Patents by Inventor Yen-Chu Yang
Yen-Chu Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240066660Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Inventors: Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang, You Wang, Rajeev Bajaj
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Patent number: 11897079Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.Type: GrantFiled: March 26, 2020Date of Patent: February 13, 2024Assignee: Applied Materials, Inc.Inventors: Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang, You Wang, Rajeev Bajaj
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Patent number: 11806835Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.Type: GrantFiled: March 22, 2021Date of Patent: November 7, 2023Assignee: Applied Materials, Inc.Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Publication number: 20230061392Abstract: Semiconductor devices and methods of manufacturing the same are described. A silicon wafer is provided and a buried etch stop layer is formed on the silicon wafer. The wafer is then subjected to device and front-end processing. After front-end processing, the wafer undergoes hybrid bonding, and then the wafer is thinned. To thin the wafer, the silicon substrate layer, which has a starting first thickness, is ground to a second thickness, the second thickness less than the first thickness. After grinding, the silicon wafer is subjected to chemical mechanical planarization (CMP), followed by etching and CMP buffing, to reduce the thickness of the silicon to a third thickness, the third thickness less than the second thickness.Type: ApplicationFiled: August 29, 2022Publication date: March 2, 2023Applicant: Applied Materials, Inc.Inventors: Suketu Arun Parikh, Ashish Pal, El Mehdi Bazizi, Andrew Yeoh, Nitin K. Ingle, Arvind Sundarrajan, Guan Huei See, Martinus Maria Berkens, Sameer A. Deshpande, Balasubramanian Pranatharthiharan, Yen-Chu Yang
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Publication number: 20230064183Abstract: Semiconductor devices and methods of manufacturing the same are described. The method includes front side processing to form a deep source/drain cavity and filling the cavity with a sacrificial material. The sacrificial material is then removed during processing of the backside to form a backside power rail via that is filled with a metal fill.Type: ApplicationFiled: August 29, 2022Publication date: March 2, 2023Applicant: Applied Materials, Inc.Inventors: Suketu Arun Parikh, Ashish Pal, El Mehdi Bazizi, Andrew Yeoh, Nitin K. Ingle, Arvind Sundarrajan, Guan Huei See, Martinus Maria Berkens, Sameer A. Deshpande, Balasubramanian Pranatharthiharan, Yen-Chu Yang
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Publication number: 20230068312Abstract: Semiconductor devices and methods of manufacturing the same are described. Transistors are fabricated using a standard process flow. A via opening extending from the top surface of the substrate to a bottom surface of the wafer device is formed, thus allowing nano TSV for high density packaging, as well as connecting the device to the backside power rail. A metal is deposited in the via opening, and the bottom surface of the wafer device is bound to a bonding wafer. The substrate is optionally thinned, and a contact electrically connected to the metal is formed.Type: ApplicationFiled: August 29, 2022Publication date: March 2, 2023Applicant: Applied Materials, Inc.Inventors: Suketu Arun Parikh, Ashish Pal, El Mehdi Bazizi, Andrew Yeoh, Nitin K. Ingle, Arvind Sundarrajan, Guan Huei See, Martinus Maria Berkens, Sameer A. Deshpande, Balasubramanian Pranatharthiharan, Yen-Chu Yang
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Publication number: 20220402096Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.Type: ApplicationFiled: August 26, 2022Publication date: December 22, 2022Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Publication number: 20210331288Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.Type: ApplicationFiled: July 8, 2021Publication date: October 28, 2021Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Patent number: 11077536Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.Type: GrantFiled: June 19, 2017Date of Patent: August 3, 2021Assignee: Applied Materials, Inc.Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Publication number: 20210205953Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.Type: ApplicationFiled: March 22, 2021Publication date: July 8, 2021Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Patent number: 10967483Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.Type: GrantFiled: June 19, 2017Date of Patent: April 6, 2021Assignee: Applied Materials, Inc.Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Publication number: 20210046602Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.Type: ApplicationFiled: March 26, 2020Publication date: February 18, 2021Inventors: Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang, You Wang, Rajeev Bajaj
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Publication number: 20210046603Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of a heating fluid, a reservoir to hold a polishing liquid, and a dispenser having one or more apertures suspended over the platen to direct the polishing liquid onto the polishing surface, wherein the source of the heating fluid is coupled to the dispenser and configured to deliver the heating fluid into the polishing liquid to heat the polishing liquid after the polishing liquid leaves the reservoir and before the polishing liquid is dispensed onto the polishing surface.Type: ApplicationFiled: March 26, 2020Publication date: February 18, 2021Inventors: Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang, You Wang, Rajeev Bajaj
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Publication number: 20190143476Abstract: A chemical mechanical polishing system includes a support to hold a polishing pad, a carrier head to hold a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature control system to control a temperature of the polishing process, and a controller coupled to the in-situ monitoring system and the temperature control system. The controller is configured to cause the temperature control system to vary the temperature of the polishing process in response to the signal.Type: ApplicationFiled: November 13, 2018Publication date: May 16, 2019Inventors: Haosheng Wu, Hari Soundararajan, Yen-Chu Yang, Jianshe Tang, Shou-Sung Chang, Shih-Haur Shen, Taketo Sekine
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Publication number: 20170368664Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.Type: ApplicationFiled: June 19, 2017Publication date: December 28, 2017Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Publication number: 20170368663Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.Type: ApplicationFiled: June 19, 2017Publication date: December 28, 2017Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Publication number: 20140030956Abstract: A polishing method includes positioning two substrates in contact with the same polishing pad. Prior to commencement of polishing and while the two substrates are in contact with the polishing pad, two starting values are generated from an in-situ monitoring system. Either a starting polishing time or a pressure applied to one of the substrates can be adjusted so that the two substrates have closer endpoint conditions. During polishing the two substrates are monitored with the in-situ monitoring system to generate a two sequences of values, and a polishing endpoint can be detected or an adjustment for a polishing parameter can be based on the two sequences of values.Type: ApplicationFiled: July 25, 2012Publication date: January 30, 2014Inventors: Jimin Zhang, Jose Salas-Vernis, Ingemar Carlsson, David H. Mai, Huyen Tran, Zhihong Wang, Wen-Chiang Tu, Stephen Jew, Boguslaw A. Swedek, Shih-Haur Shen, James C. Wang, Yen-Chu Yang