Patents by Inventor Yen-Chin Lin

Yen-Chin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME
    Publication number: 20240145379
    Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.
    Type: Application
    Filed: February 23, 2023
    Publication date: May 2, 2024
    Inventors: Yen-Kun Lai, Wei-Hsiang Tu, Ching-Ho Cheng, Cheng-Nan Lin, Chiang-Jui Chu, Chien Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii
  • ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIPATION FEATURE
    Publication number: 20240087980
    Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.
    Type: Application
    Filed: February 17, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai-Fang CHENG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Yen-Ju WU, Yen-Pin HSU, Li-Ling SU, Ming-Hsien LIN, Hsiao-Kang CHANG
  • Data cache architecture and cache algorithm used therein
    Patent number: 7814276
    Abstract: The present invention provides a data cache architecture interposed between a host and a flash memory, the data cache architecture comprising: a buffer memory, receiving data from the host; a memory controller, deploying the data in the buffer memory; and a data cache memory, controlled by the memory controller according to a cache algorithm. The data cache architecture and the cache algorithm used in the data cache architecture can be used to minimize the program/erase count of the NAND type flash device.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: October 12, 2010
    Assignee: Solid State System Co., Ltd.
    Inventors: Yen-Chin Lin, Hsin-Chung Wang, Chun-Hung Lin
  • Data Cache Architecture and Cache Algorithm Used Therein
    Publication number: 20090132770
    Abstract: The present invention provides a data cache architecture interposed between a host and a flash memory, the data cache architecture comprising: a buffer memory, receiving data from the host; a memory controller, deploying the data in the buffer memory; and a data cache memory, controlled by the memory controller according to a cache algorithm. The data cache architecture and the cache algorithm used in the data cache architecture can be used to minimize the program/erase count of the NAND type flash device.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 21, 2009
    Applicant: Solid State System Co., Ltd
    Inventor: Yen-Chin Lin