Abstract: A capacitive fingerprint sensor includes a plate, a frame, a capacitive fingerprint sensor chip and a package body. The plate comprises a first surface, an opposite second surface and a plurality of first conductive pads arranged on the first surface. A plurality of second conductive pads and third conductive pads are respectively arranged on opposite surfaces of the frame, wherein the second conductive pads are electrically connected with the corresponding first conductive pads and third conductive pads. The capacitive fingerprint sensor chip is disposed at the central area of the frame by a flip chip manner and electrically connected with the first conductive pads. The package body is filled in the central area of the frame to cover the chip. The above-mentioned sensor has a flat sensing surface with wear resistance and better ESD toleration. A package method of the above-mentioned sensor is also disclosed.

Abstract: A capacitive fingerprint sensor includes a compensation memory which stores a direct current offset parameter and a gain compensation parameter of each sensing unit of a capacitive sensing array. Therefore, the above-mentioned capacitive fingerprint sensor is able to individually compensate sensing signals measured by each the sensing unit and the sensing signals measured by each sensing unit have better uniformity and signal to noise ratio (SNR).

Abstract: A capacitive fingerprint sensor includes a compensation memory which stores a direct current offset parameter and a gain compensation parameter of each sensing unit of a capacitive sensing array. Therefore, the above-mentioned capacitive fingerprint sensor is able to individually compensate sensing signals measured by each the sensing unit and the sensing signals measured by each sensing unit have better uniformity and signal to noise ratio (SNR).

Abstract: A capacitive fingerprint sensor includes a plate, a frame, a capacitive fingerprint sensor chip and a package body. The plate comprises a first surface, an opposite second surface and a plurality of first conductive pads arranged on the first surface. A plurality of second conductive pads and third conductive pads are respectively arranged on opposite surfaces of the frame, wherein the second conductive pads are electrically connected with the corresponding first conductive pads and third conductive pads. The capacitive fingerprint sensor chip is disposed at the central area of the frame by a flip chip manner and electrically connected with the first conductive pads. The package body is filled in the central area of the frame to cover the chip. The above-mentioned sensor has a flat sensing surface with wear resistance and better ESD toleration. A package method of the above-mentioned sensor is also disclosed.