Patents by Inventor Yen-Hsing Chu

Yen-Hsing Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 10530080
    Abstract: An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: January 7, 2020
    Assignee: PEGATRON CORPORATION
    Inventors: Yu-Ti Kuo, Yen-Hsing Chu, Chien-Yi Lee, Ching-Jen Wang
  • ELECTRONIC DEVICE
    Publication number: 20190067852
    Abstract: An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.
    Type: Application
    Filed: July 12, 2018
    Publication date: February 28, 2019
    Applicant: PEGATRON CORPORATION
    Inventors: Yu-Ti Kuo, Yen-Hsing Chu, Chien-Yi Lee, Ching-Jen Wang