Patents by Inventor Yen-Feng Shih

Yen-Feng Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9480960
    Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: November 1, 2016
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yen-Feng Shih, Yi-Hsiuan Yu, Yen-Lin Tseng, Hou-An Hsieh
  • Publication number: 20160151757
    Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 2, 2016
    Inventors: YEN-FENG SHIH, YI-HSIUAN YU, YEN-LIN TSENG, HOU-AN HSIEH
  • Patent number: 8980120
    Abstract: A heat dissipating material and a method for preparing the same, of which the method comprises the following steps: providing paraffin wax, boron nitride, graphite, and a modified multi-walled carbon nanotube; heating the paraffin wax until the paraffin wax is softened; and mixing the boron nitride, the graphite, the modified multi-walled carbon nanotube and the paraffin wax. Wherein, based on the total weight of the heat dissipating material, the content of the paraffin wax is from 50 to 60% by weight; the content of boron nitride is from 20 to 40% by weight; the content of the graphite is from 3 to 15% by weight; and the content of the modified multi-walled carbon nanotube is from 1 to 5% by weight.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: March 17, 2015
    Assignee: Getac Technology Corporation
    Inventors: Tien-Chieh Wu, Yen-Feng Shih
  • Publication number: 20140070133
    Abstract: A heat dissipating material and a method for preparing the same, of which the method comprises the following steps: providing paraffin wax, boron nitride, graphite, and a modified multi-walled carbon nanotube; heating the paraffin wax until the paraffin wax is softened; and mixing the boron nitride, the graphite, the modified multi-walled carbon nanotube and the paraffin wax. Wherein, based on the total weight of the heat dissipating material, the content of the paraffin wax is from 50 to 60% by weight; the content of boron nitride is from 20 to 40% by weight; the content of the graphite is from 3 to 15% by weight; and the content of the modified multi-walled carbon nanotube is from 1 to 5% by weight.
    Type: Application
    Filed: July 10, 2013
    Publication date: March 13, 2014
    Inventors: Tien-Chieh Wu, Yen-Feng Shih