Patents by Inventor Yen-Chih Chen

Yen-Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250148595
    Abstract: A medical image analysis system comprises: a database for storing a first medical image data indicating a target medical image; and a server for accessing the database. The server includes: a first analysis module for generating a first determination data according to the first medical image data; a second analysis module for generating a second determination data according to the first medical image data; and an ensemble module communicatively connected with the first and second analysis modules and generating a third determination data according to the first and second determination data. The first and second determination data each indicate whether the target medical image includes a cancerous tissue image or indicate a chance of the target medical image including a cancerous tissue image. The third determination data indicates whether the target medical image includes a cancerous tissue image.
    Type: Application
    Filed: October 30, 2024
    Publication date: May 8, 2025
    Inventors: Wei-Chung Wang, Wei-Chih Liao, Po-Ting Chen, Da-Wei Chang, Yen-Jia Chen, Yan-Chen Yeh, Po-Chuan Wang
  • Publication number: 20250147245
    Abstract: A package assembly and a manufacturing method thereof are provided. The package assembly includes a photonic integrated circuit component, an electric integrated circuit component, a lens and an optical signal port. The photonic integrated circuit component comprises an optical input/output portion configured to transmit and receive optical signal. The electric integrated circuit component is electrically connected to the photonic integrated circuit component. The lens is disposed on a sidewall of the photonic integrated circuit component. The optical signal port is optically coupled to the optical input/output portion.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 8, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Chih Lin, Hsuan-Ting Kuo, Cheng-Yu Kuo, Yen-Hung Chen, Chia-Shen Cheng, Chao-Wei Li, Ching-Hua Hsieh, Wen-Chih Chiou
  • Publication number: 20250133927
    Abstract: An electronic device includes a flexible substrate and a conductive wire structure. The conductive wire structure is disposed on the flexible substrate and includes a first segment, a second segment, a third segment, a fourth segment, a first joint portion, a second joint portion, a third joint portion and a fourth joint portion. A first opening is surrounded by the first segment, the second segment, the first joint portion and the second joint portion. A second opening is surrounded by the third segment, the fourth segment, the third joint portion and the fourth joint portion. Along a first direction, a ratio of a first width sum of widths of the first segment, the second segment, the third segment and the fourth segment to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.
    Type: Application
    Filed: January 2, 2025
    Publication date: April 24, 2025
    Applicant: InnoLux Corporation
    Inventors: Ya-Wen Lin, Chien-Chih Chen, Yen-Hsi Tu, Cheng-Wei Chang, Shu-Hui Yang
  • Publication number: 20250125159
    Abstract: A semiconductor device having dismantlable structure is provided. The method includes forming a packaged semiconductor die by mounting the semiconductor die onto a package substrate in a flip chip orientation, attaching an interposer substrate over a backside of the semiconductor die, and encapsulating with an encapsulant the semiconductor die and remaining gap region between the package substrate and the interposer substrate. A bond pad of the semiconductor die is interconnected with a conductive trace of the package substrate. The interposer substrate includes a plurality of conductive pads exposed at a top surface and interconnected with the package substrate. A dismantlable structure is attached on the top surface of the interposer substrate. A first region of the dismantlable structure covers the plurality of conductive pads.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 17, 2025
    Inventors: Yu Ling Tsai, Yao Jung Chang, Yen-Chih Lin, Tzu Ya Fang, Jian Nian Chen, Yi-Hsuan Tsai
  • Patent number: 12274794
    Abstract: The present disclosure provides dosage forms designed to deliver active pharmaceutical ingredients (APIs) in a controlled release manner. For instance, the present disclosure includes dosage forms with adequate time of onset of action and reduced lag times in the fed state. Such dosage forms find use in a variety of conditions where a rapid onset of action is desired followed by an extended release phase for the active agent, for example in the treatment of ADHD, pain or anxiety. In some cases, the dosage form includes a drug composition including a pharmacologically active agent, a barrier layer covering at least a portion of the drug composition, and a drug layer covering at least a portion of the barrier layer, wherein the drug layer includes the pharmacologically active agent. Related methods of making and administering the disclosed dosage forms are also provided.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: April 15, 2025
    Assignee: Orient Pharma Co., Ltd.
    Inventors: Su Il Yum, Wendy Chao, Huey-Ching Su, Yen-Fei Chen, Chin-Chih Chiang
  • Patent number: 12267029
    Abstract: A method of obtaining a parameter of a synchronous motor is disclosed and includes: setting an operating current of the motor; providing a positive fixed voltage to the motor and monitoring a feedback current from the motor; recording a triggering time for the feedback current to reach the operating current; providing a negative fixed voltage to the motor for the triggering time; obtaining a square-wave voltage with a fixed frequency based on the positive fixed voltage and the negative fixed voltage being provided; providing the square-wave voltage with the fixed frequency to one axis of the motor; transforming three-phase current from the motor into an axial current; computing an inductance value of this axis based on the fixed frequency, the square-wave voltage and the axial current; and, creating an inductance-current parameter table based on a plurality of the inductance values and the axial currents correspondingly.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: April 1, 2025
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yen-Yang Chen, Jen-Chih Tseng, Lei-Chung Hsing
  • Publication number: 20250093593
    Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.
    Type: Application
    Filed: January 3, 2024
    Publication date: March 20, 2025
    Inventors: Wen-Chih Lin, Cheng-Yu Kuo, Yen-Hung Chen, Hsuan-Ting Kuo, Chia-Shen Cheng, Chao-Wei Li, Ching-Hua Hsieh, Wen-Chih Chiou, Ming-Fa Chen, Shang-Yun Hou
  • Publication number: 20250092508
    Abstract: A physical vapor deposition (PVD) target for performing a PVD process is provided. The PVD target includes a backing plate and a target plate coupled to the backing plate. The target plate includes a sputtering source material and a dopant, with the proviso that the dopant is not impurities in the sputtering source material. The sputtering source material includes a diffusion barrier material.
    Type: Application
    Filed: November 27, 2024
    Publication date: March 20, 2025
    Inventors: Chia-Hsi WANG, Yen-Yu CHEN, Yi-Chih CHEN, Shih-Wei BIH
  • Publication number: 20250087536
    Abstract: A deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. The deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. To adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. As a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN, Yi-Ming DAI
  • Publication number: 20250069989
    Abstract: A semiconductor device includes a FEOL structure and a BEOL structure. The BEOL structure is formed over the FEOL structure and includes a conductive layer, an etching stop layer (ESL) structure, a through via and a barrier layer. The ESL structure is formed over the conductive layer and has a first recess and a lateral surface. The through via passes through the ESL structure to form the first recess and the lateral surface. The barrier layer covers the lateral surface and the first recess. The first recess is recessed with respect to the lateral surface, and the first recess has a first depth ranging between 1 nm and 7 nm.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Chih HUANG, Li-An SUN, Chih-Hao CHEN, Chung-Chuan HUANG
  • Patent number: 12237230
    Abstract: A method of manufacturing a semiconductor device includes forming a fin structure over a substrate, forming a sacrificial gate structure over the fin structure, and etching a source/drain (S/D) region of the fin structure to form an S/D recess. The fin structure includes first semiconductor layers and second semiconductor layers alternately stacked. The method further includes depositing an insulating dielectric layer in the S/D recess, depositing an etch protection layer over a bottom portion of the insulating dielectric layer, and partially removing the insulating dielectric layer. The method further includes growing an epitaxial S/D feature in the S/D recess. The bottom portion of the insulating dielectric layer interposes the epitaxial S/D feature and the substrate.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Bo-Yu Lai, Jyun-Chih Lin, Yen-Ting Chen, Wei-Yang Lee, Chia-Pin Lin, Wei Hao Lu, Li-Li Su
  • Patent number: 12233368
    Abstract: A device for removing particles in a gas stream includes a first cylindrical portion configured to receive the gas stream containing a target gas and the particles, a rotatable device disposed within the first cylindrical portion and configured to generate a centrifugal force when in a rotational action to divert the particles away from the rotatable device, a second cylindrical portion coupled to the first cylindrical portion and configured to receive the target gas, and a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion, the third cylindrical portion being configured to receive the diverted particles.
    Type: Grant
    Filed: August 13, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
  • Publication number: 20250061838
    Abstract: An electronic device is provided. The electronic device includes a display panel and a controller coupled to the display panel. The display panel is configured to update displayed images at a refresh rate. The controller is configured to receive a target frame rate from a first application. The controller is further configured to determine a frame rate according to the refresh rate and the target frame rate. The frame rate is a factor of the refresh rate. The controller is further configured to control the first application to draw images at the frame rate.
    Type: Application
    Filed: August 15, 2024
    Publication date: February 20, 2025
    Inventors: Yi-Hsin SHEN, Cheng-Che CHEN, Yen-Po CHIEN, Chung-Hao HO, Jen-Chih CHANG, Chiu-Jen LIN
  • Publication number: 20250057973
    Abstract: A drug carrier with a property of crossing the blood-brain barrier comprises an extracellular vesicle with a human leukocyte antigen-G antibody on its surface. This carrier can serve as a pharmaceutical composition for promoting apoptosis of brain tumor cells, inhibiting growth of brain tumor cells, or reducing expression of O6-methylguanine-DNA methyltransferase (MGMT) in brain tumor cells. These effects contribute to the treatment of glioblastoma multiforme (GBM).
    Type: Application
    Filed: August 13, 2024
    Publication date: February 20, 2025
    Inventors: Der-Yang Cho, Shao-Chih Chiu, Yi-Wen Chen, Ming-You Shie, Chih-Ming Pan, Shi-Wei Huang, Yen Chen, Cheng-Yu Chen, Kai-Wen Kan
  • Patent number: 12219843
    Abstract: An electronic device includes a conductive wire having a metal portion with openings. The openings include a first opening and a second opening arranged along a first direction, and the metal portion includes the first to fourth extending portions and the first to fourth joint portions. The first opening is surrounded by the first extending portion, the second extending portion, the first joint portion, and the second joint portion. The second opening is surrounded by the third extending portion, the fourth extending portion, the third joint portion, and the fourth joint portion. Along the first direction, a ratio of a first width sum of widths of the first extending portion, the second extending portion, the third extending portion, and the fourth extending portion to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.
    Type: Grant
    Filed: March 18, 2024
    Date of Patent: February 4, 2025
    Assignee: InnoLux Corporation
    Inventors: Ya-Wen Lin, Chien-Chih Chen, Yen-Hsi Tu, Cheng-Wei Chang, Shu-Hui Yang
  • Publication number: 20250034042
    Abstract: The present invention relates to a basalt fiber reinforced concrete, which includes: a cement slurry with a water-to-cement ratio between 0.3 and 0.5, and a slurry volume percentage between 15-25%; an aggregate with an aggregate volume percentage between 65% and 75%; a basalt fiber reinforcement with a fiber volume percentage between 0.2% and 1.00%; and a concrete admixture used to adjust the properties of the basalt fiber reinforced concrete.
    Type: Application
    Filed: October 6, 2023
    Publication date: January 30, 2025
    Inventors: Jieh-Haur CHEN, Yu-Min SU, Min-Chih LIAO, Yen-Yu LIN, Cheng-Ching PENG
  • Publication number: 20250034043
    Abstract: The present invention relates to a basalt fiber reinforced asphalt concrete, which includes: an asphalt material with a penetration grade between 40-300 at room temperature, selected from one of an asphalt mortar, an oil-soluble asphalt, an emulsified asphalt, and a modified asphalt; an aggregate having a first volume percentage between 50-80%; a basalt fiber reinforcement with a second volume percentage between 0.1-0.9%; and a chemical admixture for asphalt concrete used to adjust the properties of the basalt fiber reinforced asphalt concrete.
    Type: Application
    Filed: October 6, 2023
    Publication date: January 30, 2025
    Inventors: Jieh-Haur CHEN, Yu-Min SU, Min-Chih LIAO, Yen-Yu LIN, Cheng-Ching PENG
  • Patent number: 12196496
    Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.
    Type: Grant
    Filed: September 25, 2022
    Date of Patent: January 14, 2025
    Assignee: AIC INC.
    Inventors: Yen-Chih Chen, Chi-Fu Chen, Wei-Ta Chen, Hung-Hui Chang
  • Patent number: 12005427
    Abstract: A catalyst for methanation reaction and a method for preparing methane are provided. The catalyst for methanation reaction includes a core, a shell encapsulating the core, and an active metal. The core includes cerium dioxide (CeO2), the shell includes zirconium dioxide (ZrO2), and the active metal is in particle form and is disposed on an outer surface of the shell layer.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: June 11, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chih Chen, Man-Yin Lo, Hsi-Yen Hsu, Ying-Chieh Lee, Yuan-Peng Du
  • Publication number: 20240178867
    Abstract: A multiple transceiver cooling system includes a networking device, a plurality of transceiver device chassis that are included in the networking device, that are positioned adjacent each other, and that are each configured to receive a respective transceiver device, and a multiple transceiver heat dissipation device that engages each of the plurality of transceiver device chassis. With the multiple transceiver heat dissipation device engaging each of the plurality of transceiver device chassis, the multiple transceiver heat dissipation device may receive heat generated by respective transceiver devices located in the plurality of transceiver device chassis, transfer the heat to a heat dissipation element, and dissipate the heat using the heat dissipation element.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 30, 2024
    Inventors: Yen-Chih Chen, Shih-Huai Cho