Patents by Inventor Yen-Kuan Lu

Yen-Kuan Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic Device
    Publication number: 20180364773
    Abstract: An electronic device includes a bottom plate, a heat pipe, a battery assembly, and a heat dissipation layer. The heat pipe is disposed along the bottom plate. The battery assembly is disposed on the bottom plate. The heat dissipation layer is disposed between the heat pipe and the bottom plate and extends between the battery assembly and the bottom plate.
    Type: Application
    Filed: August 28, 2017
    Publication date: December 20, 2018
    Inventors: Yen-Kuan Lu, Hui-Chi Hsu, Yu-Chun Wang