Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.

Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The ventilated blade is disposed on the substrate and has a pore density between 10 ppi and 500 ppi or a volume porosity between 5% and 95%.

Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.

Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.

Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a non-ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The non-ventilated blade has a roughness between 5 ?m and 1.25 mm, or a specific surface area of the non-ventilated blade exceeds a geometric area of the non-ventilated blade by more than 10%.

Abstract: A method and a device for measuring a tangential reaction force of a resistance device on a flywheel, and the reaction force multiply the radius of the flywheel to obtain a torque, such that the torque multiply a gear ratio is the torque to overcome the resistance of flywheel on the drivetrain. The torque to overcome the resistance of flywheel on the drivetrain adding a torque to overcome the inertia of the flywheel and mechanical friction under the state of no resistance is the total torque presented on the drivetrain. Such that using the total torque to calculate power and energy consumption.

Abstract: In an optical imaging lens, a first lens element has negative refracting power, a second lens element has negative refracting power, an optical axis region of the object-side surface of the third lens element is concave, an optical axis region of the object-side surface of the fourth lens element is convex, an optical axis region of the object-side surface of the fifth lens element is convex, a sixth lens element is arranged to be a lens element in a second order from an image-side to an object-side and a seventh lens element is arranged to be a lens element in a first order from the image-side to the object-side to satisfy: (G23+T3+T4+G45)/L57?2.700 and 1+2?80.000.

Abstract: In an optical imaging lens, a first lens element has negative refracting power, a second lens element has negative refracting power, an optical axis region of the object-side surface of the third lens element is concave, an optical axis region of the object-side surface of the fourth lens element is convex, an optical axis region of the object-side surface of the fifth lens element is convex, a sixth lens element is arranged to be a lens element in a second order from an image-side to an object-side and a seventh lens element is arranged to be a lens element in a first order from the image-side to the object-side to satisfy: (G23+T3+T4+G45)/L57?2.700 and 1+2?80.000.

Abstract: An optical imaging lens includes a first lens element, a second lens, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element from an object side to an image side in order along an optical axis, and each lens element has an object-side surface and an image-side surface. The first lens element has negative refracting power, an optical axis region of the object-side surface of the second lens element is concave, and a periphery region of the image-side surface of the fifth lens element is concave. The lens elements included by the optical imaging lens are only the seven lens elements described above. The optical imaging lens satisfies the following conditions: EFL/ImgH?1.100, wherein EFL is an effective focal length of the optical imaging lens, ImgH is the image height of the optical imaging lens.

Abstract: A circular knitted head cover, used to cover the user's bead, has a long cylindrical cap, integrally circular knitted, flexible, and in the shape of a hollow cylinder. The relative two ends of the long cylindrical cap are respectively formed with an upper cap opening and a lower cap opening. At least one eye through-hole is provided, being an opening integrally knitted on one side of the long cylindrical cap. The eye through-hole enables exposure of the user's eyes when wearing the head cover. An interlaced mouth and nose vent is provided in the shape of interval holes, integrally knitted on one side of the long cylindrical cap and located on a position spaced from the eye through-hole. The interlaced mouth and nose vent enables ventilation of the user's mouth and nose when wearing the head cover.

Abstract: When a web page is visited in a browser, the method automatically loads a tool bar so that a user could specify the visited web page to be tracked or one or more regions of the visited web page to be tracked (or excluded). Then, at the specified periods or instants, the method automatically checks to see if the web pages or regions of web pages are updated. If updates are detected, colored and audible notification is provided. A user then can select an updated web page to view and locates the spot(s) where update takes place. The notification of update of a specific web page or region could be provided by the method as a RSS or web service for other third-party applications.

Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

Abstract: A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate.

Abstract: A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained.

Abstract: A structure of stacked integrated circuits arranged on a circuit board includes a substrate, a lower integrated circuit, a plurality of wirings, a passivation layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals for electrically connecting to the circuit board. The lower integrated circuit has a first surface and a second surface. The first surface of the lower integrated circuit is adhered onto the first surface of the substrate. The second surface of the lower integrated circuit is formed with a plurality of bonding pads. The wirings each includes a first end and a second end opposite to the first end. The first ends of the wirings are electrically connected to the bonding pads of the lower integrated circuit, and the second ends of the wirings are electrically connected to the signal input terminals of the substrate, respectively.

Abstract: A structure of stacked integrated circuits for mounting on a circuit board includes a substrate, a lower integrated circuit, a plurality of wirings, a plurality of metallic balls, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals and a second surface formed with signal output terminals for electrically connecting to the circuit board. The lower integrated circuit has a first surface adhered to the first surface of the substrate and a second surface formed with a plurality of bonding pads. Each of the wirings has a first end and a second end away from the first end. The first ends are electrically connected to the bonding pads of the lower integrated circuit. The second ends are electrically connected to the signal input terminals on the first surface of the substrate. The plurality of metallic balls are formed on the second surface of the lower integrated circuit.

Abstract: A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of signal input terminals. The second surface is formed with a plurality of signal output terminals for electrically connecting to the circuit board. The integrated circuit has a lower surface and an upper surface. Recesses are formed at two sides of the lower surface, and a plurality of bonding pads are formed on the upper surface. The adhesive layer is used for adhering the lower surface of the integrated circuit to the first surface of the substrate. The wirings are electrically connecting to the bonding pads of the integrated circuit and to the signal input terminals of the substrate. The glue layer is used for sealing the plurality of wirings and the integrated circuits.

Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate.

Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a substrate, an integrated circuit, an image sensing chip, and a transparent layer. The substrate has a first surface and a second surface opposite to the first surface. The first surface is formed with signal input terminals. The second surface is formed with signal output terminals for electrically connecting the substrate to the printed circuit board. The integrated circuit is mounted on the first surface of the substrate and electrically connected to the signal input terminals of the substrate. The image sensing chip is located above the integrated circuit to form a stacked structure with the integrated circuit for electrically connecting to the signal input terminals of the substrate. The transparent layer covers the image sensing chip.

Abstract: A stacked structure of integrated circuits for electrically connecting to a circuit board includes a substrate, a lower integrated circuit, a plurality of wirings, and an upper integrated circuit. The lower integrated circuit has a lower surface and an upper surface. The lower surface is adhered onto the first surface of the substrate. A plurality of bonding pads are formed on the upper surface. The wirings each has a first end and a second end. The first ends of the wirings are electrically connected to the bonding pads of the lower integrated circuit. The second ends of the wirings are electrically connected to the signal input terminals of the substrate. The upper integrated circuit has a lower surface and an upper surface. Two recesses are formed at two sides of the lower surface. The upper integrated circuit is adhered to the upper surface of the lower integrated circuit so as to stack above the lower integrated circuit.