Abstract: A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.

Abstract: An embodiment of an integrated circuit chip includes a combination processing core and magnetoresistive random access memory (MRAM) circuitry integrated into the chip. The MRAM circuitry includes a plurality of MRAM cells. The MRAM cells are organized into a number of memories, including a cache memory, a main or working memory and an optional secondary storage memory. The cache memory includes multiple cache levels.

Abstract: A device includes a first power rail for a first power domain and a second power rail for a second power domain. A first circuit block is connected to the first power rail and a second circuit block is connected to the second power rail. The first and second circuit blocks are both connected to a virtual VSS terminal. A footer circuit is connected between the virtual VSS terminal and a ground terminal, and the footer circuit is configured to selectively control a connection between the virtual VSS terminal and the ground terminal.

Abstract: A semiconductor device includes a substrate having a first device and a second device, where at least one of the first device and the second device includes a photo-sensitive element. The semiconductor device includes a first isolation feature surrounding the first device, where the first isolation feature has a first depth. The semiconductor device includes a second isolation feature surrounding the second device, where the second isolation feature has a second depth and where the first depth is greater than the second depth.

Abstract: Provided is a semiconductor device includes a gate electrode, a gate dielectric layer, a channel layer, an insulating layer, a first source/drain electrode and a second source/drain electrode, a second dielectric layer, and a stop segment. The gate electrode is located within a first dielectric layer that overlies a substrate. The gate dielectric layer is located over the gate electrode. The channel layer is located on the gate dielectric layer. The insulating layer is located over the channel layer. The first source/drain electrode and the second source/drain electrode are located in the insulating layer, and connected to the channel layer. The second dielectric layer is beside one of the first source/drain electrode and the second source/drain electrode. The stop segment is embedded in the second dielectric layer.

Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.

Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.

Abstract: A method for forming a semiconductor device includes providing a semiconductor substrate, implanting n-type impurities into a device region in the semiconductor substrate to form an implanted region and an un-implanted region. The method also includes forming an epitaxial layer on the semiconductor substrate and forming a trench surrounding the device region in direct contact with the implanted region. The method further includes performing a selective lateral etch through the trench to remove the implanted region to form a cavity under the epitaxial layer. The un-implanted region is retained to form a pillar under the epitaxial layer. Next, an insulating material is disposed in the cavity and the trench. The method forms a single crystalline region that is separated from the semiconductor substrate by the insulating material except at the pillar.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: The present invention provides a covalent conjugate. The conjugate includes an antibody or antibody derivative, at least two LL37-derived polypeptides, and a payload. The antibody or antibody derivative targets a cell that has phosphatidylserine in its outer leaflet. The payload includes: a small molecule cytotoxic drug of less than 3 kDa, or a plurality thereof; or a peptide or protein of less than 100 kDa. Uses and methods of using these covalent conjugates are also provided, related to enhancing delivery of the antibody/derivative or the payload, e.g. to enhance therapeutic or diagnostic effectiveness.

Abstract: A model generating apparatus and method are provided. The apparatus receives a plurality of sample images. The apparatus generates a plurality of adversarial samples corresponding to the sample images. The apparatus inputs the sample images and the adversarial samples respectively to a first encoder and a second encoder in a self-supervised neural network to generate a plurality of first feature extractions and a plurality of second feature extractions. The apparatus calculates a similarity of each of the first feature extractions and the second feature extractions to train the self-supervised neural network. The apparatus generates a task model based on the first encoder and a plurality of labeled data.

Abstract: A head mounted display device, including a main body, a headband component, two earphone components, and two driving modules, is provided. The headband component includes two opposite headband connectors. The two headband connectors are respectively rotatably arranged on two opposite sides of the main body along a first axis. The two earphone components respectively include two earphone connectors. The two earphone connectors are respectively rotatably arranged on the two sides of the main body along two parallel second axes, and the two earphone connectors are located beside the two headband connectors of the headband component. The two driving modules are respectively arranged between the two headband connectors and the two earphone connectors, and the two earphone connectors are linked to the two headband connectors.

Abstract: The present invention relates to a fingerprint enrollment method and an electronic device for performing the fingerprint enrollment method. A fingerprint sensor of the electronic device senses the fingerprint to generate the fingerprint images. The processor of the electronic device determines if M qualified fingerprint images are acquired or the number of times the finger touches the fingerprint sensor reaches N. When any of the above conditions is satisfied, the operation of sensing fingerprint is stopped. After that, the processor uses the fingerprint images to generate fingerprint enrollment information to complete the fingerprint enrollment process. Based on the disclosure of the present invention, the user can complete the fingerprint enrollment process regardless of whether the user uses spiral enrollment or pressing enrollment.

Abstract: A system for product popularity analysis and management, applied to a store with products, includes a monitor device capturing an image or a video of the store interior; a product positioning device obtaining location data indicating locations of the corresponding visual symbols by analyzing the image, and retrieving information data of the products by scanning the visual symbols in the image; a hot-zone analyzing device detecting and recording traffic flows of customers in the store according to the video, generating plural hot-zone data associated with activities of the customers at locations in the store by analyzing the traffic flows of the customers; and a processing device defining cover regions based on the locations of the corresponding visual symbols, integrating the hot-zone data falling into a common cover region, and pairing the integrated hot-zone data with the information data of the corresponding visual symbol associated with the common cover region.

Abstract: A mounting unit includes: a bottom portion having first and second surfaces; a cylinder portion centrally disposed at the bottom portion, protruding from the first or second surface, and having a first screw hole; two abutting walls disposed at edges of the bottom portion edge and extending toward the first surface; two lugs disposed at edges of the bottom portion and extending toward the second surface to connect to different sides thereof, respectively. The lugs each have a second screw hole. An assembly frame using the mounting unit includes: a frame having a T-shaped slot insertable by the lugs; at least a second screwing element and second screw holes of the lugs couple together the mounting unit and the frame; and a screw coupled to the first screw hole of the cylinder portion of the mounting unit. A method of manufacturing a mounting unit is further provided.

Abstract: An adjusting mechanism and a head mounted display are provided. The adjusting mechanism includes a band, a rotating shaft, a knob, a driving member, and a holder. The rotating shaft has a first ring tooth around a central axis. The band is driven by the rotating shaft to move relative to the rotating shaft when the rotating shaft rotates around the central axis. The knob has a plurality of chutes. Each chute has a first section and a second section. The depth of each first section is deeper than the depth of each second section. The driving member has a second ring tooth, a plurality of guiding pins, and a plurality of pawls. The driving member is assembled to the knob, and the guiding pins are located in the chutes. The holder has a circular unidirectional tooth. The band limits the rotation of the holder relative to the band. The circular unidirectional tooth is configured to be coupled with these pawls to limit the rotation of the driving member relative to the holder in a single direction.

Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.

Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.

Abstract: A supporting foot assembly includes a base having a spherical convex, a disk connected to the spherical convex, a through hole, and an internal space; a swingably fitting member having a spherical concave swingably and fittingly contacting the spherical convex of the base, a lower edge located at a lower periphery of the spherical concave, an aperture, and an upper outer edge; a prop component having a bolt passing through the through hole and the aperture, a retaining portion integrated to or combined with the bolt and located in the internal space of the base so as to prevent the bolt from completely departing from the through hole of the base; and a nut screwed to the bolt of the prop component to abut against the upper outer edge of the swingably fitting member. Alternatively, the nut is integratedly formed on the swingably fitting member.