Patents by Inventor Yen-Ling Liu

Yen-Ling Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250178049
    Abstract: Methods are disclosed for delivering a remedial amendment to a target site. An amendment, potentially along with a binder and/or a disintegrant, may be agglomerated into several agglomerates. These agglomerates may maintain their agglomerated form when transported to a target site. Once the agglomerates have arrived, they may disintegrate in the soil via moisture activation, agitation, or both. When the agglomerates have disintegrated, the amendment may disperse and be delivered to the soil, whereafter the amendment can treat any contaminants in the target site. By delivering the amendment in this manner, one can mitigate dust scattering throughout the surrounding environment.
    Type: Application
    Filed: November 20, 2024
    Publication date: June 5, 2025
    Inventors: Paul R. Erickson, Chase Hartsell, Yen-Ling Liu
  • Publication number: 20230364660
    Abstract: Methods of treating soil contained in a volume of treatment in an underground site and forming a containment barrier within an underground site are contemplated herein. A treatment methodology may be administered upon soil having previously been contained in the volume of treatment. Such a treatment methodology may include the application of an adsorbent to this soil. A layer of micron-sized adsorbents may also be placed on one or more interfaces surrounding the volume of treatment to form a containment barrier operative to mitigate diffusion of contaminants into or from the volume of treatment. Soil in the volume of treatment may be removed to allow for the methods contemplated herein to be performed more simply and effectively. The volume of treatment may then be refilled with a filler.
    Type: Application
    Filed: May 4, 2023
    Publication date: November 16, 2023
    Inventors: Kristen A. Thoreson, Paul R. Erickson, Steve Barnes, Yen-Ling Liu
  • Patent number: 9873133
    Abstract: An extrusion device includes a container, a pump, a plurality of pipes, and an adjustment device. The container has a chamber, and a first inlet/outlet and a second inlet/outlet connected to the chamber, wherein the chamber is adapted to contain a fluid inside. The pipes are connected between the pump and the first and second inlet/outlets of the container, so as to form a fluid loop. The pump is adapted to drive the fluid to flow inside the fluid loop. The adjustment device is coupled to the container for adjusting a volume of the chamber. Further, a coating system is also provided.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: January 23, 2018
    Assignee: Creating Nano Technologies, Inc.
    Inventors: Yi-Ming Hsu, Yen-Ling Liu, Li-Min Wang, Chien-Cheng Wang, Wen-Hsiao Shen
  • Patent number: 9817219
    Abstract: An infinity mirror includes a light-transmissible and reflective layer, a reflective layer, a light-transmissible layer and at least one light-emitting element. The light-transmissible and reflective layer is disposed on a top surface of the light-transmissible layer. The reflective layer is disposed on a bottom surface of the light-transmissible layer. The at least one light-emitting element emits a light beam. The light-transmissible layer includes a pattern zone and a non-pattern zone. There is a height difference between the pattern zone and the non-pattern zone of the light-transmissible layer. The infinity mirror can provide a multi-mirror image effect.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: November 14, 2017
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: An-Chih Wu, Mu-Shu Fan, Chie-Sheng Lim, Yen-Ling Liu
  • Publication number: 20170315338
    Abstract: An infinity mirror includes a light-transmissible and reflective layer, a reflective layer, a light-transmissible layer and at least one light-emitting element. The light-transmissible and reflective layer is disposed on a top surface of the light-transmissible layer. The reflective layer is disposed on a bottom surface of the light-transmissible layer. The at least one light-emitting element emits a light beam. The light-transmissible layer includes a pattern zone and a non-pattern zone. There is a height difference between the pattern zone and the non-pattern zone of the light-transmissible layer. The infinity mirror can provide a multi-mirror image effect.
    Type: Application
    Filed: June 1, 2016
    Publication date: November 2, 2017
    Inventors: AN-CHIH WU, MU-SHU FAN, CHIE-SHENG LIM, YEN-LING LIU
  • Patent number: 9766286
    Abstract: A method for diagnosing a defect is provided. A first candidate pair comprises a first defect candidate and a second defect candidate. A first pattern is generated to distinguish one or more faults of the first defect candidate from one or more faults of the second defect candidate. The first defect candidate is removed responsive to determining that the first pattern does not detect the first defect candidate and determining that an automatic test equipment (ATE) failure log associates the first pattern with failure. Removing the first candidate pair, as well as additional candidate pairs when possible, promotes diagnosis efficiency by reducing a number of computations required.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: September 19, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Kuen-Jong Lee, Cheng-Hung Wu, Wei-Cheng Lien, Hui-Ling Lin, Yen-Ling Liu, Ji-Jan Chen
  • Patent number: 9714979
    Abstract: A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within a beam. The method further includes converting, with a number of diodes connected to a positive voltage supply, an electrical current signal created by the electron beam to a voltage signal, wherein the number of diodes includes a diode stack of multiple diodes. The method further includes extracting, with a digital inverter, a test signal from the voltage signal.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: July 25, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Bo-Jr Huang, Nan-Hsin Tseng, Yen-Ling Liu
  • Publication number: 20160356845
    Abstract: A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within a beam. The method further includes converting, with a number of diodes connected to a positive voltage supply, an electrical current signal created by the electron beam to a voltage signal, wherein the number of diodes includes a diode stack of multiple diodes. The method further includes extracting, with a digital inverter, a test signal from the voltage signal.
    Type: Application
    Filed: August 22, 2016
    Publication date: December 8, 2016
    Inventors: Bo-Jr Huang, Nan-Hsin Tseng, Yen-Ling Liu
  • Patent number: 9423452
    Abstract: A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within an electron beam, converting an electrical current created by the e-beam to a voltage with a number of diodes connected to a positive voltage supply, extracting a digital test signal from the voltage signal with a digital inverter, and passing the test signal to digital circuitry within the integrated circuit.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: August 23, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Bo-Jr Huang, Nan-Hsin Tseng, Yen-Ling Liu
  • Patent number: 9414140
    Abstract: An electronic device includes a case, a speaker, a supporting stand, and a waterproof breathable membrane. The case includes a first inner space and a through hole connected to the first inner space. The speaker is disposed in the first inner space, and produces sound waves outwards from the through hole. The supporting stand connects the case to cover the through hole. The supporting stand includes a sound hole and a second inner space connected to the sound hole and the through hole. The waterproof breathable membrane covers one of the sound hole and the through hole.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: August 9, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shing-Da Wang, Chih-Wen Chiang, Chang-Yuan Wu, Yi-Chang Wu, Hsin-Chih Hsiao, Yen-Ling Liu, Chien-Chu Chen
  • Patent number: 9310431
    Abstract: The present disclosure relates to a diagnosis framework to shorten yield learning cycles of technology node manufacturing processes from the high defect density stage to technology maturity. A plurality of defect under test (DUT) structures are designed to capture potential manufacturing issues associated with defect formation. A test structure is formed by arranging the DUT structures within a DUT carrier unit, which has been yield-hardened though heuristic yield analysis such that a defect density of the DUT carrier unit is essentially zero. Possible outcomes of an application of test patterns and various failure scenarios associated with defects formed within the DUT structures within the DUT carrier unit are simulated and stored in a look-up table (LUT). The LUT may then be referenced to determine a location of a defect within the test structure without the need for iterative analysis to correctly select defect candidates for physical failure analysis (PFA).
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: April 12, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Ling Liu, Nan-Hsin Tseng, Ji-Jan Chen, Wei-Pin Changchien, Samuel C. Pan
  • Publication number: 20160055631
    Abstract: A method for diagnosing a defect is provided. A first candidate pair comprises a first defect candidate and a second defect candidate. A first pattern is generated to distinguish one or more faults of the first defect candidate from one or more faults of the second defect candidate. The first defect candidate is removed responsive to determining that the first pattern does not detect the first defect candidate and determining that an automatic test equipment (ATE) failure log associates the first pattern with failure. Removing the first candidate pair, as well as additional candidate pairs when possible, promotes diagnosis efficiency by reducing a number of computations required.
    Type: Application
    Filed: August 20, 2014
    Publication date: February 25, 2016
    Inventors: Kuen-Jong Lee, Cheng-Hung Wu, Wei-Cheng Lien, Hui-Ling Lin, Yen-Ling Liu, Ji-Jan Chen
  • Patent number: 9242426
    Abstract: A composite plate structure including a fiber composite sheet, a metal layer, and a resin layer is provided. The fiber composite sheet includes a first fiber layer, a core layer, and a second fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer. The metal layer is disposed on the fiber composite sheet and has at least one opening. A portion of the second fiber layer is located in the opening. The resin layer is disposed on the metal layer. In addition, a manufacturing method of the composite plate structure is also provided.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: January 26, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang, Chih-Wen Chiang, Yen-Ling Liu
  • Publication number: 20150361000
    Abstract: A method and an apparatus for manufacturing a glass structure are described, which includes the following steps. A glass substrate is provided. A ceramic precursor layer is formed to cover a surface of the glass substrate. A laser annealing treatment is performed on the ceramic precursor layer to crystallize the ceramic precursor layer into a ceramic film.
    Type: Application
    Filed: October 20, 2014
    Publication date: December 17, 2015
    Inventors: Yih-Ming SHYU, Yen-Ling LIU, Chien-Jen HSIAO
  • Publication number: 20150360251
    Abstract: An extrusion device includes a container, a pump, a plurality of pipes, and an adjustment device. The container has a chamber, and a first inlet/outlet and a second inlet/outlet connected to the chamber, wherein the chamber is adapted to contain a fluid inside. The pipes are connected between the pump and the first and second inlet/outlets of the container, so as to form a fluid loop. The pump is adapted to drive the fluid to flow inside the fluid loop. The adjustment device is coupled to the container for adjusting a volume of the chamber. Further, a coating system is also provided.
    Type: Application
    Filed: October 8, 2014
    Publication date: December 17, 2015
    Inventors: Yi-Ming Hsu, Yen-Ling Liu, Li-Min Wang, Chien-Cheng Wang, Wen-Hsiao Shen
  • Publication number: 20150153407
    Abstract: A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within an electron beam, converting an electrical current created by the e-beam to a voltage with a number of diodes connected to a positive voltage supply, extracting a digital test signal from the voltage signal with a digital inverter, and passing the test signal to digital circuitry within the integrated circuit.
    Type: Application
    Filed: December 3, 2013
    Publication date: June 4, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Bo-Jr Huang, Nan-Hsin Tseng, Yen-Ling Liu
  • Publication number: 20140161293
    Abstract: An electronic device includes a case, a speaker, a supporting stand, and a waterproof breathable membrane. The case includes a first inner space and a through hole connected to the first inner space. The speaker is disposed in the first inner space, and produces sound waves outwards from the through hole. The supporting stand connects the case to cover the through hole. The supporting stand includes a sound hole and a second inner space connected to the sound hole and the through hole. The waterproof breathable membrane covers one of the sound hole and the through hole.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 12, 2014
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Shing-Da WANG, Chih-Wen CHIANG, Chang-Yuan WU, Yi-Chang WU, Hsin-Chih HSIAO, Yen-Ling LIU, Chien-Chu CHEN
  • Publication number: 20140049281
    Abstract: The present disclosure relates to a diagnosis framework to shorten yield learning cycles of technology node manufacturing processes from the high defect density stage to technology maturity. A plurality of defect under test (DUT) structures are designed to capture potential manufacturing issues associated with defect formation. A test structure is formed by arranging the DUT structures within a DUT carrier unit, which has been yield-hardened though heuristic yield analysis such that a defect density of the DUT carrier unit is essentially zero. Possible outcomes of an application of test patterns and various failure scenarios associated with defects formed within the DUT structures within the DUT carrier unit are simulated and stored in a look-up table (LUT). The LUT may then be referenced to determine a location of a defect within the test structure without the need for iterative analysis to correctly select defect candidates for physical failure analysis (PFA).
    Type: Application
    Filed: August 17, 2012
    Publication date: February 20, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Ling Liu, Nan-Hsin Tseng, Ji-Jan Chen, Wei-Pin Changchien, Samuel C. Pan
  • Publication number: 20130108830
    Abstract: A composite plate structure including a fiber composite sheet, a metal layer, and a resin layer is provided. The fiber composite sheet includes a first fiber layer, a core layer, and a second fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer. The metal layer is disposed on the fiber composite sheet and has at least one opening. A portion of the second fiber layer is located in the opening. The resin layer is disposed on the metal layer. In addition, a manufacturing method of the composite plate structure is also provided.
    Type: Application
    Filed: October 18, 2012
    Publication date: May 2, 2013
    Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang, Chih-Wen Chiang, Yen-Ling Liu