Abstract: A cooling apparatus is provided for a linear motor that comprises a coil assembly and a magnet assembly, wherein the coil assembly generates heat during operation. The cooling apparatus comprises a compressed air inlet positioned to discharge compressed air in a direction directly towards a gap between the coil assembly and magnet assembly, and an inclined surface extending from the compressed air inlet and sloping at an obtuse angle away from the discharge direction of the compressed air. The compressed air inlet is configured to discharge the compressed air at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the compressed air that is discharged.

Abstract: A cooling apparatus is provided for a linear motor that comprises a coil assembly and a magnet assembly, wherein the coil assembly generates heat during operation. The cooling apparatus comprises a compressed air inlet positioned to discharge compressed air in a direction directly towards a gap between the coil assembly and magnet assembly, and an inclined surface extending from the compressed air inlet and sloping at an obtuse angle away from the discharge direction of the compressed air. The compressed air inlet is configured to discharge the compressed air at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the compressed air that is discharged.

Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.

Abstract: The invention provides an apparatus and a method for positioning an object coupled to a first support structure and a second support structure. A first actuator drives the first support structure along a first axis and a second actuator drives the first support structure along a second axis orthogonal to the first axis. A third actuator comprising a forcer and a stator is provided for driving the second support structure that is guided for movement relative to the first support structure along a third axis orthogonal to the first and second axes. The forcer is coupled to the second support structure and is movable with respect to the stator, and the stator is relatively stationary and decoupled from the second support structure.

Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.