Abstract: The present invention relates to a composite laminate plate, a housing and a mobile communication device. The composite laminate includes a top metal layer with a through hole and an array antenna, and an area ratio of the array antenna to the through hole meets a specific range, thereby enhancing wave transmissivity of a millimeter wave. Moreover, the composite laminate has a specific material structure, such that it has good mechanical properties and low density. The housing and the mobile communication device made by the composite laminate have advantages of metallic texture, high signal intensity and excellent effect for light weight tendency.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor die and surrounding a sidewall of the semiconductor die with a dielectric material. The method further includes forming a post passivation interconnect (PPI) over the semiconductor die and electrically coupling the PPI with the semiconductor die. The method further includes molding the semiconductor die and the PPI into an integrated semiconductor package. The method further includes covering at least a portion of an outer surface of the integrated semiconductor package with a conductive layer, wherein the conductive layer is conformal to the morphology of the portion of the outer surface. Moreover, the method further includes forming a conductive path inside the integrated semiconductor package electrically coupled to the conductive layer and a ground terminal of the integrated semiconductor package.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.

Abstract: An epitaxial structure includes a first type semiconductor layer, an active layer, a second type semiconductor layer, and a lattice mismatch layer. The first type semiconductor layer includes a material of aluminum gallium indium phosphide. The active layer is disposed on a side of the first type semiconductor layer. The second semiconductor layer is disposed on a side of the active layer away from the first type semiconductor layer, and includes the material of aluminum gallium indium phosphide. The lattice mismatch layer includes the material of aluminum gallium indium phosphide and is disposed on any side of the first type semiconductor layer, the active layer, or the second type semiconductor layer. In an X-ray diffractometer analysis spectrum, at least one of the first type semiconductor layer, the active layer and the second type semiconductor layer corresponds to a main diffractive peak, the lattice mismatch layer has a secondary diffractive peak.

Abstract: A semiconductor device with different configurations of contact structures and a method of fabricating the same are disclosed. The semiconductor device includes first and second gate structures disposed on first and second fin structures, first and second source/drain (S/D) regions disposed on the first and second fin structures, first and second contact structures disposed on the first and second S/D regions, and a dipole layer disposed at an interface between the first nWFM silicide layer and the first S/D region. The first contact structure includes a first nWFM silicide layer disposed on the first S/D region and a first contact plug disposed on the first nWFM silicide layer. The second contact structure includes a pWFM silicide layer disposed on the second S/D region, a second nWFM silicide layer disposed on the pWFM silicide layer, and a second contact plug disposed on the pWFM silicide layer.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor die and surrounding a sidewall of the semiconductor die with a dielectric material. The method further includes forming a post passivation interconnect (PPI) over the semiconductor die and electrically coupling the PPI with the semiconductor die. The method further includes molding the semiconductor die and the PPI into an integrated semiconductor package. The method further includes covering at least a portion of an outer surface of the integrated semiconductor package with a conductive layer, wherein the conductive layer is conformal to the morphology of the portion of the outer surface. Moreover, the method further includes forming a conductive path inside the integrated semiconductor package electrically coupled to the conductive layer and a ground terminal of the integrated semiconductor package.

Abstract: A semiconductor device with different configurations of contact structures and a method of fabricating the same are disclosed. The semiconductor device includes first and second gate structures disposed on first and second fin structures, first and second source/drain (S/D) regions disposed on the first and second fin structures, first and second contact structures disposed on the first and second S/D regions, and a dipole layer disposed at an interface between the first nWFM silicide layer and the first S/D region. The first contact structure includes a first nWFM silicide layer disposed on the first S/D region and a first contact plug disposed on the first nWFM silicide layer. The second contact structure includes a pWFM silicide layer disposed on the second S/D region, a second nWFM silicide layer disposed on the pWFM silicide layer, and a second contact plug disposed on the pWFM silicide layer.

Abstract: An information handling system may include a chassis and a variable venting assembly comprising a wall having a plurality of spaced venting holes and an adjustable venting block mechanically coupled to the wall via an axis of rotation and having a plurality of spaced blocking fins such that as a position of the adjustable venting block varies, an overlap between the spaced blocking fins and the spaced venting holes varies.

Abstract: An information handling system may include a chassis and a variable venting assembly comprising a wall having a plurality of spaced venting holes and an adjustable venting block mechanically coupled to the wall via an axis of rotation and having a plurality of spaced blocking fins such that as a position of the adjustable venting block varies, an overlap between the spaced blocking fins and the spaced venting holes varies.

Abstract: In accordance with embodiments of the present disclosure, a latch may include a pivoting member and a leaf-spring member. The pivoting member may be configured to rotatably couple the latch to a chassis such that the latch may rotate between a first position and a second position relative to the chassis. The leaf-spring feature may be shaped and arranged in order to, as the latch is rotated between the first position and the second position, apply a mechanical force to a first circuit board to mate a first connector of the first circuit board to a second connector of a second circuit board.

Abstract: An air baffle for directing air within an information handling system is disclosed. The air baffle includes an open region configured to permit passage of an airflow, a closed region configured to obstruct passage of the airflow, and a variable region between the open region and the closed region. The air baffle further includes an adjustable tab configured to obstruct passage of the airflow. The variable region is configured to permit and obstruct passage of the airflow based on a position of the adjustable tab with respect to the variable region.

Abstract: An air baffle for directing air within an information handling system is disclosed. The air baffle includes an open region configured to permit passage of an airflow, a closed region configured to obstruct passage of the airflow, and a variable region between the open region and the closed region. The air baffle further includes an adjustable tab configured to obstruct passage of the airflow. The variable region is configured to permit and obstruct passage of the airflow based on a position of the adjustable tab with respect to the variable region.

Abstract: In accordance with embodiments of the present disclosure, a latch may include a pivoting member and a leaf-spring member. The pivoting member may be configured to rotatably couple the latch to a chassis such that the latch may rotate between a first position and a second position relative to the chassis. The leaf-spring feature may be shaped and arranged in order to, as the latch is rotated between the first position and the second position, apply a mechanical force to a first circuit board to mate a first connector of the first circuit board to a second connector of a second circuit board.

Abstract: In one embodiment, a system comprises a bar and a baffle. The bar is connected to a frame through a plurality of holes in a board. The baffle is connected to the bar and is configured to direct air to components on the board. One or more fasteners may be used to connect the bar and the baffle.

Abstract: An electronic device includes a base and an adjustment mechanism including an elevating member, a first elastic member, a moveable member and a damper. The elevating member has a plurality of grooves, and is moveably disposed on the base. The elastic member connects the elevating member and the base. The moveable member has an engaging portion, and is moveable between a first position and a second position. The damper connects with the elevating member to limit speed of the elevating member. When the moveable member is in the first position, the engaging portion is engaged with one of the grooves. When the moveable member is in the second position, the engaging portion is disengaged from the engaged groove so that the elevating member is moveable with respect to the base so as to adjust the height of the electronic device.

Abstract: A lamp assembly and an air guide plate thereof. The lamp assembly and the air guide plate are positioned in a projector. The lamp assembly comprises a base with a bottom portion and an opening, and a lamp with a bulb disposed at the bottom portion in a manner such that it extends toward the opening. The air guide plate comprises a body, a first guide portion, a second guide portion, and a third guide portion. The first guide portion substantially extends between the bulb and the bottom portion. The second guide portion substantially extends toward the bulb. The third guide portion substantially extends between the bulb and the opening.

Abstract: An optical assembly includes a barrel including a slot, a lens installed inside the barrel for magnifying an image, a magnification-adjusting mechanism installed outside and around the barrel including an adjusting loop installed outside the barrel in a rotatable manner including a groove on a side facing the barrel, and a roller installed between the adjusting loop and the barrel. The optical machine further includes a rod for adjusting the magnification of the lens. One end of the rod is installed inside the slot of the barrel in a slidable manner, and another end of the rod is installed inside the groove of the adjusting loop in a slidable manner.

Abstract: An adjusting device for a projector lens comprises a seat bearing a lens, a shaft connected to the seat which moving on the shaft to adjust lens positions when the shaft rotates, a first gear pivoted on the shaft, a second gear engaging the first gear, a motor rotating the second gear, and an torque limiter joined to the first gear and the shaft. The motor rotates the shaft via the first and second gears. When the torque rotating the shaft exceeds a predetermined value, the torque limiter releases the first gear from the shaft enabling the first gear to rotate relative to the shaft to intercept the torque transmitted from the motor to the shaft.

Abstract: An optical assembly includes a barrel including a slot, a lens installed inside the barrel for magnifying an image, a magnification-adjusting mechanism installed outside and around the barrel including an adjusting loop installed outside the barrel in a rotatable manner including a groove on a side facing the barrel, and a roller installed between the adjusting loop and the barrel. The optical machine further includes a rod for adjusting the magnification of the lens. One end of the rod is installed inside the slot of the barrel in a slidable manner, and another end of the rod is installed inside the groove of the adjusting loop in a slidable manner.