Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.

Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.

Abstract: Disclosed is a bonding apparatus, comprising: i) a supporting device for supporting a supply of electronic devices; ii) an ejecting device for ejecting an electronic device from the supply of electronic devices; iii) a plurality of delivery devices, each delivery device being for delivering a substrate for bonding the electronic devices thereto; and iv) a plurality of transfer devices, each transfer device having a rotary transfer arm operable to transfer the electronic devices from the supply of electronic devices at one or more pick locations to a respective one of the substrates for bonding thereto, upon the electronic devices being ejected by the ejecting device from the supply of electronic devices at the one or more pick locations. A method of bonding electronic devices to substrates is also disclosed.

Abstract: Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions.

Abstract: Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing is disclosed. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually levelled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: A method of bonding semiconductor dice onto a substrate first uses an optical assembly to perform pattern recognition of a die bonding section of the substrate in which multiple die pads are located so as to identify positions of the multiple die pads simultaneously during such pattern recognition step. After pattern recognition of the said die bonding section, an adhesive is dispensed with an adhesive dispenser onto at least one of the die pads located in the die bonding section. While the adhesive dispenser is dispensing the adhesive to further die pads located in the die bonding section, a pick-and-place arm concurrently bonds a die onto each die pad where the adhesive has already been dispensed.

Abstract: Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

Abstract: The invention provides an apparatus and a method for positioning an object coupled to a first support structure and a second support structure. A first actuator drives the first support structure along a first axis and a second actuator drives the first support structure along a second axis orthogonal to the first axis. A third actuator comprising a forcer and a stator is provided for driving the second support structure that is guided for movement relative to the first support structure along a third axis orthogonal to the first and second axes. The forcer is coupled to the second support structure and is movable with respect to the stator, and the stator is relatively stationary and decoupled from the second support structure.