Patents by Inventor Yen-Lu Chen

Yen-Lu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inverted-T shaped via for reducing adverse stress-migration effects
    Patent number: 9905509
    Abstract: A semiconductor interconnect structure is formed as a via with an inverted-T shape to increase the reliability of the interface between the interconnect structure and an underlying electrically conductive, e.g., copper (Cu), layer of material. The inverted-T shape effectively increases a bottom critical dimension of the via, thereby reducing and/or eliminating via degradation of the interconnect structure caused by voids in the electrically conductive layer introduced during high-temperature or stress-migration baking.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: February 27, 2018
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Yen-Lu Chen, Shih-Ping Hong, Ta Hung Yang
  • INVERTED-T SHAPED VIA FOR REDUCING ADVERSE STRESS-MIGRATION EFFECTS
    Publication number: 20160027729
    Abstract: A semiconductor interconnect structure is formed as a via with an inverted-T shape to increase the reliability of the interface between the interconnect structure and an underlying electrically conductive, e.g., copper (Cu), layer of material. The inverted-T shape effectively increases a bottom critical dimension of the via, thereby reducing and/or eliminating via degradation of the interconnect structure caused by voids in the electrically conductive layer introduced during high-temperature or stress-migration baking.
    Type: Application
    Filed: July 25, 2014
    Publication date: January 28, 2016
    Inventors: Yen-Lu Chen, Shih-Ping Hong, Ta Hung Yang