Patents by Inventor Yen-Lin Chu
Yen-Lin Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11564329Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.Type: GrantFiled: November 3, 2020Date of Patent: January 24, 2023Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Sheng-Huang Lin, Yen-Lin Chu
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Publication number: 20220141994Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.Type: ApplicationFiled: November 3, 2020Publication date: May 5, 2022Inventors: Sheng-Huang Lin, Yen-Lin Chu
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Publication number: 20200068745Abstract: A heat dissipation structure of electronic device includes a main body having a first heat pipe set and a second heat pipe set. The first heat pipe set includes at least one first heat pipe normal to the main body. A first thermal module and a first fan are disposed on the first heat pipe. The second heat pipe set includes at least one second heat pipe having a first section normal to the main body and a second section extending from the first section in parallel to the main body. A second thermal module and a second fan are disposed on the second section. The first fan creates a first airflow flowing through the first and second thermal modules in a first direction. The second fan creates a second airflow flowing through the second thermal module in a second direction.Type: ApplicationFiled: August 22, 2018Publication date: February 27, 2020Inventors: Sheng-Huang Lin, Yen-Lin Chu
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Patent number: 10021813Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.Type: GrantFiled: October 13, 2015Date of Patent: July 10, 2018Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Yuan-Yi Lin, Yen-Lin Chu
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Patent number: 9625218Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.Type: GrantFiled: January 15, 2015Date of Patent: April 18, 2017Assignee: Asia Vital Components Co., Ltd.Inventors: Sheng-Huang Lin, Yen-Lin Chu
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Publication number: 20170105316Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.Type: ApplicationFiled: October 13, 2015Publication date: April 13, 2017Inventors: Yuan-Yi Lin, Yen-Lin Chu
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Patent number: 9574830Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.Type: GrantFiled: March 26, 2012Date of Patent: February 21, 2017Assignee: Asia Vital Components Co., Ltd.Inventors: Sheng-Huang Lin, Yen-Lin Chu
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Publication number: 20150122456Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.Type: ApplicationFiled: January 15, 2015Publication date: May 7, 2015Applicant: Asia Vital Components Co., Ltd.Inventors: Sheng-Huang Lin, Yen-Lin Chu
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Patent number: 8931972Abstract: A thermal module mount structure including a first mount body and a second mount body. The first mount body defines therein a first passage and has multiple engaging sections inward extending into the first passage. The second mount body is disposed in the first passage and has multiple complementary engaging sections complementary to the engaging sections. Each of the complementary engaging sections has a moving space and multiple engaging splits in communication therewith. The second mount body is vertically displaceable within the first passage, whereby the first and second mount bodies can be relatively rotated to insert the engaging sections into the engaging splits at different heights. Accordingly, the height of the mount structure is changeable by means of adjusting the second mount body in accordance with different heights of radiating fins. Therefore, the mount structure has high commonness so that the cost for developing the molds is reduced.Type: GrantFiled: August 6, 2009Date of Patent: January 13, 2015Assignee: Asia Vital Components Co., Ltd.Inventor: Yen-Lin Chu
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Publication number: 20130248145Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.Type: ApplicationFiled: March 26, 2012Publication date: September 26, 2013Inventors: Sheng-Huang Lin, Yen-Lin Chu
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Publication number: 20110030919Abstract: A thermal module mount structure including a first mount body and a second mount body. The first mount body defines therein a first passage and has multiple engaging sections inward extending into the first passage. The second mount body is disposed in the first passage and has multiple complementary engaging sections complementary to the engaging sections. Each of the complementary engaging sections has a moving space and multiple engaging splits in communication therewith. The second mount body is vertically displaceable within the first passage, whereby the first and second mount bodies can be relatively rotated to insert the engaging sections into the engaging splits at different heights. Accordingly, the height of the mount structure is changeable by means of adjusting the second mount body in accordance with different heights of radiating fins. Therefore, the mount structure has high commonness so that the cost for developing the molds is reduced.Type: ApplicationFiled: August 6, 2009Publication date: February 10, 2011Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventor: Yen-Lin Chu
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Patent number: 6998534Abstract: A partition structure of in a computer casing provides a partition with two guide grooves and a joining member with two engaging parts corresponding to the guide grooves respectively. Each of the guide grooves has an upper opening, a locating part and a lower opening respectively for engaging with engaging parts of the joining member. One of the guide grooves is shorter and the upper opening and the lower opening 322c are wider than rest part in the respective guide groove for facilitating the joining member 23 being assembled to or disassembled from the partition 32 handily.Type: GrantFiled: October 20, 2004Date of Patent: February 14, 2006Assignee: Asia Vital Component Co., LTDInventor: Yen-Lin Chu