Abstract: A method of manufacturing composite material containing artificial graphite is disclosed. An artificial graphite powder and a first solvent are mixed together to obtain a graphite dispersion solution, and a particle size of the graphite powder is less than 50 ?m. The graphite dispersion solution and a polyamic acid solution are mixed together to obtain a liquid mixture. The liquid mixture is heated to obtain a polyamic acid film containing artificial graphite powder. The imidization of the polyamic acid film is performed to obtain the composite material containing artificial graphite. A method of manufacturing a graphite sheet by using the composite material containing artificial graphite as raw material is disclosed.

Abstract: A polyimide polymer, polyimide film and polyimide laminate plate including the same are provided. The polyimide polymer includes Formula (I), Formula (II) and Formula (III). In Formula (I), Formula (II) and Formula (III), A is an aromatic group with fluorine, B, B?, and B? are aromatic groups different from one another. B/(B+B?+B?), B?/(B+B?+B?), and B?/(B+B?+B?) are larger than 0. The polyimide film includes a film layer which includes the above polyimide polymer. The film layer optionally includes colorants or inorganic nanoparticles. Therefore, the thermal resistance and the transparency of the polyimide film are improved, and a polyimide film with high thermal resistance and different colors is available. The polyimide solution can also be applied on metal film to form polyimide laminate plate.

Abstract: A polyimide polymer, polyimide film and polyimide laminate plate including the same are provided. The polyimide polymer includes Formula (I), Formula (II) and Formula (III). In Formula (I), Formula (II) and Formula (III), A is an aromatic group with fluorine, B, B?, and B? are aromatic groups different from one another. B/(B+B?+B?), B?/(B+B?+B?), and B?/(B+B?+B?) are larger than 0. The polyimide film includes a film layer which includes the above polyimide polymer. The film layer optionally includes colorants or inorganic nanoparticles. Therefore, the thermal resistance and the transparency of the polyimide film are improved, and a polyimide film with high thermal resistance and different colors is available. The polyimide solution can also be applied on metal film to form polyimide laminate plate.

Abstract: A polyimide film comprising a polyimide and a lithium iron phosphate and a polyimide laminate thereof are disclosed. The weight percentage of the lithium iron phosphate is between 1 wt % and 49 wt %, and the weight percentage of the lithium iron phosphate is based on the total weight of the polyimide film. The polyimide laminate comprises a substrate and a polyimide film. The polyimide film covers the substrate.

Abstract: A polyimide film comprising a polyimide and a lithium iron phosphate and a polyimide laminate thereof are disclosed. The weight percentage of the lithium iron phosphate is between 1 wt % and 49 wt %, and the weight percentage of the lithium iron phosphate is based on the total weight of the polyimide film. The polyimide laminate comprises a substrate and a polyimide film. The polyimide film covers the substrate.

Abstract: Disclosed herein is a polyimide film having inorganic particles. The polyimide film is 12-250 ?m in thickness. The polyimide film includes about 50-90 weight parts of polyimide and about 10-50 weight parts of the inorganic particles. The particle size of each of the inorganic particles is about 0.1 ?m to about 5 ?m. The polyimide film is characterized in that the thermal expansion coefficient is equal to or less than 30 ppm/° C. in any direction, the difference between two thermal expansion coefficients in two mutually perpendicular directions on the film surface is less than 10 ppm/° C., and the Young's modulus of the polyimide film is greater than 4 GPa in any direction. The dimensional stability of the polyimide film measured by the standard of IPC-TM-650 is less than 0.10% in any direction. A method for manufacturing the polyimide film is disclosed as well.

Abstract: Disclosed herein is a polyimide film having inorganic particles. The polyimide film is 12-250 ?m in thickness. The polyimide film includes about 50-90 weight parts of polyimide and about 10-50 weight parts of the inorganic particles. The particle size of each of the inorganic particles is about 0.1 ?m to about 5 ?m. The polyimide film is characterized in that the thermal expansion coefficient is equal to or less than 30 ppm/° C. in any direction, the difference between two thermal expansion coefficients in two mutually perpendicular directions on the film surface is less than 10 ppm/° C., and the Young's modulus of the polyimide film is greater than 4 GPa in any direction. The dimensional stability of the polyimide film measured by the standard of IPC-TM-650 is less than 0.10% in any direction. A method for manufacturing the polyimide film is disclosed as well.

Abstract: A black matte polyimide film having inorganic particles and carbon particles is provided. The polyimide film has a thickness ranging from 12 ?m to 250 ?m. The polyimide film includes 1 wt % to 49 wt % of the carbon particles and 1 wt % to 49 wt % of the inorganic particles. Each of the carbon particles and the inorganic particles respectively has a particle size ranging from about 0.1 ?m to about 10 ?m. The polyimide film is characterized in that the 60° lustrousness is equal to or less than 60 Gloss Unit (GU). The thermal expansion coefficient (CTE) is equal to or less than 30 ppm/° C. The light transmittance is equal to or less than 10%. A method for manufacturing the polyimide film is disclosed as well.

Abstract: Disclosed herein is a polyimide film having inorganic particles. The polyimide film is 12-250 ?m in thickness. The polyimide film includes about 50-90 weight parts of polyimide and about 10-50 weight parts of the inorganic particles. The particle size of each of the inorganic particles is about 0.1 ?m to about 5 ?m. The polyimide film is characterized in that the thermal expansion coefficient is equal to or less than 30 ppm/° C. in any direction, the difference between two thermal expansion coefficients in two mutually perpendicular directions on the film surface is less than 10 ppm/° C., and the Young's modulus of the polyimide film is greater than 4 GPa in any direction. The dimensional stability of the polyimide film measured by the standard of IPC-TM-650 is less than 0.10% in any direction. A method for manufacturing the polyimide film is disclosed as well.

Abstract: A method for forming a patterned layer on the substrate structure, comprising the steps of providing a substrate structure, a plurality of banks formed on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms, jetting ink into the accommodating rooms using an ink jet device, and solidifying the ink in the accommodating rooms to form the patterned layer on the substrate structure.

Abstract: Disclosed herein are a polyimide laminate and a method for fabricating the same. In the disclosed method, a polyimide film having a thermally-conductive filler distributed homogenously therein is prepared, the polyimide film is characterized in having a thermal conductivity greater than 0.3 W/m-° C. Then, at least one metal film is subsequently deposited on one or both sides of the polyimide film by electroplating, electroless plating, evaporation, sputtering or lamination and thereby forming the desired polyimide laminate.

Abstract: A method for manufacturing a metal clad laminate is provided. A poly(amic acid) solution is first formed. The poly(amic acid) solution includes a heat-conductive filler, a poly(amic acid) and a solvent. The thermal conductivity of the heat-conductive filler is higher than 10 W/m-° C. The content of the heat-conductive filler is about 10˜90 wt % of the solid content of the poly(amic acid) solution. Then, the poly(amic acid) solution is coated on a metal foil. Finally, the poly(amic acid) solution on the metal foil is heated to form a polyimide layer on the metal foil.

Abstract: A substrate structure includes a substrate and a number of banks formed on the substrate. The banks and the substrate cooperatively define a number of accommodating rooms. The accommodating rooms are configured for accommodating ink. A spread-control layer is formed on the substrate beneath the accommodating rooms. The spread-control layer enables the ink applied on the spread-control layer to spread at a lower spreading rate than the rate on the substrate without the spread-control layer formed thereon.

Abstract: A method for manufacturing a patterned thin-film layer includes the steps of: providing a substrate (102) with a plurality of walls (106), the walls cooperatively defining a plurality of spaces (108); depositing ink (110) into the plurality of spaces; controlling a temperature of the substrate so as to increase the viscosity of the ink deposited in the plurality of spaces; and solidifying the ink to form the patterned thin-film layer on the substrate.

Abstract: A method for manufacturing a substrate (10) having a thin film pattern layer (114) thereon includes the steps of: providing a preformed substrate (11) including a number of partition walls with ink repellent characteristic (104) and receiving spaces (106) bounded by the corresponding partition walls; filling the receiving spaces with an ink (112) containing a solidifiable content, wherein the ink received in each of the receiving spaces has a volume greater than that of the corresponding receiving space; and solidifying the ink so that the solidifiable content in the ink is formed into the thin film pattern layer in the receiving space.

Abstract: A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250.degree. C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.