Patents by Inventor Yen Chiu Kuo
Yen Chiu Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240021431Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.Type: ApplicationFiled: July 28, 2023Publication date: January 18, 2024Inventors: Wan Hsuan Hsu, Jao Sheng Huang, Yen-Chiu Kuo, Yu-Li Cheng, Ya Tzu Chen, Neng-Jye Yang, Chun-Li Chou
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Patent number: 11776818Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.Type: GrantFiled: April 19, 2021Date of Patent: October 3, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wan Hsuan Hsu, Jao Sheng Huang, Yen-Chiu Kuo, Yu-Li Cheng, Ya Tzu Chen, Neng-Jye Yang, Chun-Li Chou
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Publication number: 20210257218Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.Type: ApplicationFiled: April 19, 2021Publication date: August 19, 2021Inventors: Wan Hsuan Hsu, Jao Sheng Huang, Yen-Chiu Kuo, Yu-Li Cheng, Ya Tzu Chen, Neng-Jye Yang, Chun-Li Chou
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Publication number: 20210118689Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.Type: ApplicationFiled: October 18, 2019Publication date: April 22, 2021Inventors: Wan Hsuan Hsu, Jao Sheng Huang, Yen-Chiu Kuo, Yu-Li Cheng, Ya Tzu Chen, Neng-Jye Yang, Chun-Li Chou
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Patent number: 10985028Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.Type: GrantFiled: October 18, 2019Date of Patent: April 20, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wan Hsuan Hsu, Jao Sheng Huang, Yen-Chiu Kuo, Yu-Li Cheng, Ya Tzu Chen, Neng-Jye Yang, Chun-Li Chou
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Patent number: 10755972Abstract: A semiconductor device and method of manufacture comprise placing an etch stop layer of a material such as aluminum oxide over a conductive element, placing a dielectric layer over the etch stop layer, and placing a hardmask of a material such as titanium nitride over the dielectric layer. Openings are formed to the etch stop layer, the hardmask material is selectively removed, and the openings are then the material of the etch stop layer is then selectively removed to extend the openings through the etch stop layer.Type: GrantFiled: March 20, 2017Date of Patent: August 25, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Nai-Chia Chen, Chun-Li Chou, Yen-Chiu Kuo, Yu-Li Cheng, Chun-Hung Chao
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Patent number: 10354913Abstract: A method of forming a semiconductor device includes forming a conductive feature in a first dielectric layer, forming one or more dielectric layers over the first dielectric layer, and forming a via opening in the one or more dielectric layers, a bottom of the via opening exposing the conductive feature. The method further includes cleaning the via opening using a chemical mixture, and rinsing the via opening using basic-ion doped water after cleaning the via opening.Type: GrantFiled: November 1, 2017Date of Patent: July 16, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Nai-Chia Chen, Chun-Li Chou, Yen-Chiu Kuo, Chun-Hung Chao, Yu-Li Cheng
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Publication number: 20180350664Abstract: A method of forming a semiconductor device includes forming a conductive feature in a first dielectric layer, forming one or more dielectric layers over the first dielectric layer, and forming a via opening in the one or more dielectric layers, a bottom of the via opening exposing the conductive feature. The method further includes cleaning the via opening using a chemical mixture, and rinsing the via opening using basic-ion doped water after cleaning the via opening.Type: ApplicationFiled: November 1, 2017Publication date: December 6, 2018Inventors: Nai-Chia Chen, Chun-Li Chou, Yen-Chiu Kuo, Chun-Hung Chao, Yu-Li Cheng
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Publication number: 20180151421Abstract: A semiconductor device and method of manufacture comprise placing an etch stop layer of a material such as aluminum oxide over a conductive element, placing a dielectric layer over the etch stop layer, and placing a hardmask of a material such as titanium nitride over the dielectric layer. Openings are formed to the etch stop layer, the hardmask material is selectively removed, and the openings are then the material of the etch stop layer is then selectively removed to extend the openings through the etch stop layer.Type: ApplicationFiled: March 20, 2017Publication date: May 31, 2018Inventors: Nai-Chia Chen, Chun-Li Chou, Yen-Chiu Kuo, Yu-Li Cheng, Chun-Hung Chao
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Patent number: 8017517Abstract: A method and system for forming dual damascene structures in a semiconductor package. In one embodiment, the method includes forming an intermediate dielectric layer on a bottom stop layer; forming an ashing removable dielectric layer on the intermediate dielectric layer; forming a patterned photoresist layer above the ashing removable dielectric layer in the semiconductor structure; and defining an in-situ hard mask in the ashing removable dielectric layer having an opening with a profile selected from the group consisting of a via, a trench, or a combination thereof. The profile of the in-situ mask preferably is capable of being transferred to the intermediate dielectric layer by etching.Type: GrantFiled: June 7, 2007Date of Patent: September 13, 2011Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventor: Yen Chiu Kuo
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Publication number: 20080305639Abstract: A method and system for forming dual damascene structures in a semiconductor package. In one embodiment, the method includes forming an intermediate dielectric layer on a bottom stop layer; forming an ashing removable dielectric layer on the intermediate dielectric layer; forming a patterned photoresist layer above the ashing removable dielectric layer in the semiconductor structure; and defining an in-situ hard mask in the ashing removable dielectric layer having an opening with a profile selected from the group consisting of a via, a trench, or a combination thereof. The profile of the in-situ mask preferably is capable of being transferred to the intermediate dielectric layer by etching.Type: ApplicationFiled: June 7, 2007Publication date: December 11, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventor: Yen Chiu Kuo