Patents by Inventor Yen Chu
Yen Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12380329Abstract: In some aspects, the present disclosure describes a method of sampling a ligand. In some embodiments, the method comprises receiving a target descriptor. In some embodiments, the method comprises generating, in an engineered chemical space, a latent descriptor, based at least in part on the target descriptor. In some embodiments, the method comprises generating a ligand descriptor, based at least in part on the latent descriptor.Type: GrantFiled: March 1, 2023Date of Patent: August 5, 2025Assignee: INSILICO MEDICINE IP LIMITEDInventors: Ya-Chu Yang, Tzu-Lan Yeh, Yen-Chu Lin
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Publication number: 20250237745Abstract: A coherent LiDAR system including semiconductor optical amplifier that can boost the transmitter power into the Watt level as well as provide a means of pre-amplification of the return beam. This approach offers significant immunity to sunlight interference over a TOF LiDAR system and has the potential to operate over a wider range of atmospheric conditions because of the higher sensitivity of a coherent system's double balanced receiver configuration. The coherent receiver mixes a local oscillator signal with the received signal, the received signal must be an exact match to the transmitted signal's wavelength in order for the receiver to recognize the signal. This greatly reduces interference from sunlight and allows each LiDAR system to have a unique signature minimizing cross interference from another vehicle.Type: ApplicationFiled: June 27, 2024Publication date: July 24, 2025Inventors: Sidi Aboujja, Daniel Yen Chu, Ronald Moore
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Publication number: 20250237746Abstract: A time-of-flight LiDAR system that uses multi-junction laser diodes, for higher peak power than a single junction laser diode can provide, will provide in greater range capability for the LiDAR system. An additional approach to extending range is to continue to increase the output power of the transmitter using multi-junction semiconductor optical amplifiers. In addition to increasing the output power of the laser transmitter, it is also possible to increase the sensitivity of the receiver by using a single junction semiconductor optical amplifier. Finally, operating the pulsed system with an injection locked multi-junction transmitter and a coherent receiver greatly increases the sensitivity of the receiver.Type: ApplicationFiled: June 27, 2024Publication date: July 24, 2025Inventors: Sidi Aboujja, Daniel Yen Chu, Ronald Moore
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Publication number: 20250239838Abstract: A silicon based photonic integrated circuit (Si-PIC) uses a semiconductor optical amplifier to overcome losses in the circuit from the input to the output ports.Type: ApplicationFiled: June 27, 2024Publication date: July 24, 2025Inventors: Sidi Aboujja, Daniel Yen Chu, Ronald Moore
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Patent number: 12355001Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a connecting element, a first semiconductor device, a second semiconductor device, a first underfill layer, and a package layer. The interposer substrate is disposed on the carrier substrate. The connecting element is disposed in the interposer substrate. The connecting element includes a dielectric element and first conductive features disposed in the dielectric element. The first semiconductor device and the second semiconductor device are disposed on the interposer substrate. The first semiconductor device is electrically connected to the second semiconductor device through the connecting element. The first underfill layer is disposed between the first semiconductor device, the second semiconductor device, and the interposer substrate. The package layer surrounds the first semiconductor device, the second semiconductor device, and the first underfill layer.Type: GrantFiled: February 11, 2022Date of Patent: July 8, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yen-Chu Tu, Shang-Lun Tsai, Monsen Liu, Shuo-Mao Chen, Shin-Puu Jeng
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Publication number: 20250121472Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided that are particularly suited for polishing substrates utilized in hybrid bonding applications. Methods and articles may include a plurality of first polishing elements, where at least one of the plurality of first polymer layers forms the polishing surface; and one or more second polishing elements, where at least a region of each of the one or more second polishing elements is disposed between at least one of the plurality of first polishing elements and a supporting surface of the polishing pad. One or more first polishing elements have a Shore D hardness of greater than 60, one or more second polishing elements have a Shore D hardness of from about 20 to less than 60, and the polishing article has a total Shore D hardness of greater than or about 50.Type: ApplicationFiled: October 12, 2023Publication date: April 17, 2025Applicant: Applied Materials, Inc.Inventors: Liu Jiang, Prayudi Lianto, Santosh Kumar Rath, Nina Bao, Muhammad Adli Danish, Aniruddh Khanna, Pin Gian Gan, Mohammad Faizal Bin Aermie Ang, Mayu Yamamura, Sivapackia Ganapathiappan, Daniel Redfield, El Mehdi Bazizi, Yen-Chu Yang, Pang Yen Ong, Rajeev Bajaj
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Publication number: 20250108476Abstract: A chemical mechanical polishing system includes a support to hold a polishing pad, a carrier head to hold a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature control system to control a temperature of the polishing process, and a controller coupled to the in-situ monitoring system and the temperature control system. The controller is configured to cause the temperature control system to vary the temperature of the polishing process in response to the signal.Type: ApplicationFiled: December 11, 2024Publication date: April 3, 2025Inventors: Haosheng Wu, Hari Soundararajan, Yen-Chu Yang, Jianshe Tang, Shou-Sung Chang, Shih-Haur Shen, Taketo Sekine
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Patent number: 12236345Abstract: Implementations are directed to receiving a set of tuples, each tuple including an entity and a product from a set of products, for each tuple: generating, by an embedding module, a total latent vector as input to a recommender network, the total latent vector generated based on a structural vector, a textual vector, and a categorical vector, each generated based on a product profile of a respective product and an entity profile of the entity, generating, by a context integration module, a latent context vector based on a context vector representative of a context of the entity, and inputting the total latent vector and the latent context vector to the recommender network, the recommender network being trained by few-shot learning using a multi-task loss function, and generating, by the recommender network, a prediction including a set of recommendations specific to the entity.Type: GrantFiled: June 17, 2021Date of Patent: February 25, 2025Assignee: Accenture Global Solutions LimitedInventors: Lan Guan, Guanglei Xiong, Christopher Yen-Chu Chan, Jayashree Subrahmonia, Aaron James Sander, Sukryool Kang, Wenxian Zhang, Anwitha Paruchuri
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Patent number: 12214468Abstract: A chemical mechanical polishing system includes a support to hold a polishing pad, a carrier head to hold a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature control system to control a temperature of the polishing process, and a controller coupled to the in-situ monitoring system and the temperature control system. The controller is configured to cause the temperature control system to vary the temperature of the polishing process in response to the signal.Type: GrantFiled: November 13, 2018Date of Patent: February 4, 2025Assignee: Applied Materials, Inc.Inventors: Haosheng Wu, Hari Soundararajan, Yen-Chu Yang, Jianshe Tang, Shou-Sung Chang, Shih-Haur Shen, Taketo Sekine
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Publication number: 20250014058Abstract: A hotel demand evaluation method includes setting a plurality of keywords, collecting a plurality of texts according to the plurality of keywords, selecting a plurality of valid texts from the plurality of texts, performing a semantic analysis operation to identify at least one time keyword and at least one location keyword in the plurality of valid texts, generating a classification result according to at least the at least one time keyword and the at least one location keyword, classifying each valid text of the plurality of valid texts into a positive impact group, a no impact group or a negative impact group according to the classification result, and generating a hotel demand score of a specific region according to at least one valid text of the positive impact group and/or at least one valid text of the negative impact group.Type: ApplicationFiled: November 13, 2023Publication date: January 9, 2025Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Publication number: 20240390947Abstract: A method of automatically selecting beans includes dispersing a plurality of beans on at least a first and a second parallel rows on a motion plane; capturing images of a first part of the beans on the first and second rows; capturing images of a second part of the beans on the first and second rows; determining a plurality of appearance features of the beans; removing the beans with the first appearance feature on the first row; collecting the beans without the first appearance on the first row; removing the beans with the first appearance feature on the second row; and collecting the beans without the first appearance on the second row. The timing of removing the beans with the first appearance feature is related to the motion speed of the motion plane and the positions for capturing the images of the first or second part of the beans.Type: ApplicationFiled: November 29, 2023Publication date: November 28, 2024Inventors: Yen Chu Teng, Meng Fang Yu, Chia-Chung Chen
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Patent number: 12151266Abstract: A method of automatically selecting beans includes dispersing a plurality of beans on at least a first and a second parallel rows on a motion plane; capturing images of a first part of the beans on the first and second rows; capturing images of a second part of the beans on the first and second rows; determining a plurality of appearance features of the beans; removing the beans with the first appearance feature on the first row; collecting the beans without the first appearance on the first row; removing the beans with the first appearance feature on the second row; and collecting the beans without the first appearance on the second row. The timing of removing the beans with the first appearance feature is related to the motion speed of the motion plane and the positions for capturing the images of the first or second part of the beans.Type: GrantFiled: November 29, 2023Date of Patent: November 26, 2024Assignee: LIGHTTELLS CORP., LTD.Inventors: Yen Chu Teng, Meng Fang Yu, Chia-Chung Chen
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Publication number: 20240261570Abstract: The present disclosure provides a closed-loop DBS system and method for regulating motor symptoms of a subject. The DBS system comprises: neural electrodes for being implanted in deep brain nuclei of the subject and a closed-loop stimulation generator in communication with the neural electrodes. The stimulation generator includes: a data acquisition unit configured to receive the LFP signals transmitted from the neural electrodes and convert the LFP signals to LFP data; a processing unit in communication configured to analyze the LFP data to determine presence of abnormal beta band oscillation and generate a DBS signal upon determining presence of abnormal beta band oscillation; and a pulse generation unit configured to generate, in response to the DBS signal, the DBS pulses to the deep brain nuclei through the neural electrodes. The provided system and method can save stimulation time and avoid adverse side effects of continuous stimulation while maintaining treatment efficacy.Type: ApplicationFiled: February 2, 2023Publication date: August 8, 2024Inventors: Chi Him Eddie MA, Kumar GAJENDRA, Vivian Yen Yen CHU
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Patent number: 12048948Abstract: Methods of curing a polymer layer on a substrate using variable microwave frequency are provided herein. In some embodiments, methods of curing a polymer layer on a substrate using variable microwave frequency include (a) forming a first thin-film polymer layer on a substrate, the first thin-film polymer layer including at least one first base dielectric material and at least one microwave tunable material, (b) applying a variable frequency microwave energy to the substrate and the first thin-film polymer layer to heat the substrate and the first thin-film polymer layer to a first temperature, and (c) adjusting the variable frequency microwave energy applied to the substrate and the first thin-film polymer layer to tune at least one material property of the first thin-film polymer layer.Type: GrantFiled: May 31, 2019Date of Patent: July 30, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Yueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Nuno Yen-Chu Chen, Guan Huei See, Felix Deng
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Publication number: 20240193629Abstract: A method for predicting operational indicators includes performing a training operation according to first data to train a demand model, inputting second data into the demand model to generate predicted demand data, collecting actual demand data, and performing an adjustment operation according to the predicted demand data and the actual demand data to update the demand model.Type: ApplicationFiled: December 27, 2022Publication date: June 13, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Publication number: 20240193628Abstract: A method for feature extraction and data prediction based on pre-training, includes building a first neural network, inputting first processed data to the first neural network to perform a first training operation to generate a first trained neural network, inputting second processed data to the first trained neural network and fixing a first portion of neurons of the first trained neural network to perform a second training operation to generate a second trained neural network, and inputting third processed data to the second trained neural network to generate a predicted result. A first portion of neurons of the second trained neural network is the same as the first portion of neurons of the first trained neural network.Type: ApplicationFiled: December 27, 2022Publication date: June 13, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Patent number: 11986926Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.Type: GrantFiled: August 26, 2022Date of Patent: May 21, 2024Assignee: Applied Materials, Inc.Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Publication number: 20240144305Abstract: A method for allocating perishable products based on machine learning, includes using a sales estimation model to evaluate estimated sales of a plurality of perishable products in a predetermined period, using a rating model to calculate a predetermined rate of the plurality of perishable products in the predetermined period according to the estimated sales, using an allocation model to adjust an allocation ratio of the plurality of perishable products in a plurality of marketing channels according to the estimated sales and the predetermined rate if a current rate is lower than the predetermined rate, and determining the numbers of perishable products allocated to the plurality of marketing channels according to the allocation ratio.Type: ApplicationFiled: December 27, 2022Publication date: May 2, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Publication number: 20240119473Abstract: A rate adjustment method includes a rate estimation model generating a plurality of estimated rates according to a plurality of training data, a revenue estimation model generating an estimated revenue according to the plurality of estimated rates, updating the rate estimation model according to the estimated revenue to generate an updated rate estimation model, and inputting a plurality of current data into the updated rate estimation model to update the plurality of estimated rates.Type: ApplicationFiled: December 27, 2022Publication date: April 11, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Patent number: 11929260Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: GrantFiled: August 24, 2021Date of Patent: March 12, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Fang Jie Lim, Chin Wei Tan, Jun-Liang Su, Felix Deng, Sai Kumar Kodumuri, Ananthkrishna Jupudi, Nuno Yen-Chu Chen