Patents by Inventor Yen-Liang Huang
Yen-Liang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942433Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.Type: GrantFiled: January 17, 2022Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang
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Publication number: 20240096609Abstract: The physical vapor deposition tool includes a magnet component, a single cathode, and a power circuit for biasing a pedestal that supports a semiconductor substrate. During a deposition operation that deposits an inert metal material, the physical vapor deposition tool may modulate an electromagnetic field emanating from the magnet component that includes spiral-shaped bands having different ranges of magnetic strength. The physical vapor deposition tool may have an increased throughput relative to a physical vapor deposition tool without the magnet component, the single cathode, and the power circuit. Additionally, or alternatively, the inert metal material may have a grain size that is greater relative to a grain size of an inert metal material deposited using the physical vapor deposition tool without the magnet component, the single cathode, and the power circuit.Type: ApplicationFiled: January 31, 2023Publication date: March 21, 2024Inventors: Yen-Liang LIN, Yu-Kang HUANG, Yu-Chuan TAI
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Patent number: 11935804Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.Type: GrantFiled: April 10, 2023Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
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Publication number: 20240088195Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Yu WEI, Yen-Liang LIN, Kuo-Cheng LEE, Hsun-Ying HUANG, Hsin-Chi CHEN
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Patent number: 11887928Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.Type: GrantFiled: December 17, 2021Date of Patent: January 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yung-Shun Chang, Sheng-Wen Yang, Teck-Chong Lee, Yen-Liang Huang
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Publication number: 20230197600Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.Type: ApplicationFiled: December 17, 2021Publication date: June 22, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yung-Shun CHANG, Sheng-Wen YANG, Teck-Chong LEE, Yen-Liang HUANG
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Patent number: 8952921Abstract: A capacitive touch display panel includes a display panel, a touch sensing unit, and a plurality of diode ESD protection devices. The touch sensing unit includes a plurality of first sensing pads and second sensing pads. Each diode ESD protection device is disposed between two adjacent first sensing pads and between two adjacent second sensing pads. The two adjacent first sensing pads are electrically disconnected from each other, and the two adjacent second sensing pads are electrically disconnected from each other.Type: GrantFiled: February 24, 2011Date of Patent: February 10, 2015Assignee: AU Optronics Corp.Inventors: Yen-Liang Huang, Wei-Hung Kuo, Chau-Shiang Huang, Tun-Chun Yang, Seok-Lyul Lee, Wei-Ming Huang
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Patent number: 8514200Abstract: A capacitive touch display panel includes a display panel, a touch sensing unit, and a plurality of floating gate type ESD protection devices. The touch sensing unit includes a plurality of first sensing pads and second sensing pads. Each floating gate type ESD protection device is disposed between two adjacent first sensing pads and between two adjacent second sensing pads. The two adjacent first sensing pads are electrically disconnected from each other, and the two adjacent second sensing pads are electrically disconnected from each other.Type: GrantFiled: April 26, 2010Date of Patent: August 20, 2013Assignee: AU Optronics Corp.Inventors: Yen-Liang Huang, Wei-Hung Kuo, Tun-Chun Yang, Seok-Lyul Lee, Wei-Ming Huang
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Publication number: 20110157084Abstract: A capacitive touch display panel includes a display panel, a touch sensing unit, and a plurality of diode ESD protection devices. The touch sensing unit includes a plurality of first sensing pads and second sensing pads. Each diode ESD protection device is disposed between two adjacent first sensing pads and between two adjacent second sensing pads. The two adjacent first sensing pads are electrically disconnected from each other, and the two adjacent second sensing pads are electrically disconnected from each other.Type: ApplicationFiled: February 24, 2011Publication date: June 30, 2011Inventors: Yen-Liang Huang, Wei-Hung Kuo, Chau-Shiang Huang, Tun-Chun Yang, Seok-Lyul Lee, Wei-Ming Huang
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Publication number: 20110157071Abstract: A capacitive touch display panel includes a display panel, a touch sensing unit, and a plurality of floating gate type ESD protection devices. The touch sensing unit includes a plurality of first sensing pads and second sensing pads. Each floating gate type ESD protection device is disposed between two adjacent first sensing pads and between two adjacent second sensing pads. The two adjacent first sensing pads are electrically disconnected from each other, and the two adjacent second sensing pads are electrically disconnected from each other.Type: ApplicationFiled: April 26, 2010Publication date: June 30, 2011Inventors: Yen-Liang Huang, Wei-Hung Kuo, Tun-Chun Yang, Seok-Lyul Lee, Wei-Ming Huang