Abstract: A test structure and methods of forming the same are described. In some embodiments, the structure includes a first portion having a first thickness, and the first portion comprises one or more dielectric layers. The test structure further includes a second portion disposed adjacent the first portion, the second portion has a second thickness substantially less than the first thickness, and the second portion includes the one or more dielectric layers and a first plurality of test conductive features disposed in the one or more dielectric layers. The test structure further includes a third portion disposed adjacent the second portion, the third portion has a third thickness substantially less than the second thickness, and the third portion comprises the one or more dielectric layers and a second plurality of test conductive features disposed in the one or more dielectric layers.