Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.

Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, molded articles, adhesives and coatings.

Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.

Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.

Abstract: The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.

Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.

Abstract: The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications.

Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.

Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.

Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.

Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.

Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.

Abstract: The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.