Patents by Inventor Yen-Ming Huang

Yen-Ming Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959318
    Abstract: An oven includes an oven body, a heating element, a frame, and an oven door. The oven body has an inner space inside and includes a front plate, wherein the front plate has an entrance that communicates with the inner space. The heating element is adapted to heat the inner space. The frame is engaged with the oven body and has an abutted portion. The oven door is pivotally connected to the oven body and is located at the entrance. The oven door can pivot to a closed position to close the entrance and can pivot downward to an open position from the closed position to open the entrance. When the oven door is located at the open position, the second surface abuts against the abutted portion of the frame, thereby forming a platform outside the entrance for placing objects.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: April 16, 2024
    Assignee: GRAND MATE CO., LTD.
    Inventors: Chung-Chin Huang, Chin-Ying Huang, Hsin-Ming Huang, Hsing-Hsiung Huang, Yen-Jen Yeh
  • Publication number: 20240112707
    Abstract: A dynamic random access memory applied to an embedded display port includes a memory core unit, a peripheral circuit unit, and an input/output unit. The memory core unit is used for operating in a first predetermined voltage. The peripheral circuit unit is electrically connected to the memory core unit for operating in a second predetermined voltage, where the second predetermined voltage is lower than 1.1V. The input/output unit is electrically connected to the memory core unit and the peripheral circuit unit for operating in a third predetermined voltage, where the third predetermined voltage is lower than 1.1V.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 4, 2024
    Applicant: Etron Technology, Inc
    Inventors: Der-Min Yuan, Yen-An Chang, Wei-Ming Huang
  • Patent number: 11937515
    Abstract: Semiconductor device and methods of forming the same are provided. A semiconductor device according to one embodiment includes a dielectric layer including a top surface, a plurality of magneto-resistive memory cells disposed in the dielectric layer and including top electrodes, a first etch stop layer disposed over the dielectric layer, a common electrode extending through the first etch stop layer to be in direct contact with the top electrodes, and a second etch stop layer disposed on the first etch stop layer and the common electrode. Top surfaces of the top electrodes are coplanar with the top surface of the dielectric layer.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Fan Huang, Hsiang-Ku Shen, Liang-Wei Wang, Chen-Chiu Huang, Dian-Hau Chen, Yen-Ming Chen
  • Publication number: 20240084017
    Abstract: Monoclonal antibodies against human Mac-1 are provided. These antibodies can bind to different states of Mac-1 so as to alter the biofunctions of Mac-1. These antibodies can modulate Th1/Th2 cytokine secretions by TLR-activated immune cells and can be used for the treatments of diseases related to acute and chronic inflammatory disorders, such as infectious diseases, and cancers.
    Type: Application
    Filed: December 30, 2021
    Publication date: March 14, 2024
    Applicant: Ascendo Biotechnology, Inc.
    Inventors: Yen-Ta Lu, Chia-Ming Chang, Ping-Yen Huang, I-Fang Tsai, Frank Wen-Chi Lee
  • Patent number: 11923405
    Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen
  • Patent number: 10610168
    Abstract: A nursing call system includes an emergency call device, a display screen and an extension accessory. The extension accessory includes a connecting wire, a connecting end and a holding device. The connecting end is connected to one end of the connecting wire and is used to connect a connection member of the emergency call device. The holding device is connected to the other end of the connecting wire and includes a first physiological sensor and a second physiological sensor. The first physiological sensor includes a sensing component and is disposed to measure a first physiological information. The second physiological sensor is disposed to measure a second physiological information and includes a first sensing component and a second sensing component. The second sensing component and both of the first sensing component and the sensing component are respectively disposed at two different regions of the holding device.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: April 7, 2020
    Assignee: MELTEN CONNECTED HEALTHCARE INC.
    Inventors: Fang-Chi Wu, Yen-Ming Huang, Yun-Tse Hsiao, Chia-Chien Chang
  • Patent number: 10601620
    Abstract: A transmitting device comprises a modulation unit, for modulating a plurality of input signals into a plurality of modulated signals; a transform unit, coupled to the modulation unit, for transforming the plurality of modulated signals into a plurality of transformed signals according to a time-frequency transform; and a transmitting unit, coupled to the transform unit, for transmitting the plurality of transformed signals on a first subset of a plurality of subcarriers in a block transmission.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: March 24, 2020
    Assignees: National Taiwan University, MEDIATEK INC.
    Inventors: Yen-Ming Huang, Bor-Ching Su
  • Publication number: 20190246994
    Abstract: A nursing call system includes an emergency call device, a display screen and an extension accessory. The extension accessory includes a connecting wire, a connecting end and a holding device. The connecting end is connected to one end of the connecting wire and is used to connect a connection member of the emergency call device. The holding device is connected to the other end of the connecting wire and includes a first physiological sensor and a second physiological sensor. The first physiological sensor includes a sensing component and is disposed to measure a first physiological information. The second physiological sensor is disposed to measure a second physiological information and includes a first sensing component and a second sensing component. The second sensing component and both of the first sensing component and the sensing component are respectively disposed at two different regions of the holding device.
    Type: Application
    Filed: November 20, 2018
    Publication date: August 15, 2019
    Inventors: Fang-Chi WU, Yen-Ming HUANG, Yun-Tse HSIAO, Chia-Chien CHANG
  • Publication number: 20170070996
    Abstract: A transmitting device comprises a modulation unit, for modulating a plurality of input signals into a plurality of modulated signals; a transform unit, coupled to the modulation unit, for transforming the plurality of modulated signals into a plurality of transformed signals according to a time-frequency transform; and a transmitting unit, coupled to the transform unit, for transmitting the plurality of transformed signals on a first subset of a plurality of subcarriers in a block transmission.
    Type: Application
    Filed: September 1, 2016
    Publication date: March 9, 2017
    Inventors: Yen-Ming Huang, Bor-Ching Su
  • Patent number: 9405356
    Abstract: Systems and methods are disclosed managing power and/or temperature in a data storage system. A hybrid data storage device comprises a disk component and a non-volatile semiconductor memory component. The data storage device further comprises a temperature sensor and a controller configured to receive a temperature signal from the temperature sensor indicating a temperature of at least a portion of the data storage device and, when the temperature is determined to be greater than a first temperature, manage power to the semiconductor memory according to a first power throttling state.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: August 2, 2016
    Assignee: Western Digital Technologies, Inc.
    Inventors: Anil Sareen, Yen Ming Huang, Sanwu Tan
  • Publication number: 20150085818
    Abstract: A resource allocation method for device to device (D2D) communications and a base station using the same are provided. In the method, resource patterns are assigned, wherein each of the resource patterns comprises resource groups comprising the resource block(s). Frequency index and time index of each resource group in a time-frequency domain of resource pattern are determined, and there exists at least one of the resource patterns such that the time index of a first resource group and the time index of a second group are different. The resource groups of each resource pattern to the UEs are respectively assigned according to the frequency index and the time index of each of the resource groups in the time-frequency domain of each resource pattern.
    Type: Application
    Filed: September 26, 2014
    Publication date: March 26, 2015
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Yen-Ming Huang, Bor-Ching Su