Patents by Inventor Yen-Chin Huang

Yen-Chin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959318
    Abstract: An oven includes an oven body, a heating element, a frame, and an oven door. The oven body has an inner space inside and includes a front plate, wherein the front plate has an entrance that communicates with the inner space. The heating element is adapted to heat the inner space. The frame is engaged with the oven body and has an abutted portion. The oven door is pivotally connected to the oven body and is located at the entrance. The oven door can pivot to a closed position to close the entrance and can pivot downward to an open position from the closed position to open the entrance. When the oven door is located at the open position, the second surface abuts against the abutted portion of the frame, thereby forming a platform outside the entrance for placing objects.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: April 16, 2024
    Assignee: GRAND MATE CO., LTD.
    Inventors: Chung-Chin Huang, Chin-Ying Huang, Hsin-Ming Huang, Hsing-Hsiung Huang, Yen-Jen Yeh
  • Publication number: 20220293520
    Abstract: A method includes forming a first etch stop layer (ESL) over a conductive feature, forming a first dielectric layer on the first ESL, forming a second ESL on the first dielectric layer, forming a second dielectric layer on the second ESL, forming a trench in the second dielectric layer, forming a first opening in a bottom surface of the trench extending through the second dielectric layer, and forming a second opening in a bottom surface of the first opening. The second opening extends through the first dielectric layer and the first ESL. The second opening exposes a top surface of the conductive feature. The method further includes widening the first opening to a second width, filling the trench with a conductive material to form a conductive line, and filling the second opening and the first opening with the conductive material to form a conductive via.
    Type: Application
    Filed: May 12, 2021
    Publication date: September 15, 2022
    Inventors: Yen-Chin Huang, Li-An Sun, Che-En Tsai, Yu-Lin Chiang, Chung Chuan Huang, Chih-Hao Chen
  • Patent number: D302168
    Type: Grant
    Filed: June 18, 1987
    Date of Patent: July 11, 1989
    Assignee: Tong Nan Optical Enterprise Co., Ltd.
    Inventor: Yen-Chin Huang