Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

Abstract: A photosensitive resin composition which is non-reactive and thus storable at a normal temperatures includes 100 parts (by weight) of an epoxy acrylate, 10-50 parts acrylate monomers, 1-40 parts acrylate oligomers, 5-15 parts of a photoinitiator, 1-5 parts of a coloring agent, and 10-50 parts of a blocked polyisocyanate. A method of making and a printed circuit board made accordingly are also disclosed.

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

Abstract: A resin composition suitable as an adhesive layer and as a circuit board substrate includes an acrylic resin, a non-photosensitive resin with carboxyl groups, nano core-shell particles, a photoinitiator, and a solvent, such adhesive layer and circuit board substrate being high-strength and temperature-resistant whilst retaining flexibility. The acrylic resin is in an amount by weight of 150 parts in the resin composition, the non-photosensitive resin is in an amount by weight of 30 parts to 80 parts in the resin composition, the nano core-shell particles are in an amount by weight of 5 parts to 30 parts in the resin composition, and the photoinitiator is in an amount by weight of 1 part to 10 parts in the resin composition.