Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: A foldable electronic device includes a first body having an end and a first inclined surface, a second body having a second inclined surface, and a hinge module. The end includes an accommodating area. A virtual shaft line exists between sides of the first inclined surface and the second inclined surface that are closest to each other. The second body rotates relative to the first body through the virtual shaft line. The hinge module includes a first bracket adjacent to the first inclined surface, connected to the first body, and located in the accommodating area, a second bracket adjacent to the second inclined surface and connected to the second body, and a third bracket including a first end and a second end. The first bracket is connected to the first end through a first torsion assembly. The second bracket is connected to the second end through a second torsion assembly.

Abstract: A surgical robot including at least one contact module, a control connection module, at least one first robotic arm, and at least one grip control device. A first transmission member of the control connection module drives the control module through a first transmission connecting member. A first shaft member of the first robotic arm is connected with the first transmission member while the grip control device is connected with the first robotic arm by a transmission interface. A force sensing member of the first robotic arm detects a first reaction force from the contact module so that the first robotic arm sends a feedback control signal to the grip control device to control a grip driving member to generate a force feedback for allowing a grip portion to move. Thereby, users can feel movement of the grip portion caused by the force feedback to avoid accidental iatrogenic injuries.

Abstract: An antenna device and a method for configuring the same are provided. The antenna device includes a grounding metal, a grounding part, a radiating part, a feeding part, a proximity sensor, and a sensing metal. The radiating part is electrically connected to the grounding metal through the grounding part. The feeding part is coupled to the grounding metal through a feeding point. The sensing metal is electrically connected to the proximity sensor. The sensing metal is separated from the radiating part at a distance. The distance is less than or equal to one thousandth of a wavelength corresponding to an operating frequency of the antenna device.

Abstract: An Antrodia cinnamomea cultivation method sequentially comprises the following steps: step 1, obtaining a nutrient solution by mixing in proportion, wherein ingredients of the nutrient solution comprises Cinnamomum kanehirai extracts, carbon sources and nitrogen sources, the nutrient solution is placed in a porous carrier, the porous carrier has a peripheral surface and multiple micropores recessed into the peripheral surface, the nutrient solution is able to infiltrate into the micropores to form a nutrient layer on the peripheral surface and inner peripheries of the micropores; step 2, performing a membrane treatment on the porous carrier to form a membrane on the nutrient layer; step 3, sterilizing the porous carrier; and step 4, growing Antrodia cinnamomea strains on the membrane on the porous carrier, and then placing the porous carrier in a sealed environment for cultivation at constant temperature and humidity.

Abstract: A lighting device including a lamp and a reflector is provided. The reflector is located in a light emitting direction of the lamp and disposed farther away from the lamp for reflecting a light emitted from the lamp. The reflector includes at least one reflective sheet and a coating partially formed on the at least one reflective sheet.

Abstract: A lighting device including a lamp and a reflector is provided. The reflector is located in a light emitting direction of the lamp and disposed farther away from the lamp for reflecting a light emitted from the lamp. The reflector includes at least one reflective sheet and a coating partially formed on the at least one reflective sheet.

Abstract: A pole fixing structure for fixing a lamp is provided. The pole fixing structure includes a multi-axial adapter and a positioning structure. The multi-axial adapter includes a fixed seat, a movable seat and a steering member. The fixed seat has first and second axial pole inserting holes. The movable seat has first and second size openings. The first size opening corresponds to the first axial pole inserting hole. The steering member is disposed on the movable seat in the first axis, wherein the movable seat rotates around the steering member with respect to the fixed seat, so that the second size opening corresponds to the second axial pole inserting hole. The positioning structure is disposed on the multi-axial adapter for fixing the first axial pole in the first size opening or fixing the second axial pole in the second size opening.

Abstract: A powered device, a power supply system and an operation mode selection method are provided. The power supply system includes a power sourcing equipment and the powered device. The powered device is electrically connected to the power sourcing equipment through an internet cable. The powered device includes a sensing module and a controlling module. The sensing module receives an internet signal from the power sourcing equipment through the internet cable, and outputs a switching signal according to the internet signal. The controlling module is used for selecting an operation mode of the powered device according to the switching signal.

Abstract: A powered device, a power supply system and an operation mode selection method are provided. The power supply system includes a power sourcing equipment and the powered device. The powered device is electrically connected to the power sourcing equipment through an internet cable. The powered device includes a sensing module and a controlling module. The sensing module receives an internet signal from the power sourcing equipment through the internet cable, and outputs a switching signal according to the internet signal. The controlling module is used for selecting an operation mode of the powered device according to the switching signal.

Abstract: A blood sampling needle has a shell, a trigger seat, a needle stand, an elastic resetter and a safety switching member. The shell is provided with inner wall, retaining space, needle outlet and insertion end. A through-flange is formed into the shell. The through-flange and inner wall form a release groove with a tapered end-face. The trigger seat is mounted into the retaining space in a moveable state. The trigger seat has a control end and a rod. An axial chamber is opened on the rod so that two elastic release blades are formed on the rod, and also accommodated correspondingly into the release groove. An abutting bevel edge is formed at the bottom of the elastic release blade, and mated with the tapered end-face of the release groove in an oblique surface. The present invention saves structural members, reduces fabrication cost with better safety and applicability.

Abstract: A rotational safety syringe includes front and rear barrels rotatable with respect to each other for moving a needle holder towards the rear barrel and compressing a spring to separate a protective cover. The needle holder is fixed by an elastic press button on the needle holder and a press opening on the rear barrel. After a through hole of the front barrel is aligned with a using position, the elastic press button can be pressed to release the needle holder, and the spring can eject the needle holder towards the through hole of the front barrel to extend the needle out from the through hole of the front barrel and pierce the needle into the using position. When the spring is released, the needle holder and needle are pulled back to hide the needle into the front and rear barrels to prevent the used needle from being touched.

Abstract: A blood sampling needle has a shell, a trigger seat, a needle stand, an elastic resetter and a safety switching member. The shell is provided with inner wall, retaining space, needle outlet and insertion end. A through-flange is formed into the shell. The through-flange and inner wall form a release groove with a tapered end-face. The trigger seat is mounted into the retaining space in a moveable state. The trigger seat has a control end and a rod. An axial chamber is opened on the rod so that two elastic release blades are formed on the rod, and also accommodated correspondingly into the release groove. An abutting bevel edge is formed at the bottom of the elastic release blade, and mated with the tapered end-face of the release groove in an oblique surface. The present invention saves structural members, reduces fabrication cost with better safety and applicability.

Abstract: The present invention discloses a substrate within a Ni/Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with a circuit layout pattern and forming a conducting film on the surface of the substrate; depositing a first photoresist layer within an opening on said electrical conducting film surface to expose a portion of said circuit layout pattern to be electrical contact pads; removing the exposed conducting film uncovered by the first photoresist layer; depositing a second photoresist layer, covering the conducting film exposed in the openings of the first photoresist layer; electroplating Ni/Au covering the surface of the electrical contact pads; removing the first and second photoresists, and the conducting film covered by the photoresists; depositing solder mask on the substrate within an opening to expose said electrical contact pads.

Abstract: The present invention discloses a substrate within a Ni/Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with a circuit layout pattern and forming a conducting film on the surface of the substrate; depositing a first photoresist layer within an opening on said electrical conducting film surface to expose a portion of said circuit layout pattern to be electrical contact pads; removing the exposed conducting film uncovered by the first photoresist layer; depositing a second photoresist layer, covering the conducting film exposed in the openings of the first photoresist layer; electroplating Ni/Au covering the surface of the electrical contact pads; removing the first and second photoresists, and the conducting film covered by the photoresists; depositing solder mask on the substrate within an opening to expose said electrical contact pads.