Patents by Inventor Yen-Lung Chen

Yen-Lung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240387586
    Abstract: One or more semiconductor processing tools may deposit a contact etch stop layer on a substrate. In some implementations, the contact etch stop layer is comprised of less than approximately 12 percent hydrogen. Depositing the contact etch stop layer may include depositing contact etch stop layer material at a temperature of greater than approximately 600 degrees Celsius, at a pressure of greater than approximately 150 torr, and/or with a ratio of at least approximately 70:1 of NH3 and SiH4, among other examples. The one or more semiconductor processing tools may deposit a silicon-based layer above the contact etch stop layer. The one or more semiconductor processing tools may perform an etching operation into the silicon-based layer until reaching the contact etch stop layer to form a trench isolation structure.
    Type: Application
    Filed: July 26, 2024
    Publication date: November 21, 2024
    Inventors: Cheng-Hsien CHEN, Yung-Hsiang CHEN, Chia Hao LI, Yu-Lung YEH, Yen-Hsiu CHEN
  • Patent number: 12142668
    Abstract: In an embodiment, a structure includes: a semiconductor substrate; a fin extending from the semiconductor substrate; a gate stack over the fin; an epitaxial source/drain region in the fin adjacent the gate stack; and a gate spacer disposed between the epitaxial source/drain region and the gate stack, the gate spacer including a plurality of silicon oxycarbonitride layers, each of the plurality of silicon oxycarbonitride layers having a different concentration of silicon, a different concentration of oxygen, a different concentration of carbon, and a different concentration of nitrogen.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: November 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Chih Lin, Yen-Ting Chen, Wen-Kai Lin, Szu-Chi Yang, Shih-Hao Lin, Tsung-Hung Lee, Ming-Lung Cheng
  • Publication number: 20240371680
    Abstract: A semiconductor arrangement includes an isolation structure having a first electrical insulator layer in a trench in a semiconductor substrate and a second electrical insulator layer in the trench and over the first electrical insulator layer.
    Type: Application
    Filed: July 19, 2024
    Publication date: November 7, 2024
    Inventors: Wei-Liang CHEN, Cheng-Hsien CHEN, Yu-Lung YEH, Chuang CHIHCHOUS, Yen-Hsiu CHEN
  • Publication number: 20240347377
    Abstract: Various embodiments of the present application are directed to a method for forming a semiconductor-on-insulator (SOI) device with an impurity competing layer to absorb potential contamination metal particles during an annealing process, and the SOI structure thereof. In some embodiments, an impurity competing layer is formed on the dummy substrate. An insulation layer is formed over a support substrate. A front side of the dummy wafer is bonded to the insulation layer. An annealing process is performed and the impurity competing layer absorbs metal from an upper portion of the dummy substrate. Then, a majority portion of the dummy substrate is removed including the impurity competing layer, leaving a device layer of the dummy substrate on the insulation layer.
    Type: Application
    Filed: June 26, 2024
    Publication date: October 17, 2024
    Inventors: Yu-Hung Cheng, Pu-Fang Chen, Cheng-Ta Wu, Po-Jung Chiang, Ru-Liang Lee, Victor Y. Lu, Yen-Hsiu Chen, Yeur-Luen Tu, Yu-Lung Yeh, Shi-Chieh Lin
  • Publication number: 20240347571
    Abstract: A semiconductor device is provided. The semiconductor device includes a first deep trench isolation (DTI) structure within a substrate. The first DTI structure includes a barrier structure, a dielectric structure, and a copper structure. The dielectric structure is between the barrier structure and the copper structure. The barrier structure is between the substrate and the dielectric structure.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 17, 2024
    Inventors: Yung-Hsiang CHEN, Yu-Lung YEH, Yen-Hsiu CHEN, Bo-Chang SU, Cheng-Hsien CHEN
  • Patent number: 12114412
    Abstract: A method for monitoring a shock wave in an extreme ultraviolet light source includes irradiating a target droplet in the extreme ultraviolet light source apparatus of an extreme ultraviolet lithography tool with ionizing radiation to generate a plasma and to detect a shock wave generated by the plasma. One or more operating parameters of the extreme ultraviolet light source is adjusted based on the detected shock wave.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: October 8, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Shuo Su, Jen-Hao Yeh, Jhan-Hong Yeh, Ting-Ya Cheng, Henry Yee Shian Tong, Chun-Lin Chang, Han-Lung Chang, Li-Jui Chen, Po-Chung Cheng
  • Publication number: 20240329678
    Abstract: The present disclosure discloses a low dropout regulator apparatus having noise-suppression mechanism. An operational amplifier circuit includes a differential input circuit, an amplifying output circuit and a first and a second resistive components. The differential input circuit is coupled between first connection nodes and a ground terminal to receive a reference voltage and a feedback voltage. The amplifying output circuit includes a first and a second transistor pair circuits. The first transistor pair circuit is coupled between a power supply and second connection nodes. The second transistor pair is coupled between the second connection nodes and the ground terminal and has an amplifying output terminal generating an amplified voltage. The first and the second resistive components are coupled between the first and the second connection nodes.
    Type: Application
    Filed: March 18, 2024
    Publication date: October 3, 2024
    Inventors: YEN-PO LAI, Chih-Lung Chen, Yi Feng
  • Patent number: 12094756
    Abstract: A semiconductor arrangement includes an isolation structure having a first electrical insulator layer in a trench in a semiconductor substrate and a second electrical insulator layer in the trench and over the first electrical insulator layer.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: September 17, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Wei-Liang Chen, Cheng-Hsien Chen, Yu-Lung Yeh, Chuang Chihchous, Yen-Hsiu Chen
  • Patent number: 12046615
    Abstract: A semiconductor device is provided. The semiconductor device includes a first deep trench isolation (DTI) structure within a substrate. The first DTI structure includes a barrier structure, a dielectric structure, and a copper structure. The dielectric structure is between the barrier structure and the copper structure. The barrier structure is between the substrate and the dielectric structure.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: July 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Yung-Hsiang Chen, Yu-Lung Yeh, Yen-Hsiu Chen, Bo-Chang Su, Cheng-Hsien Chen
  • Patent number: 12040221
    Abstract: Various embodiments of the present application are directed to a method for forming a semiconductor-on-insulator (SOI) device with an impurity competing layer to absorb potential contamination metal particles during an annealing process, and the SOI structure thereof. In some embodiments, an impurity competing layer is formed on the dummy substrate. An insulation layer is formed over a support substrate. A front side of the dummy wafer is bonded to the insulation layer. An annealing process is performed and the impurity competing layer absorbs metal from an upper portion of the dummy substrate. Then, a majority portion of the dummy substrate is removed including the impurity competing layer, leaving a device layer of the dummy substrate on the insulation layer.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: July 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hung Cheng, Pu-Fang Chen, Cheng-Ta Wu, Po-Jung Chiang, Ru-Liang Lee, Victor Y. Lu, Yen-Hsiu Chen, Yeur-Luen Tu, Yu-Lung Yeh, Shi-Chieh Lin
  • Publication number: 20240210610
    Abstract: A backlight module includes the following features. A light guide plate has a viewing angle convergence structure, a light-incident surface and a surface connected to the light-incident surface. The viewing angle convergence structure is located at the surface. The prism plate has first prism columns and second prism columns disposed cross to each other. The inverse prism plate has third prism columns respectively having a first side surface and a second side surface. The first side surface and the second side surface are connected to each other and are respectively connected to the second surface. The first side surface faces a side of the backlight module with the light-emitting element, and the second side surface faces away from the side. An included angle between the first side surface and the second surface is larger than an included angle between the second side surface and the second surface.
    Type: Application
    Filed: June 16, 2023
    Publication date: June 27, 2024
    Inventors: HSIANG-I HU, Yen-Lung Chen, YU-HUAN CHIU
  • Patent number: 12019265
    Abstract: A backlight module includes the following features. A light guide plate has a viewing angle convergence structure, a light-incident surface and a surface connected to the light-incident surface. The viewing angle convergence structure is located at the surface. The prism plate has first prism columns and second prism columns disposed cross to each other. The inverse prism plate has third prism columns respectively having a first side surface and a second side surface. The first side surface and the second side surface are connected to each other and are respectively connected to the second surface. The first side surface faces a side of the backlight module with the light-emitting element, and the second side surface faces away from the side. An included angle between the first side surface and the second surface is larger than an included angle between the second side surface and the second surface.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: June 25, 2024
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Hsiang-I Hu, Yen-Lung Chen, Yu-Huan Chiu
  • Publication number: 20240126001
    Abstract: A switchable backlight module is disclosed. The switchable backlight module includes two light source modules arranged parallelly with respect to a plane. Each of the light source modules includes a turning film and a LGP. The LGP is of an edge-lit type arranged parallelly under the turning film. A light ray enters the LGP from a light incident side of the LGP, exits the LGP from a light emergent surface of the LGP, enters the turning film, and exits the turning film from a surface of the turning film away from the LGP. The light incident side of the LGP of one of the light source modules is perpendicular to the light incident side of the LGP of the other light source module. The switchable backlight module is in an anti-peeping mode having a narrow viewing angle when only an upper one of the light source modules emits light.
    Type: Application
    Filed: July 19, 2023
    Publication date: April 18, 2024
    Inventors: YU-HUAN CHIU, CHIEN-WEI LIAO, YEN-LUNG CHEN
  • Patent number: 11940645
    Abstract: A front light module includes a reflective display device, a front light guide, and a light emitting unit plate. The front light guide plate includes a micro-structure. The micro-structure has a first angle between a surface thereof close to the light emitting unit and an upper surface of the front light guide plate. The micro-structure has a second angle between a surface thereof away from the light emitting unit and the upper surface of the front light guide plate. The micro-structure has a third angle between the surface thereof close to the light emitting unit and the surface thereof away from the light emitting unit. The first angle is within a range between 30 degrees and 60 degrees, the second angle is within a range between 30 degrees and 59 degrees, and the third angle is greater than 90 degrees.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: March 26, 2024
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Chun-Te Wang, Yu-Shan Shen, Yen-Lung Chen
  • Publication number: 20240045131
    Abstract: A front light module includes a reflective display device, a front light guide, and a light emitting unit plate. The front light guide plate includes a micro-structure. The micro-structure has a first angle between a surface thereof close to the light emitting unit and an upper surface of the front light guide plate. The micro-structure has a second angle between a surface thereof away from the light emitting unit and the upper surface of the front light guide plate. The micro-structure has a third angle between the surface thereof close to the light emitting unit and the surface thereof away from the light emitting unit. The first angle is within a range between 30 degrees and 60 degrees, the second angle is within a range between 30 degrees and 59 degrees, and the third angle is greater than 90 degrees.
    Type: Application
    Filed: September 12, 2022
    Publication date: February 8, 2024
    Inventors: Chun-Te WANG, Yu-Shan SHEN, Yen-Lung CHEN
  • Publication number: 20230384504
    Abstract: A backlight module includes a light guide plate and a light source module. The light guide plate includes a light receiving surface, a light exit surface, and a bottom surface. The light exit surface is connected to a first end of the light receiving surface. The bottom surface is connected to a second end of the light receiving surface opposite to the first end and located opposite to the light exit surface. The bottom surface includes a central region and a peripheral girdle region at least partially surrounding the central region. The central region includes a plurality of first reflecting structures, and the peripheral girdle region includes a plurality of second reflecting structures. The second reflecting structure is different from the first reflecting structure. The light source module is disposed along the light receiving surface and provides light beams incident into the light receiving surface.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 30, 2023
    Inventors: YU-HUAN CHIU, CHIEN-WEI LIAO, YEN-LUNG CHEN
  • Publication number: 20230244106
    Abstract: The present disclosure provides a fabrication method of a light guide plate including the following steps. A first substrate with a processing plane is provided. A plurality of first mold trenches are formed along a second direction on the processing plane by a first cutter, where the first mold trenches are connected to each other. A plurality of second mold trenches are formed along a first direction different from the second direction in a first processing region of the processing plane by a second cutter, where the first processing region is near to a first edge of the processing plane. A light-emitting surface of the light guide plate is formed by using the first substrate as a mold.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 3, 2023
    Inventors: Yu-Huan CHIU, Chien-Wei LIAO, Yen-Lung CHEN
  • Patent number: 11662623
    Abstract: The present disclosure provides a backlight module including a plurality of light-emitting elements and a light guide plate, in which the light guide plate includes a light-emitting surface, a bottom surface opposite to the light-emitting surface, and a light-incident side connecting the light-emitting surface and the bottom surface. The light-emitting elements are disposed at the light-incident side along a first direction, and the light-emitting surface includes a first region near the light-incident side. The light guide plate includes a plurality of columns extending along the first direction and disposed in the first region of the light-emitting surface and a plurality of microstructure groups, in which each microstructure group includes a plurality of microstructures arranged along a second direction different from the first direction, and each microstructure connects the adjacent two of the columns.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: May 30, 2023
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yu-Huan Chiu, Chien-Wei Liao, Yen-Lung Chen
  • Publication number: 20230154570
    Abstract: A data processing system can be operated in one of a preprocessing mode, a short-read mapping mode, a sequence assembly mode or a variant calling mode that are related to a to-be-tested DNA sequence. The data processing system includes a sorting engine that supports high-speed processing of sorting in the preprocessing mode and the sequence assembly mode, and a dynamic processing engine that supports dynamic programming calculations in the short-read mapping mode and the variant calling mode. The data processing system may be implemented on a system-on-chip (SoC) for performing accelerated processing of gene sequencing data with reduced memory requirements.
    Type: Application
    Filed: August 3, 2022
    Publication date: May 18, 2023
    Applicants: National Yang Ming Chiao Tung University, National Taiwan University
    Inventors: Jui-Hung Hung, Chia-Hsiang Yang, Yi-Chung Wu, Yen-Lung Chen, Chung-Hsuan Yang
  • Patent number: 11415736
    Abstract: The present disclosure provides a backlight module including a light guide plate including a light-emitting surface, a bottom surface opposite to the light-emitting surface, and a light-incident side connecting the light-emitting surface and the bottom surface and light-emitting elements disposed at the light-incident side along a first direction. The light guide plate includes first columnar microstructures extending along a second direction perpendicular to the first direction on the light-emitting surface and columnar microstructure groups with second columnar microstructures, which are 1-15 times the number of the adjacent first columnar microstructures, between the first columnar microstructures extending along the second direction on the light-emitting surface. A first width of the first columnar microstructures is larger than or equal to a second width of the columnar microstructure groups along the first direction.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: August 16, 2022
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yu-Huan Chiu, Chien-Wei Liao, Yen-Lung Chen