Patents by Inventor Yen-Ni Hu

Yen-Ni Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
    Patent number: 10679965
    Abstract: A semiconductor package structure and manufacturing method thereof are provided, and the semiconductor package structure includes a semiconductor element, a top substrate, a bottom substrate, an insulating layer, and two metal conductive layers. The top substrate is mainly made of a conductive metal, and having a first separated portion on the top substrate, the first separated portion divides the top substrate into two blocks which are not electrically connected to each other. The bottom substrate is mainly made of the conductive metal, and having a second separated portion on the bottom substrate. The second separated portion divides the bottom substrate into two blocks which are not electrically connected to each other. The insulating layer is disposed between the top substrate and the bottom substrate. The metal conductive layer is disposed at two sides of the insulating layer and connected to the top substrate and the bottom substrate.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: June 9, 2020
    Assignee: ZOWIE TECHNOLOGY CORPORATION
    Inventors: Chia-Wei Li, Yen-Ni Hu
  • Semiconductor Package Structure and Manufacturing Method Thereof
    Publication number: 20160225684
    Abstract: A semiconductor package structure and manufacturing method thereof are provided, and the semiconductor package structure includes a semiconductor element, a top substrate, a bottom substrate, an insulating layer, and two metal conductive layers. The top substrate is mainly made of a conductive metal, and having a first separated portion on the top substrate, the first separated portion divides the top substrate into two blocks which are not electrically connected to each other. The bottom substrate is mainly made of the conductive metal, and having a second separated portion on the to bottom substrate. The second separated portion divides the bottom substrate into two blocks which are not electrically connected to each other. The insulating layer is disposed between the top substrate and the bottom substrate. The metal conductive layer is disposed at two sides of the insulating layer and connected to the top substrate and the bottom substrate.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 4, 2016
    Inventors: Chia-Wei Li, Yen-Ni Hu