Abstract: A method for manufacturing a semiconductor structure includes: forming a semiconductor device on a main region of the device substrate, the device substrate having a peripheral region surrounding the main region; forming a first filling layer on the peripheral region of the device substrate; forming a second filling layer over the first filling layer and the semiconductor device after forming the first filling layer, the second filling layer having a polishing rate different from that of the first filling layer; performing a planarization process over the second filling layer to remove a portion of the second filling layer so that a remaining portion of the second filling layer has a planarized surface opposite to the device substrate; and bonding the device substrate to a carrier substrate through the first filling layer and the remaining portion of the second filling layer.

Abstract: A high-efficiency high step-up ratio direct current converter with an interleaved soft-switching mechanism is provided. The direct current converter includes a voltage-multiplier circuit and an active clamping circuit. The voltage-multiplier circuit includes two isolating transformers, two main switches disposed on a primary side of the two isolating transformers, four diodes disposed on a secondary side of the two isolating transformers and four capacitors disposed on the secondary side of two isolating transformers, configured to boost a voltage of a direct-current power to a desired voltage value. The active clamping circuit, electrically connected to the voltage-multiplier circuit, includes two active clamp switches and a clamp capacitor to lower a voltage surge of the two main switches so that the two main switches and the two active clamp switches can be soft switched on.

Abstract: A high-efficiency high step-up ratio direct current converter with an interleaved soft-switching mechanism is provided. The direct current converter includes a voltage-multiplier circuit and an active clamping circuit. The voltage-multiplier circuit includes two isolating transformers, two main switches disposed on a primary side of the two isolating transformers, four diodes disposed on a secondary side of the two isolating transformers and four capacitors disposed on the secondary side of two isolating transformers, configured to boost a voltage of a direct-current power to a desired voltage value. The active clamping circuit, electrically connected to the voltage-multiplier circuit, includes two active clamp switches and a clamp capacitor to lower a voltage surge of the two main switches so that the two main switches and the two active clamp switches can be soft switched on.

Abstract: A system for creating the learning organizational tool known as a concept map to thereby facilitate learning includes a manipulation-sensing device with a wireless data transceiver, an information integration platform, and a data processing device. The wireless manipulating-sensing device allows users to physically manipulate the concept map and then transmit/receive data related to the results of the physical manipulation via a wireless network. The wireless manipulation-sensing device includes a plurality of conceptual modules for recording data in the process of learning a concept map, a plurality of connecting modules for recording data of the connection relations between the conceptual modules, and a plurality of connecting wires connected between the plurality of conceptual modules and the plurality of connecting modules to form connection relations therebetween.

Abstract: A system for creating the learning organizational tool known as a concept map to thereby facilitate learning includes a manipulation-sensing device with a wireless data transceiver, an information integration platform, and a data processing device. The wireless manipulating-sensing device allows users to physically manipulate the concept map and then transmit/receive data related to the results of the physical manipulation via a wireless network. The wireless manipulation-sensing device includes a plurality of conceptual modules for recording data in the process of learning a concept map, a plurality of connecting modules for recording data of the connection relations between the conceptual modules, and a plurality of connecting wires connected between the plurality of conceptual modules and the plurality of connecting modules to form connection relations therebetween.