Patents by Inventor Yen-Chu Li

Yen-Chu Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944659
    Abstract: The invention provides a method for improving sarcopenia of a subject in need thereof by using Phellinus linteus, in which the method includes administering an effective dose of composition to the subject, and the composition includes Phellinus linteus (NITE BP-03321 and BCRC 930210) as an effective substance. By using the aforementioned composition including an extract of a fermented product of the Phellinus linteus and/or its derivative, diameters of myotubes, amounts of muscles and muscle muscular endurance can be maintained, thereby improving sarcopenia.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 2, 2024
    Assignee: GRAPE KING BIO LTD
    Inventors: Chin-Chu Chen, I-Chen Li, Tsung-Ju Li, Ting-Yu Lu, Yen-Po Chen
  • Publication number: 20190081192
    Abstract: The present invention provides a solar-blind detecting device with a wide-bandgap oxide, which comprises an oxide epitaxial sensing layer disposed on a substrate for improving the property as well as substantially increasing the photocurrent in the oxide epitaxial sensing layer under the stimulation of ultraviolet light. Particularly, the sensing performance for the deep ultraviolet region (200˜280 nanometers) is enhanced significantly.
    Type: Application
    Filed: January 24, 2018
    Publication date: March 14, 2019
    Inventors: RAY-HUA HORNG, YEN-CHU LI, CHUN-YI TUNG, SI-HAN TSAI, LI-CHUNG CHENG
  • Publication number: 20190081197
    Abstract: The present invention provides a method for manufacturing a wide-bandgap oxide epitaxial film. An epitaxial film with superior physical properties, such as high saturated drift velocity of electrons, small dielectric constant, high thermal stability, and excellent high-temperature resistance, is formed on a substrate. In addition, because the oxide epitaxial film is grown by metal-organic chemical vapor deposition (MOCVD), the yield is improved significantly and defects in the epitaxy is reduced.
    Type: Application
    Filed: January 24, 2018
    Publication date: March 14, 2019
    Inventors: RAY-HUA HORNG, YEN-CHU LI, CHUN-YI TUNG, SI-HAN TSAI, LI-CHUNG CHENG
  • Patent number: 9548424
    Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. A light extraction layer with a roughened structure is formed on the doped semiconductor layer to improve the light emitting efficiency of LED. Furthermore, the strength of the semiconductor stacked structure can be enhanced by the light extraction layer, to improve the reliability of the LED and the production yields of manufacturing process.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: January 17, 2017
    Assignees: Industrial Technology Research Institute, Tyntek Corporation
    Inventors: Chia-Fen Hsieh, Yao-Jun Tsai, Zhi-Wei Koh, Shih-Yi Wen, Chen-Peng Hsu, Chia-Chun Yu, Yen-Chu Li, Chun-Yi Tung
  • Patent number: 9425359
    Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. An undoped semiconductor layer over the first semiconductor layer may be not removed or not completely removed to increase the strength of the semiconductor stacked structure and improve the reliability of the LED and the production yields of manufacturing process. A roughened structure (or a photonic crystal) can be formed on the undoped semiconductor layer when the semiconductor stacked structure to improve the light emitting efficiency of the LED.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: August 23, 2016
    Assignees: Industrial Technology Research Institute, TYNTEK CORPORATION
    Inventors: Yao-Jun Tsai, Shih-Yi Wen, Chen-Peng Hsu, Hung-Lieh Hu, Chia-Chun Yu, Yen-Chu Li, Chun-Yi Tung
  • Publication number: 20150108526
    Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. An undoped semiconductor layer over the first semiconductor layer may be not removed or not completely removed to increase the strength of the semiconductor stacked structure and improve the reliability of the LED and the production yields of manufacturing process. A roughened structure (or a photonic crystal) can be formed on the undoped semiconductor layer when the semiconductor stacked structure to improve the light emitting efficiency of the LED.
    Type: Application
    Filed: December 30, 2014
    Publication date: April 23, 2015
    Inventors: Yao-Jun Tsai, Shih-Yi Wen, Chen-Peng Hsu, Hung-Lieh Hu, Chia-Chun Yu, Yen-Chu Li, Chun-Yi Tung
  • Publication number: 20150108527
    Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. A light extraction layer with a roughened structure is formed on the doped semiconductor layer to improve the light emitting efficiency of LED. Furthermore, the strength of the semiconductor stacked structure can be enhanced by the light extraction layer, to improve the reliability of the LED and the production yields of manufacturing process.
    Type: Application
    Filed: December 30, 2014
    Publication date: April 23, 2015
    Inventors: Chia-Fen Hsieh, Yao-Jun Tsai, Zhi-Wei Koh, Shih-Yi Wen, Chen-Peng Hsu, Chia-Chun Yu, Yen-Chu Li, Chun-Yi Tung