Abstract: A die bonding method with corner or side contact without impact force includes the steps: picking up a die by a die bonding device, wherein a surface of the die has no solder and bump; moving the die to one side of a die placement area of a substrate, wherein the substrate has no solder and bump; blowing one corner or one side of the die a positive pressure from the die bonding device to bend the corner/side to contact the die placement area; forming a bonding wave after the corner/side of the die contacting the die placement area, and spreading the bonding wave from the corner/side to opposite corner/side of the die, and separating the die from the die bonding device gradually and bonding the die on the die placement area; and bonding the die on the die placement area completely.

Abstract: A hybrid die bonding method includes the following steps: dicing a wafer into a plurality of dies arranged on a plurality of target blocks of a carrier film, wherein surfaces of each of the dies having no solder and bump; cleaning particulate from first surfaces of the dies; separating sides and corners of second surfaces of the dies from the target blocks; turning the carrier film and transferring the dies to a first carrier, wherein the first surfaces of the dies contact the first carrier; removing the carrier film from the second surfaces of the dies; cleaning particulate from the second surfaces of the dies; and transferring the dies from the first carrier to a substrate, wherein a surface of the substrate having no solder and bump. As such, the method reduces the adhesive force between the dies and the carrier film.

Abstract: A die bonding method with corner or side contact without impact force includes the steps: picking up a die by a die bonding device, wherein a surface of the die has no solder and bump; moving the die to one side of a die placement area of a substrate, wherein the substrate has no solder and bump; blowing one corner or one side of the die a positive pressure from the die bonding device to bend the corner/side to contact the die placement area; forming a bonding wave after the corner/side of the die contacting the die placement area, and spreading the bonding wave from the corner/side to opposite corner/side of the die, and separating the die from the die bonding device gradually and bonding the die on the die placement area; and bonding the die on the die placement area completely.

Abstract: A chip-placing method for performing an image alignment of chip placement comprises a chip pick-up step, a reference-image capturing step, an alignment-image capturing step, a calculating and processing step, a calibration adjusting step and a placing step. An image(s) of a marking member and a chip sucked by a chip-placing member is/are captured from an opposite direction so as to obtain a relative position information of the chip in relation to the marking member. An image showing the marking member and the substrate is captured from a backside so as to obtain a relative position information of the marking member in relation to the substrate. A position calibration relationship information of the position of the chip in relation to a to-be-placed location of the substrate is obtained according to those relative position information. Therefore, a relative position of the chip-placing member in relation to the to-be-placed location is calibrated.

Abstract: A chip-placing method for performing an image alignment of chip placement comprises a chip pick-up step, a reference-image capturing step, an alignment-image capturing step, a calculating and processing step, a calibration adjusting step and a placing step. An image(s) of a marking member and a chip sucked by a chip-placing member is/are captured from an opposite direction so as to obtain a relative position information of the chip in relation to the marking member. An image showing the marking member and the substrate is captured from a backside so as to obtain a relative position information of the marking member in relation to the substrate. A position calibration relationship information of the position of the chip in relation to a to-be-placed location of the substrate is obtained according to those relative position information. Therefore, a relative position of the chip-placing member in relation to the to-be-placed location is calibrated.