Patents by Inventor Yen-Hsiu Chen

Yen-Hsiu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature method for metal deposition
    Patent number: 7176081
    Abstract: A novel, low-temperature metal deposition method which is suitable for depositing a metal film on a substrate, such as in the fabrication of metal-insulator-metal (MIM) capacitors, is disclosed. The method includes depositing a metal film on a substrate using a deposition temperature of less than typically about 270 degrees C. The resulting metal film is characterized by enhanced thickness uniformity and reduced grain agglomeration which otherwise tends to reduce the operational integrity of a capacitor or other device of which the metal film is a part. Furthermore, the metal film is characterized by intrinsic breakdown voltage (Vbd) improvement.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: February 13, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Fu Chang, Yen-Hsiu Chen, Hung-Jen Lin, Ming-Chu King, Ching-Hwanq Su, Chih-Mu Huang, Yun Chang
  • Low temperature method for metal deposition
    Publication number: 20050260811
    Abstract: A novel, low-temperature metal deposition method which is suitable for depositing a metal film on a substrate, such as in the fabrication of metal-insulator-metal (MIM) capacitors, is disclosed. The method includes depositing a metal film on a substrate using a deposition temperature of less than typically about 270 degrees C. The resulting metal film is characterized by enhanced thickness uniformity and reduced grain agglomeration which otherwise tends to reduce the operational integrity of a capacitor or other device of which the metal film is a part. Furthermore, the metal film is characterized by intrinsic breakdown voltage (Vbd) improvement.
    Type: Application
    Filed: May 20, 2004
    Publication date: November 24, 2005
    Inventors: Chih-Fu Chang, Yen-Hsiu Chen, Hung-Jen Lin, Ming-Chu King, Ching-Hwano Su, Chih-Mu Huang, Yun Chang