Abstract: A packet transmission method is provided. The packet transmission method may be applied to an apparatus. The packet transmission method may include the following steps. A path engine circuit of the apparatus may receive a packet from a modem circuit of the apparatus or from a Wi-Fi chip of the apparatus. Then, the path engine circuit may transmit the packet from the modem circuit to the Wi-Fi chip, or transmit the packet from the Wi-Fi chip to the modem circuit or a central processing unit (CPU) of the apparatus.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A video file playback system capable of previewing an image, a method thereof, and a computer program product can sequentially compare change amounts between chronological two of frame images, select the frame images, of which the change amounts exceed a preset value, in at least one time interval, and select a frame image, which has a maximum change amount, in the frame images in each time interval as a preview image. By displaying a preview image corresponding to each time interval, a user can quickly browse key images of each time interval.

Abstract: A video file playback system capable of previewing an image, a method thereof, and a computer program product can sequentially compare change amounts between chronological two of frame images, select the frame images, of which the change amounts exceed a preset value, in at least one time interval, and select a frame image, which has a maximum change amount, in the frame images in each time interval as a preview image. By displaying a preview image corresponding to each time interval, a user can quickly browse key images of each time interval.

Abstract: A method and circuit with minimized clock skews in an IC.

Abstract: An integrated circuit with a flexible data strobe signal (DQS) bus structure is presented. The integrated circuit has a number of input/output (I/O) modules with a number of data pins to receive and transmit data. In addition, a subset of the I/O modules also have a data strobe pin. The input/output modules are connected to data strobe signal buses having a fixed configuration. The configuration of the fixed DQS bus groups a number of data pins with a corresponding data strobe pin and the grouping of data pin spans multiple I/O modules. The integrated circuit also has a flexible data bus connected to the I/O modules. Data pins of I/O modules of a second integrated circuit are mapped a subset of the data pins of corresponding I/O modules of the integrated circuit. The flexible data strobe signal bus enables selection of the subset of data pins in the integrated circuit.

Abstract: A circuit can include a module having signal pads that are configurable to route signals between the circuit and at least one external device. The module can also have unused pads that are interleaved between the signal pads. A circuit can include a module having signal pads that are configurable to route varying signals between the circuit and at least one external device. The module can also have voltage pads that are configurable to route substantially constant voltages between at least one external device and the circuit. The signal pads can be interleaved between the voltage pads. A module with one or more of these features can achieve ideal performance in both wire bond and flip chip packages with the flexibility of setting a different input/output utilization percentage within the module.

Abstract: A circuit can include a module having signal pads that are configurable to route signals between the circuit and at least one external device. The module can also have unused pads that are interleaved between the signal pads. A circuit can include a module having signal pads that are configurable to route varying signals between the circuit and at least one external device. The module can also have voltage pads that are configurable to route substantially constant voltages between at least one external device and the circuit. The signal pads can be interleaved between the voltage pads. A module with one or more of these features can achieve ideal performance in both wire bond and flip chip packages with the flexibility of setting a different input/output utilization percentage within the module.

Abstract: Circuits, methods, and apparatus for ordering the timing of clock and data signals. Programmable delay cells are utilized in a data output cell to control a critical multiple data rate input/output write timing so the output can achieve better performance, such as higher maximum frequency of output (Fmax) performance. The delay cells ensure that critical timing criteria between clock signals and data high and low signals are satisfied so that there is a reduced chance of output glitching.