Abstract: A reciprocating unidirectional electromagnetic resistance device includes a shaft having a flywheel installed to a first end of the shaft, an electromagnetic braking unit, and a first sensing device. A spring return device and a second sensing device are installed at a second end of the shaft, and a pull rope device is installed at the middle of the shaft. The electromagnetic braking unit and the spring return device are integrated into a single module and provided for an operator to perform a reciprocating motion to pull out a pull rope of the pull rope device and drive the shaft, the flywheel and the spring return device synchronously, and the electromagnetic braking unit acts an electromagnetic resistance onto the flywheel, so that the flywheel has the excellent precise resistance of the electromagnetic braking unit. When released, the pull rope can be retracted to achieve the reciprocating motion effect.

Abstract: A manufacturing method of a semiconductor packaging device is provided, and the manufacturing method includes steps as follows. A working chip is soldered on one surface of a wiring board so that an working circuit inbuilt inside a chip body of the working chip is electrically connected to the wiring board. A silicon thermal conductivity element is soldered on one surface of a heat-dissipating metal lid. The heat-dissipating metal lid is fixedly covered on the wiring board such that the silicon thermal conductivity element is sandwiched between the chip body and the heat-dissipating metal lid, and the silicon thermal conductivity element is electrically isolated from the working circuit of the chip body and the wiring board.

Abstract: A reciprocating unidirectional electromagnetic resistance device includes a shaft having a flywheel installed to a first end of the shaft, an electromagnetic braking unit, and a first sensing device. A spring return device and a second sensing device are installed at a second end of the shaft, and a pull rope device is installed at the middle of the shaft. The electromagnetic braking unit and the spring return device are integrated into a single module and provided for an operator to perform a reciprocating motion to pull out a pull rope of the pull rope device and drive the shaft, the flywheel and the spring return device synchronously, and the electromagnetic braking unit acts an electromagnetic resistance onto the flywheel, so that the flywheel has the excellent precise resistance of the electromagnetic braking unit. When released, the pull rope can be retracted to achieve the reciprocating motion effect.

Abstract: A manufacturing method of a semiconductor packaging device is provided, and the manufacturing method includes steps as follows. A working chip is soldered on one surface of a wiring board so that an working circuit inbuilt inside a chip body of the working chip is electrically connected to the wiring board. A silicon thermal conductivity element is soldered on one surface of a heat-dissipating metal lid. The heat-dissipating metal lid is fixedly covered on the wiring board such that the silicon thermal conductivity element is sandwiched between the chip body and the heat-dissipating metal lid, and the silicon thermal conductivity element is electrically isolated from the working circuit of the chip body and the wiring board.

Abstract: A semiconductor packaging device includes a wiring board, a working chip, a heat-dissipating metal lid and a silicon thermal conductivity element. The working chip is mounted on the wiring board, and in-built with an working circuit therein. The silicon thermal conductivity element is thermally coupled to the working chip and the heat-dissipating metal lid, and is electrically isolated from the working circuit and the wiring board.

Abstract: A semiconductor packaging device includes a wiring board, a working chip, a heat-dissipating metal lid and a silicon thermal conductivity element. The working chip is mounted on the wiring board, and in-built with an working circuit therein. The silicon thermal conductivity element is thermally coupled to the working chip and the heat-dissipating metal lid, and is electrically isolated from the working circuit and the wiring board.