patent number: 11634834
    Abstract: A method for growing polycrystalline diamond films having engineered grain growth and microstructure. Grain growth of a polycrystalline diamond film on a substrate is manipulated by growing the diamond on a nanopatterned substrate having features on the order of the initial grain size of the diamond film. By growing the diamond on such nanopatterned substrates, the crystal texture of a polycrystalline diamond film can be engineered to favor the preferred <110> orientation texture, which in turn enhances the thermal conductivity of the diamond film.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: April 25, 2023
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Karl D. Hobart, Tatyana I. Feygelson, Marko J. Tadjer, Travis J. Anderson, Andrew D. Koehler, Samuel Graham, Jr., Mark Goorsky, Zhe Cheng, Luke Yates, Tingyu Bai, Yekan Wang
  • Diamond on Nanopatterned Substrate
    Publication number: 20210381127
    Abstract: A method for growing polycrystalline diamond films having engineered grain growth and microstructure. Grain growth of a polycrystalline diamond film on a substrate is manipulated by growing the diamond on a nanopatterned substrate having features on the order of the initial grain size of the diamond film. By growing the diamond on such nanopatterned substrates, the crystal texture of a polycrystalline diamond film can be engineered to favor the preferred <110> orientation texture, which in turn enhances the thermal conductivity of the diamond film.
    Type: Application
    Filed: August 24, 2021
    Publication date: December 9, 2021
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Karl D. Hobart, Tatyana I. Feygelson, Marko J. Tadjer, Travis J. Anderson, Andrew D. Koehler, Samuel Graham, JR., Mark Goorsky, Zhe Cheng, Luke Yates, Tingyu Bai, Yekan Wang
  • Diamond on nanopatterned substrate
    Patent number: 11131039
    Abstract: A method for growing polycrystalline diamond films having engineered grain growth and microstructure. Grain growth of a polycrystalline diamond film on a substrate is manipulated by growing the diamond on a nanopatterned substrate having features on the order of the initial grain size of the diamond film. By growing the diamond on such nanopatterned substrates, the crystal texture of a polycrystalline diamond film can be engineered to favor the preferred <110> orientation texture, which in turn enhances the thermal conductivity of the diamond film.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: September 28, 2021
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Karl D. Hobart, Tatyana I. Feygelson, Marko J. Tadjer, Travis J. Anderson, Andrew D. Koehler, Samuel Graham, Jr., Mark Goorsky, Zhe Cheng, Luke Yates, Tingyu Bai, Yekan Wang
  • Diamond on Nanopatterned Substrate
    Publication number: 20190360117
    Abstract: A method for growing polycrystalline diamond films having engineered grain growth and microstructure. Grain growth of a polycrystalline diamond film on a substrate is manipulated by growing the diamond on a nanopatterned substrate having features on the order of the initial grain size of the diamond film. By growing the diamond on such nanopatterned substrates, the crystal texture of a polycrystalline diamond film can be engineered to favor the preferred <110> orientation texture, which in turn enhances the thermal conductivity of the diamond film.
    Type: Application
    Filed: May 23, 2019
    Publication date: November 28, 2019
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Karl D. Hobart, Tatyana I. Feygelson, Marko J. Tadjer, Travis J. Anderson, Andrew D. Koehler, Sam Graham, JR., Mark Goorsky, Zhe Cheng, Luke Yates, Tingyu Bai, Yekan Wang