Abstract: A UV LED reactor includes a housing having an inlet, an outlet and a reactor chamber; a UV LED module mounted to the housing configured to emit UV radiation into the reactor chamber having a selected wavelength range and with a selected energy (E); and a heatsink on the UV LED module configured to dissipate heat generated by the UV LED module. The heatsink on the UV LED module includes one or more surfaces in thermal communication or physical contact with the fluid, which improves the efficiency of heat transfer from the heatsink to the fluid and eliminates the need for cooling fans. The UV LED reactor can also include a UV transparent inner tube mounted to the inlet for generating a double UV exposure flow path through the reactor chamber. The UV LED reactor can also include a UV reflective coating on the sidewalls of the housing, or on a separate tube or sleeve mounted to the housing, configured to reflect UV radiation onto the fluid in the reactor chamber.

Abstract: A nail product curing system for curing nail products includes a housing having a nail treatment space configured to receive a hand of a user and to position one or more nails of the user, and one or more LED light sources on the housing for generating light in the nail treatment space for performing a curing process. The nail product curing system also includes a sensing and controlling system that includes touchless sensors on the housing configured to sense placement of the hand in the nail treatment space, and to control various parameters of the curing process using movement of the user's hands. The sensing and controlling system also includes a circuit board on the housing and a radio transmission controller in signal communication with the circuit board configured to control the LED light sources and the curing process using programmed instructions.

Abstract: A semiconductor packaging device includes a packaging module, a heat dissipation cover and a thermal interface material layer. The package module includes a substrate, and a working chip mounted on the substrate. The heat dissipation cover includes a metal cover fixed on the substrate and covering the working chip, an accommodating recess located on the metal cover to accommodate the working chip, and a plurality of protrusive columns respectively formed on the metal cover and distributed within the accommodating recess at intervals. The depth of the accommodating recess is greater than the height of each protrusive column, and the accommodating recess is greater than the working chip. The thermal interface material layer is non-solid, and located within the accommodating recess between the protrusive columns to wrap the protrusive columns and contact with the working chip, the metal cover and the protrusive columns.

Abstract: A reciprocating unidirectional electromagnetic resistance device includes a shaft having a flywheel installed to a first end of the shaft, an electromagnetic braking unit, and a first sensing device. A spring return device and a second sensing device are installed at a second end of the shaft, and a pull rope device is installed at the middle of the shaft. The electromagnetic braking unit and the spring return device are integrated into a single module and provided for an operator to perform a reciprocating motion to pull out a pull rope of the pull rope device and drive the shaft, the flywheel and the spring return device synchronously, and the electromagnetic braking unit acts an electromagnetic resistance onto the flywheel, so that the flywheel has the excellent precise resistance of the electromagnetic braking unit. When released, the pull rope can be retracted to achieve the reciprocating motion effect.

Abstract: A manufacturing method of a semiconductor packaging device is provided, and the manufacturing method includes steps as follows. A working chip is soldered on one surface of a wiring board so that an working circuit inbuilt inside a chip body of the working chip is electrically connected to the wiring board. A silicon thermal conductivity element is soldered on one surface of a heat-dissipating metal lid. The heat-dissipating metal lid is fixedly covered on the wiring board such that the silicon thermal conductivity element is sandwiched between the chip body and the heat-dissipating metal lid, and the silicon thermal conductivity element is electrically isolated from the working circuit of the chip body and the wiring board.

Abstract: A reciprocating unidirectional electromagnetic resistance device includes a shaft having a flywheel installed to a first end of the shaft, an electromagnetic braking unit, and a first sensing device. A spring return device and a second sensing device are installed at a second end of the shaft, and a pull rope device is installed at the middle of the shaft. The electromagnetic braking unit and the spring return device are integrated into a single module and provided for an operator to perform a reciprocating motion to pull out a pull rope of the pull rope device and drive the shaft, the flywheel and the spring return device synchronously, and the electromagnetic braking unit acts an electromagnetic resistance onto the flywheel, so that the flywheel has the excellent precise resistance of the electromagnetic braking unit. When released, the pull rope can be retracted to achieve the reciprocating motion effect.

Abstract: A manufacturing method of a semiconductor packaging device is provided, and the manufacturing method includes steps as follows. A working chip is soldered on one surface of a wiring board so that an working circuit inbuilt inside a chip body of the working chip is electrically connected to the wiring board. A silicon thermal conductivity element is soldered on one surface of a heat-dissipating metal lid. The heat-dissipating metal lid is fixedly covered on the wiring board such that the silicon thermal conductivity element is sandwiched between the chip body and the heat-dissipating metal lid, and the silicon thermal conductivity element is electrically isolated from the working circuit of the chip body and the wiring board.

Abstract: A semiconductor packaging device includes a wiring board, a working chip, a heat-dissipating metal lid and a silicon thermal conductivity element. The working chip is mounted on the wiring board, and in-built with an working circuit therein. The silicon thermal conductivity element is thermally coupled to the working chip and the heat-dissipating metal lid, and is electrically isolated from the working circuit and the wiring board.

Abstract: A semiconductor packaging device includes a wiring board, a working chip, a heat-dissipating metal lid and a silicon thermal conductivity element. The working chip is mounted on the wiring board, and in-built with an working circuit therein. The silicon thermal conductivity element is thermally coupled to the working chip and the heat-dissipating metal lid, and is electrically isolated from the working circuit and the wiring board.