Patents by Inventor YEN-AN TSAI

YEN-AN TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240195450
    Abstract: An inquirer-side circuit of an automotive Ethernet system includes: a hybrid circuit arranged to operably couple with an MDI circuit to conduct data communication with a respondent-side circuit; a transmitting circuit coupled with a hybrid circuit and arranged to operably generate and provide a transmission signal to the hybrid circuit; a receiving circuit coupled with the hybrid circuit and arranged to operably receive and parse a received signal transmitted from the hybrid circuit to generate a data signal; a processing circuit coupled with the receiving circuit and arranged to operably process the data signal; a physical coding sublayer circuit coupled with the processing circuit and arranged to operably conduct a physical coding operation according to the instruction of the processing circuit to control the operations of the transmitting circuit; and an echo cancellation circuit coupled between the transmitting circuit and the receiving circuit.
    Type: Application
    Filed: December 4, 2023
    Publication date: June 13, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yuan-Jih CHU, Yao-Chun CHUANG, Ching-Yen LEE, Ming Hsuan TSAI
  • Publication number: 20240195449
    Abstract: An inquirer-side circuit of an automotive Ethernet system includes: a hybrid circuit arranged to operably conduct data communication with a respondent-side circuit through an MDI circuit; a transmitting circuit coupled with a hybrid circuit and arranged to operably generate and provide a transmission signal to the hybrid circuit; a receiving circuit coupled with the hybrid circuit and arranged to operably receive and parse a received signal transmitted from the hybrid circuit to generate a data signal; a processing circuit coupled with the receiving circuit and arranged to operably process the data signal; a physical coding sublayer circuit coupled with the processing circuit and arranged to operably conduct a physical coding operation to control the operations of the transmitting circuit; and an echo cancellation circuit coupled between the transmitting circuit and the receiving circuit, and arranged to operably generate an echo cancellation signal.
    Type: Application
    Filed: December 4, 2023
    Publication date: June 13, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yuan-Jih CHU, Yao-Chun CHUANG, Ching-Yen LEE, Ming Hsuan TSAI
  • Publication number: 20240191040
    Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.
    Type: Application
    Filed: February 21, 2024
    Publication date: June 13, 2024
    Applicant: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia CHANG, Yunn-Kuen CHANG, Wen-Yen HUANG, Ging-Ho HSIUE, Hsieh-Chih TSAI, Shuian-Yin LIN, Nai-Sheng HSU, Tzu-Yu LIN
  • Patent number: 12002904
    Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on and directly contacts the first conductive layer, wherein in a top view, the cushion part is surrounded by and electrically isolated from the second conductive layer.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: June 4, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chao-Hsing Chen, Tsung-Hsun Chiang, Chien-Chih Liao, Wen-Hung Chuang, Min-Yen Tsai, Bo-Jiun Hu
  • Publication number: 20240179699
    Abstract: The present invention provides a control method of an electronic device, wherein the control method includes the steps of: using a first beacon setting to transmit beacons; if a wireless communication state of the electronic device satisfies a condition, using a second beacon setting to transmit beacons; wherein the first beacon setting and the second beacon setting have different beacon periods or different payload sizes.
    Type: Application
    Filed: November 28, 2023
    Publication date: May 30, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ming-Yen Tsai, Tsung-Hsuan Wu, Ching-Yu Kuo
  • Publication number: 20240168985
    Abstract: One or more computing devices, systems, and/or methods are provided. In an example, a first performance metric score may be determined based upon first content item text. A plurality of similarity scores associated with a plurality of sets of content item text may be determined. One or more sets of content item text may be selected from among the plurality of sets of content item text based upon the plurality of similarity scores and a plurality of performance metric scores associated with the plurality of sets of content item text. The plurality of performance metric scores may comprise one or more performance metric scores associated with the one or more sets of content item text. The one or more performance metric scores may be higher than the first performance metric score. One or more representations of the one or more sets of content item text may be displayed.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Inventors: Shaunak Mishra, Changwei Hu, Kevin Yen, Manisha Verma, Yifan Hu, Maxim Ivanovich Sviridenko, Avinash Chukka, Max Edward Beech, Chao-Hung Wang, Hua-Ying Tsai, Kamil Michal Zasadzinski, Wei Yu Lin, Yu Tian
  • Patent number: 11986763
    Abstract: A remote control system for gas detection and purification is disclosed and includes a remote control device, a gas detection module and a gas purification device. The remote control device includes a gas inlet and a gas outlet. The gas detection module is disposed in the remote control device and in communication with the gas outlet to detect the gas located in an indoor space. The gas detection module provides and outputs a gas detection datum, and the remote control device transmits an operation command via wireless transmission. The gas purification device is disposed in the indoor space and receives the operating instruction transmitted from the remote control device to be operated. When the gas purification device is under the activated state, the gas in the indoor space is purified, and the purification operation mode of the gas purification device is adjusted according to the first gas detection datum.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: May 21, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Yung-Lung Han, Chi-Feng Huang, Chun-Yi Kuo, Yang Ku, Chang-Yen Tsai, Wei-Ming Lee
  • Publication number: 20240157801
    Abstract: A method for estimating a flight time of a hydrogen fuel cell UAV (unmanned aerial vehicle) includes multiple steps performed by a controller: obtaining an internal pressure of a hydrogen tank by a pressure sensor installed on the hydrogen tank, calculating a remaining hydrogen volume according to the internal pressure and a capacity of the hydrogen tank, obtaining a reaction current value of the fuel cell, calculating a first hydrogen consumption rate according to the reaction current value, the number of a set of membrane electrodes connected in series and a Faraday constant, obtaining a second hydrogen consumption rate of a purge operation of an anode of the full cell; obtaining a hydrogen leakage rate of a stack of the fuel cell, and calculating the flight time according to the remaining hydrogen volume, the first hydrogen consumption rate, the second hydrogen consumption rate and the hydrogen leakage rate.
    Type: Application
    Filed: May 18, 2023
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Jung LIU, Yuh-Fwu CHOU, Ku-Yen KANG, Yin-Wen TSAI, Ching-Fang HO, Cheng-Hsien YU
  • Patent number: 11984450
    Abstract: A device includes a semiconductive fin, an isolation structure, a gate structure, dielectric spacers, and source/drain epitaxial structures. The isolation structure surrounds a bottom portion of the semiconductive fin. The gate structure is over the semiconductive fin. The dielectric spacers are on opposite sides of the semiconductive fin and over the isolation structure. The dielectric spacers include nitride. The source/drain epitaxial structures are on opposite sides of the gate structure and over the dielectric spacers. The source/drain epitaxial structures have hexagon shapes.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sung-Li Wang, Pang-Yen Tsai, Yasutoshi Okuno
  • Patent number: 11985906
    Abstract: A magnetic tunnel junction (MTJ) memory cell and a metallic etch mask portion are formed over a substrate. At least one dielectric etch stop layer is deposited over the metallic etch mask portion, and a via-level dielectric layer is deposited over the at least one dielectric etch stop layer. A via cavity may be etched through the via-level dielectric layer, and a top surface of the at least one dielectric etch stop layer is physically exposed. The via cavity may be vertically extended by removing portions of the at least one dielectric etch stop layer and the metallic etch mask portion. A contact via structure is formed directly on a top surface of the top electrode in the via cavity to provide a low-resistance contact to the top electrode.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Feng Yin, Tai-Yen Peng, An-Shen Chang, Han-Ting Tsai, Qiang Fu, Chung-Te Lin
  • Publication number: 20240153997
    Abstract: The present disclosure describes a semiconductor device having facet-free epitaxial structures with a substantially uniform thickness. The semiconductor device includes a fin structure on a substrate. The fin structure includes a fin bottom portion and a fin top portion. A top surface of the fin bottom portion is wider than a bottom surface of the fin top portion. The semiconductor device further includes a dielectric layer on the fin top portion, an amorphous layer on the dielectric layer, and an epitaxial layer. The epitaxial layer is on a top surface of the amorphous layer, sidewall surfaces of the amorphous layer, the dielectric layer, the fin top portion, and the top surface of the fin bottom portion.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Winnie Victoria Wei-Ning CHEN, Pang-Yen Tsai
  • Publication number: 20240150592
    Abstract: Provided is a photocurable conductive black composition including: (a) at least one (meth)acrylate-functionalized urethane oligomer; (b) at least one photopolymerizable compound; (c) a photoinitiator; (d) a visible-light blocking system; (e) conductive fillers; and optionally (f) a thermal initiator. Also provided are a method for forming a cured product composed of the photocurable conductive black compositions, and an article comprising the cured product.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 9, 2024
    Inventors: Chien-Ho HUANG, Yi-Ting CHEN, Tsung-Han TSAI, Li-Yen LIN
  • Publication number: 20240154629
    Abstract: A 24 GHz band-pass filter includes a step impedance resonator, a first U-shape feeding portion, a second U-shape feeding portion, short-circuit stubs and open-circuit stubs. The step impedance resonator includes a first main portion, a second main portion, and a connection portion for connecting the main portions to each other. The first main portion and the second main portion are electrically connected to a first signal input/output port and a second signal input/output port. The first U-shape feeding portion is electrically connected between the first main portion and the first signal input/output port. The second U-shape feeding portion is electrically connected between the second main portion and the second signal input/output port. The short-circuit stubs are electrically connected to coupling segments of the step impedance resonator. The open-circuit stubs are electrically connected to the first U-shape feeding portion and the second U-shape feeding portion.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Inventors: Kun Yen TU, Meng-Hua TSAI, Wei Ting LEE, Sin-Siang WANG
  • Publication number: 20240142833
    Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: Innolux Corporation
    Inventors: Wei-Yen Chiu, Ming-Jou Tai, You-Cheng Lu, Yi-Shiuan Cherng, Yi-Hsiu Wu, Chia-Hao Tsai, Yung-Hsun Wu
  • Publication number: 20240139301
    Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 2, 2024
    Inventors: Ming-Tain LAI, Cheng-Der Tony YU, I-Ju CHEN, Wei-Han LEE, Chueh-Hao YANG, Chun-Yen TSAO, Chang-Lin HSIEH, Chien-Chih OU, Chen-En TSAI
  • Patent number: 11971493
    Abstract: An indoor positioning method based on image visual features is disclosed. A Wi-Fi signal strength value of a Wi-Fi tag is matched with a signal strength list to obtain a first location of a first Wi-Fi tag with the greatest matching degree. A SURF descriptor of an image of the Wi-Fi tag is matched with SURF descriptors recorded in the signal strength list to discover an image of a Wi-Fi tag with the greatest matching degree, thereby obtaining a second location of a second Wi-Fi tag corresponding to the image of the Wi-Fi tag with the greatest matching degree. A three location of a three Wi-Fi tag is obtained according to a homography matrix corresponding to the image of the Wi-Fi tag with the largest matching degree. Positioning information of the mobile device is obtained according to the first location, the second location and the third location.
    Type: Grant
    Filed: May 9, 2023
    Date of Patent: April 30, 2024
    Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.
    Inventor: Cheng-Yen Tsai
  • Publication number: 20240133421
    Abstract: An electronic device includes a monitor stand, a hinge mechanism, and an operation element. The hinge mechanism includes a back plate, a speed reduction assembly, and a friction assembly. The back plate is fixed to the monitor stand. The speed reduction assembly includes an input plate and a speed reduction member. The speed reduction member is arranged on the input plate. The friction assembly is arranged between the back plate and the input plate. The operation element is connected to the speed reduction member. A rotation center of the operation element coincides with an axis of the back plate and the speed reduction member are coaxially arranged.
    Type: Application
    Filed: January 17, 2023
    Publication date: April 25, 2024
    Inventors: Chih-Wei KUO, Yu-Chun HUNG, Che-Yen CHOU, Chen-Wei TSAI, Hsiang-Wen HUANG
  • Publication number: 20240128125
    Abstract: A method of forming a semiconductor device includes providing a substrate having a recess, and growing an epitaxial feature in the recess. The method of growing the epitaxial feature includes: (a) growing a sub-layer of the epitaxial feature; (b) selectively etching the sub-layer of the epitaxial feature while providing a first UV radiation; and (c) repeating step (a) and step (b) alternately multiple times.
    Type: Application
    Filed: February 1, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Winnie Victoria Wei-Ning Chen, Chia-Ling Pai, Pang-Yen Tsai
  • Publication number: 20240115790
    Abstract: Disclosed is a drainage bottle system comprising: a system housing, a drainage bottle, a drainage tube, a motorless suction device and a liquid detection device, wherein a piezoelectric suction pump of the motorless suction device generates a negative pressure by means of piezoelectric effect to drive the drainage tube to suck and collect a liquid to be detected into the drainage bottle.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Applicant: PACIFIC HOSPITAL SUPPLY CO., LTD.
    Inventors: Jung-Yen TSAI, Ming-Chung CHEN, Hsuan-Chiao HO
  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao