Abstract: A write assist circuit can include a control circuit and a voltage generator. The control circuit can be configured to receive memory address information associated with a memory write operation for memory cells. The voltage generator can be configured to provide a reference voltage to one or more bitlines coupled to the memory cells. The voltage generator can include two capacitive elements, where during the memory write operation, (i) one of the capacitive elements can be configured to couple the reference voltage to a first negative voltage, and (ii) based on the memory address information, both capacitive elements can be configured to cumulatively couple the reference voltage to a second negative voltage that is lower than the first negative voltage.

Abstract: A sense amplifier (SA) includes a semiconductor substrate having a source/drain (S/D) diffusion region; a pair of SA sensing devices both disposed in the S/D diffusion region; an SA enabling device disposed in the same S/D diffusion region as where the pair of SA sensing devices are disposed in; and a sense amplifier enabling signal (SAE) line for carrying an SAE signal, for turning on the SA enabling device to discharge one of the pair of SA sensing devices during a data read from the sense amplifier, wherein the SA enabling device is arranged to provide buffer protection for source/drain terminals of the pair of SA sensing devices.

Abstract: A cell structure is disclosed. The cell structure includes a first unit comprising a first group of transistors and a first data latch, a second unit comprising a second group of transistors and a second data latch a read port unit comprising a plurality of p-type transistors, a search line and a complementary search line, the search line and the complementary search line function as input of the cell structure, and a master line, the master line functions as an output of the cell structure, the first unit is coupled to the second unit, both the first and the second units are coupled to the read port unit. According to some embodiments, the first data latch comprises a first and a second p-type transistors, a first and a second n-type transistors.

Abstract: A static random access memory (SRAM) includes a bit cell that includes a p-type pass gate, a bit information path connected to the bit cell by the p-type pass gate, and a write multiplexer connected to the bit information path. The write multiplexer includes a p-type transistor configured to selectively couple the bit information path to a flip-flop.

Abstract: A memory macro includes a first memory cell array, a first tracking circuit, a first and a second transistor. The first tracking circuit includes a first set of memory cells configured as a first set of loading cells responsive to a first control signal, a second set of memory cells configured as a first set of pull-down cells responsive to a second control signal, and a first tracking bit line extending over the first tracking circuit. The second control signal is inverted from the first control signal. At least the first set of pull-down cells or the first set of loading cells is configured to track a memory cell of the first memory cell array. The first and second transistor are coupled to the first tracking bit line, and are configured to charge the first tracking bit line to a pre-charge voltage level responsive to a third control signal.

Abstract: A memory circuit including: a first column of memory cells, each memory cell of the first column including a first supply segment; a first supply voltage line in a first conductive layer, the first supply voltage line being made of at least the first supply segments of the first column; a second supply voltage line; a first resistive device electrically connecting the first and second supply voltage lines, and being located in a via layer; a first material, from which the first resistive device is formed, being different than a second material from which a first type of via plug in the via layer is formed; and a supply voltage source electrically coupled with first supply voltage line through one or more conductive paths, and the second supply voltage line and the first resistive device being in a lowest resistance path of the one or more conductive paths.

Abstract: A device includes a memory array. The memory array includes a first sub-bank, a first strap cell coupled to the first sub-bank, and a first continuous data line. The first continuous data line includes a first portion and a second portion coupled to the first sub-bank via the first strap cell. The first portion of the first continuous data line is disposed above the first strap cell and the second portion of the first continuous data line is disposed above the first portion of the first continuous data line.

Abstract: An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.

Abstract: A static random access memory (SRAM) including at least a first memory cell array, a second memory cell array, a first data line connected to the first memory cell array and the second memory cell array, a primary driver circuit connected to the first data line and a supplementary driver circuit connected to the first data line, wherein the supplementary driver circuit is configured to pull a voltage level of the first data line to a first voltage level during a write operation of the SRAM.

Abstract: A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.

Abstract: Some embodiments relate to a memory device including first and second conductive lines extending generally in parallel with one another within over a row of memory cells. A centerline extends generally in parallel with the first and second conductive lines and is spaced between the first and second conductive lines. A first plurality of conductive line segments is over the first conductive line. Conductive line segments of the first plurality of conductive line segments are coupled to different locations on the first conductive line. A second plurality of conductive line segments are disposed over the second conductive line, and are coupled to different locations on the second conductive line.

Abstract: A memory cell includes a write port and a read port. The write port includes two cross-coupled inverters that form a storage unit. The cross-coupled inverters are connected between a first power source signal line and a second power source signal line. The write port also includes a first local interconnect line in an interconnect layer that is connected to the second power source signal line. The read port includes a transistor that is connected to the storage unit in the write port and to the second power source signal line, and a second local interconnect line in the interconnect layer that is connected to the second power source signal line. The second local interconnect line in the read port is separate from the first local interconnect line in the write port.

Abstract: A memory device is provided. The memory device includes a shift register array having a plurality of shift registers arranged in a matrix of a plurality of rows and a plurality of columns. Each of the plurality of rows comprises a first plurality of shift registers and each of the plurality of columns comprises a second plurality of shift registers. Each of the plurality of rows are associated with a read word line and a write word lines. Each of the plurality of rows are associated with a data input line and a data output line. Each of the plurality of shift arrays comprises a static random access memory.

Abstract: A sense amplifier (SA) comprises a semiconductor substrate having an oxide definition (OD) region, a pair of SA sensing devices, a SA enabling device, and a sense amplifier enabling signal (SAE) line for carrying an SAE signal. The pair of SA sensing devices have the same poly gate length Lg as the SA enabling device, and they all share the same OD region. When enabled, the SAE signal turns on the SA enabling device to discharge one of the pair of SA sensing devices for data read from the sense amplifier.

Abstract: An electronic device for checking a randomness of an identification key device, a random key checker circuit for an electronic device and a method of checking randomness for an electronic device. An electronic device for checking a randomness of an identification key device includes an identification key generator, configured to generate an identification key. A random key checker circuit, configured to receive the identification key from the identification key generator, calculates a randomness value of the identification key according to the identification key for checking a randomness of the identification key and generates an output of the identification key with high randomness.

Abstract: A testing circuit for testing a multi-port random access memory includes an input circuit, a first port testing circuit and a second port testing circuit. The input circuit receives a testing clock signal and a test mode enable signal and is configured to provide the testing clock signal according to the test mode enable signal. The first port testing circuit is coupled to the input circuit, and is configured to output a first word line enable signal for a first port of the multi-port random access memory according to the testing clock signal and a first delay signal. The second port testing circuit is coupled to the input circuit, and is configured to output a second word line enable signal for a second port of the multi-port random access memory according to the testing clock signal and a second delay signal. The first word line enable signal and the second word line enable signal are asserted at the same time, and the first word line enable signal is de-asserted before the second word line enable signal.

Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to minimize power consumption.

Abstract: In some embodiments, a semiconductor memory device includes an array of semiconductor memory cells arranged in rows and columns. The array includes a first segment of memory cells and a second segment of memory cells. A first pair of complementary local bit lines extend over the first segment of memory cells and is coupled to multiple memory cells along a first column within the first segment of memory cells. A second pair of complementary local bit lines extend over the second segment of memory cells and is coupled to multiple memory cells along the first column within the second segment of memory cells. A pair of switches is arranged between the first and second segments of memory cells. The pair of switches is configured to selectively couple the first pair of complementary local bit lines in series with the second pair of complementary local bit lines.

Abstract: A memory device includes memory cells and a control circuit. Each memory cell includes a first inverter, a second inverter, a first transistor and a second transistor. The first and second inverters are cross-coupled between a first data node and a second data node. The first transistor has a first control terminal coupled to a wordline, a first connection terminal coupled to a bitline, and a second connection terminal. The second transistor has a second control terminal, a third connection terminal and a fourth connection terminal. The second control terminal is coupled to the first data node. The third connection terminal is coupled to the second connection terminal. The control circuit is coupled to the fourth connection terminal, and is configured to, when the bitline is selected, adjust a voltage level at the fourth connection terminal in response to activation of the wordline.

Abstract: A memory device includes: a memory cell array having a plurality of memory cells, wherein each of the plurality of memory cells includes a first port; a first control circuit disposed on a first side of the memory cell array and arranged to electrically connect to the plurality of first ports; and a second control circuit disposed on a second side of the memory cell array and arranged to electrically connect to the plurality of first ports; wherein the second side is opposite to the first side of the memory cell array.