Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A packing device for electrode sheets is provided in the present disclosure. The packing device is used for pasting tapes on a stack structure consisted of the electrode sheets to packing the stack structure. The packing device is included of a tape fetching mechanism, a couple of claws, a carrying mechanism and a positioning mechanism. The tape fetching mechanism is used for moving a tape and putting on the claws. The claws are arranged at interval and a gap is thereby formed between the claws. Each claw is included of a chamfer surface, and the chamfer surfaces are arranged at opposite sides of the gap. The carrying mechanism is used for loading the stack structure. The positioning mechanism is used to drive the claws and the carrying mechanism move related to each other.

Abstract: A packing device for electrode sheets is provided in the present disclosure. The packing device is used for pasting tapes on a stack structure consisted of the electrode sheets to packing the stack structure. The packing device is included of a tape fetching mechanism, a couple of claws, a carrying mechanism and a positioning mechanism. The tape fetching mechanism is used for moving a tape and putting on the claws. The claws are arranged at interval and a gap is thereby formed between the claws. Each claw is included of a chamfer surface, and the chamfer surfaces are arranged at opposite sides of the gap. The carrying mechanism is used for loading the stack structure. The positioning mechanism is used to drive the claws and the carrying mechanism move related to each other.