Patents by Inventor Yen-Chin Yang

Yen-Chin Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932714
    Abstract: A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III) wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 19, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Yi Chu, Yun-Ching Lee, Li-Chun Liang, Wei-Ta Yang, Hsiang-Chin Juan
  • Publication number: 20070046520
    Abstract: An electronic circuit structure uses an analog-to-digital conversion concept for saving circuit pins and installs a control circuit on a main board, and the control circuit includes a processor, an analog-to-digital converter circuit, a power supply circuit and an ID generator circuit; wherein the power supply circuit is connected separately to the processor, the analog-to-digital converter circuit, and the ID generator circuit for providing a stable operating power supply; the analog-to-digital converter circuit is connected to the ID generator circuit for receiving a voltage divide power produced by the ID generator circuit and converting the voltage divide power into a digital machine ID; and the analog-to-digital converter circuit is connected to the processor for sending the machine ID. After the processor obtains the machine ID, the processor can analyze and determine the hardware configuration represented by the voltage divide power for the main board to carry out the booting operation.
    Type: Application
    Filed: August 29, 2005
    Publication date: March 1, 2007
    Applicant: INVENTEC CORPORATION
    Inventors: Spring Liu, Roger Tsai, Hao-Tai Hsieh, Sheng-Tang Chang, Wei-Kuang Chen, Yen-Chin Yang