Patents by Inventor YEN-LIN TSENG

YEN-LIN TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240180492
    Abstract: A signal transmitting element is used to solve the problem that an additional surgery is required to remove the conventional vascular monitoring element after completing the detecting task. The signal transmitting element comprises a body made of a specific biodegradable material. The body includes a signal sensing portion including a structure configured to sense a blood flow information of a blood vessel surrounded and contacted by the body, thereby generating a blood vessel signal; and a signal transmitting portion coupled with the signal sensing portion for receiving the blood vessel signal and including a specific structure configured to convert the blood vessel signal into a transmission signal.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Chun-Chieh Tseng, Chun-Ming Chen, Tung-Lin Tsai, Yen-Hao Chang, Shu-Hung Huang, Sheng-Hua Wu, Yen-Hsin Kuo, Ping-Ruey Chou
  • Publication number: 20240181127
    Abstract: A bone substitute composition includes a bone substitute matrix and a conditioning solution. The bone substitute matrix includes 85% to 98% by weight of alkaline calcium phosphate powder, 1% to 10% by weight of a polymer, and 1% to 5% by weight of a crosslinker. The conditioning solution includes 90% to 97% by weight of water, 1% to 5% by weight of a phosphate, and 1% to 5% by weight of a water-soluble acidic compound.
    Type: Application
    Filed: March 20, 2023
    Publication date: June 6, 2024
    Inventors: Kuan-Yu CHIU, Yen-Hao CHANG, Chun-Chieh TSENG, Tung-Lin TSAI, Chun-Ming CHEN, Yue-Jun WANG, Tzyy-Ker SUE
  • Patent number: 9480960
    Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: November 1, 2016
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yen-Feng Shih, Yi-Hsiuan Yu, Yen-Lin Tseng, Hou-An Hsieh
  • Publication number: 20160151757
    Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 2, 2016
    Inventors: YEN-FENG SHIH, YI-HSIUAN YU, YEN-LIN TSENG, HOU-AN HSIEH