Patents by Inventor Yen-Hwei Hsieh

Yen-Hwei Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230185280
    Abstract: An integrated circuit (IC) configurable to perform adaptive thermal ceiling control in a per-functional-block manner, an associated main circuit, an associated electronic device and an associated thermal control method are provided. The IC may include a plurality of hardware circuits arranged to perform operations of a first functional block, and at least one thermal control circuit. At least one temperature sensor is coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block.
    Type: Application
    Filed: November 23, 2022
    Publication date: June 15, 2023
    Applicant: MEDIATEK INC.
    Inventors: Chih-Fu Tsai, Yu-Chia Chang, Bo-Jiun Yang, Yen-Hwei Hsieh, Shun-Yao Yang, Jia-Wei Fang, Ta-Chang Liao, Tai-Yu Chen
  • Publication number: 20180173610
    Abstract: A code coverage processing method includes: receiving a source code; executing a program according to the source code, wherein the source code is categorized into basic blocks, and each line included in a same basic block is executed a same number of times; creating a line tracking file having a plurality of line tracking records for a plurality of lines of the source code, respectively, wherein each of the line tracking records indicates how many times a corresponding line in the source code has been executed; receiving a non-cared zone setting which indicates at least one of the basic blocks in the source code is selected as a part of a non-cared zone; computing a code coverage result of the source code according to the line tracking file and the non-cared zone setting; and providing the code coverage result.
    Type: Application
    Filed: December 19, 2016
    Publication date: June 21, 2018
    Inventors: Kuo-Cheng Lee, Yen-Hwei Hsieh