Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A gate driving device and an operating method are provided. The gate driving device includes a plurality of gate driving circuits and a control circuit. The gate driving circuits generate a plurality of gate driving signals having different timing. The control circuit is coupled to a plurality of candidate gate driving circuits among the gate driving circuits. The control circuit selects one of the candidate gate driving circuits as an initial stage gate driving circuit per one scanning cycle. A series connection mode between the gate driving circuits is changed in response to a scan selection signal.

Abstract: A multi-level voltage generator includes P-type metal-oxide-semiconductor (PMOS) transistors that generate corresponding positive voltages and a common voltage respectively, each PMOS transistor having a source connected to corresponding generated voltage, and a drain connected to an output node to provide the corresponding generated voltage; N-type metal-oxide-semiconductor (NMOS) transistors that generate corresponding negative voltages and the common voltage respectively, each NMOS transistor having a source connected to corresponding generated voltage, and a drain connected to the output node to provide the corresponding generated voltage; and body-voltage selectors that adaptively select a body voltage for the plurality of PMOS transistors and NMOS transistors respectively, except PMOS transistor associated with a highest positive voltage and NMOS transistor associated with a lowest negative voltage with body and source connected together.

Abstract: A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.

Abstract: This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.

Abstract: A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.

Abstract: An improved spacer in an apparatus comprising a MEMS device that is packaged between a substrate and cover plate, where the improved spacer protects traces running on the substrate and under the spacer. The improved spacer reduces the amount of force or pressure on the traces or wires, which reduces line out damage when an array of packaged MEMS devices are separated by pressure or force into one packaged MEMS device. In one embodiment, the improved spacer comprises a softer, deformable, elastic, or malleable material that does not crush the traces. This softer material can be an elastic polymeric spacer. In another embodiment, the improved spacer can protect these traces by having a shape with a smaller contact surface which minimizes the amount of traces being affected. This surface can be a sphere or a ball.

Abstract: A method of packaging an organic electroluminescent (OEL) device is provided. In the method, a substrate comprising an OEL component formed thereon is provided first. Thereafter, a cover plate is provided. Afterward, a hydrophilic polymer serving as a desiccant between the substrate and the cover plate is formed. Then, an adhesive between the substrate and the cover plate for sealing the OEL component and the desiccant is formed. Therefore, moisture/oxygen in the package structure is absorbed and removed by the hydrophilic polymer.

Abstract: An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.

Abstract: A package structure of an organic electroluminescent (OEL) device and a method of packaging thereof are provided. The package structure includes a substrate, an OEL component, a cover plate, a desiccant and an adhesive. The OEL component is disposed over the substrate. The cover plate is disposed over the substrate. The desiccant is disposed above the substrate or the cover plate. The desiccant includes, for example but not limited to, a hydrophilic polymer. The adhesive is disposed between the substrate and the cover plate, wherein the OEL component and the desiccant are sealed by the substrate, the cover plate and the adhesive. Therefore, moisture/oxygen in the package structure is absorbed and removed by the hydrophilic polymer.

Abstract: An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.

Abstract: An organic light-emitting device having a porous desiccant layer therein and a method for fabricating the same is provided. The porous desiccant layer is manufactured by spreading a liquid desiccant on a surface, forming air bubbles (by activating some vesicant or injecting gas into the liquid desiccant) and curing the liquid desiccant. The porous desiccant comprises solidified hardening glue having bubbles and lots of desiccant particles or powder distributed evenly therein. Some residual vesicant may remain inside the solidified hardening glue after activation. The bubbles inside the porous desiccant enhance the absorption rate and efficiency of the desiccant so that moisture and gaseous oxygen inside the OLED package can be absorbed rapidly.