Patents by Inventor Yelim Won
Yelim Won has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11152544Abstract: Disclosed is a method for fabricating CSP LEDs.Type: GrantFiled: February 19, 2020Date of Patent: October 19, 2021Assignee: LUMENS CO., LTD.Inventors: Daewon Kim, Yelim Won
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Patent number: 10847504Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.Type: GrantFiled: April 25, 2019Date of Patent: November 24, 2020Assignee: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Seongbok Yoon, Yelim Won, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
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Patent number: 10818830Abstract: An LED module is disclosed. The LED module includes: a mount substrate including electrodes; an LED chip including a semiconductor stacked structure, a passivation layer covering the outer surface of the semiconductor stacked structure, and electrode pads connected to the outer surface of the semiconductor stacked structure through openings formed in the passivation layer; and solder bumps connecting the electrode pads to the corresponding electrodes and formed using a solder material represented by Sn-M (where M is a metal).Type: GrantFiled: March 25, 2020Date of Patent: October 27, 2020Assignee: LUMENS CO., LTD.Inventors: Daewon Kim, Yelim Won
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Publication number: 20200295234Abstract: Disclosed is a method for fabricating CSP LEDs.Type: ApplicationFiled: February 19, 2020Publication date: September 17, 2020Applicant: LUMENS CO., LTD.Inventors: Daewon KIM, Yelim WON
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Publication number: 20200227606Abstract: An LED module is disclosed. The LED module includes: a mount substrate including electrodes; an LED chip including a semiconductor stacked structure, a passivation layer covering the outer surface of the semiconductor stacked structure, and electrode pads connected to the outer surface of the semiconductor stacked structure through openings formed in the passivation layer; and solder bumps connecting the electrode pads to the corresponding electrodes and formed using a solder material represented by Sn-M (where M is a metal). Each of the electrode pads includes a multilayer body including a plurality of metal layers and a contact body connected to the multilayer body. The contact body includes a surface contact part in contact with the passivation layer outside the opening and an ohmic contact part in contact with the semiconductor stacked structure through the opening.Type: ApplicationFiled: March 25, 2020Publication date: July 16, 2020Applicant: LUMENS CO., LTD.Inventors: Daewon KIM, Yelim WON
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Patent number: 10644212Abstract: An LED module is disclosed. The LED module includes: a mount substrate including electrodes; an LED chip including a semiconductor stacked structure, a passivation layer covering the outer surface of the semiconductor stacked structure, and electrode pads connected to the outer surface of the semiconductor stacked structure through openings formed in the passivation layer; and solder bumps connecting the electrode pads to the corresponding electrodes and formed using a solder material represented by Sn-M (where M is a metal).Type: GrantFiled: August 22, 2018Date of Patent: May 5, 2020Assignee: LUMENS CO., LTD.Inventors: Daewon Kim, Yelim Won
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Patent number: 10636938Abstract: An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.Type: GrantFiled: October 23, 2018Date of Patent: April 28, 2020Assignee: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Yelim Won
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Publication number: 20190252360Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.Type: ApplicationFiled: April 25, 2019Publication date: August 15, 2019Applicant: LUMENS CO., LTD.Inventors: Taekyung YOO, Daewon KIM, Seongbok YOON, Yelim WON, Myungji MOON, Hanbeet CHANG, Yongpil KIM, Jaesoon PARK
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Patent number: 10319706Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.Type: GrantFiled: November 20, 2017Date of Patent: June 11, 2019Assignee: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Seongbok Yoon, Yelim Won, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
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Publication number: 20190165230Abstract: An LED module is disclosed. The LED module includes: a mount substrate including electrodes; an LED chip including a semiconductor stacked structure, a passivation layer covering the outer surface of the semiconductor stacked structure, and electrode pads connected to the outer surface of the semiconductor stacked structure through openings formed in the passivation layer; and solder bumps connecting the electrode pads to the corresponding electrodes and formed using a solder material represented by Sn-M (where M is a metal). Each of the electrode pads includes a multilayer body including a plurality of metal layers and a contact body connected to the multilayer body. The contact body includes a surface contact part in contact with the passivation layer outside the opening and an ohmic contact part in contact with the semiconductor stacked structure through the opening.Type: ApplicationFiled: August 22, 2018Publication date: May 30, 2019Applicant: LUMENS CO., LTD.Inventors: Daewon KIM, Yelim WON
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Publication number: 20190058086Abstract: An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.Type: ApplicationFiled: October 23, 2018Publication date: February 21, 2019Applicant: LUMENS CO., LTD.Inventors: Taekyung YOO, Daewon KIM, Yelim WON
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Publication number: 20180374989Abstract: An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.Type: ApplicationFiled: April 23, 2018Publication date: December 27, 2018Applicant: LUMENS CO., LTD.Inventors: Taekyung YOO, Daewon KIM, Yelim WON
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Patent number: 10164149Abstract: An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.Type: GrantFiled: April 23, 2018Date of Patent: December 25, 2018Assignee: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Yelim Won
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Publication number: 20180233496Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.Type: ApplicationFiled: November 20, 2017Publication date: August 16, 2018Applicant: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Seongbok Yoon, Yelim Won, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
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Patent number: 9985175Abstract: An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.Type: GrantFiled: December 28, 2017Date of Patent: May 29, 2018Assignee: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Yelim Won