Patents by Inventor Yen-Pu Hsu

Yen-Pu Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7242998
    Abstract: Systems and methods for etching operation management. A process controller acquires a line width on a processed wafer, determines a first Critical Dimension (CD) bias by subtracting the measured width from a target width, determines an adjusted target width by providing a first and a second etching duration, determines a second CD bias by providing the adjusted target width, determines third etching duration corresponding to the second CD bias, receives an event from an etching tool, and directs the etching tool to perform etching operations on an initiated wafer for the third etching duration.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: July 10, 2007
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Pu Hsu, Wei Cheng Hsien
  • Patent number: 7127316
    Abstract: A computer implemented method for estimating manufacturing target bias for products in manufacturing tools. The method first establishes a first data set according to manufacturing target bias history based on a correlation with tools used. The manufacturing tools comprise a first manufacturing tool and other manufacturing tools. Next, a testing operation is executed for a predicted product in the first manufacturing tool to obtain a first predicted manufacturing target bias. Finally, manufacturing target bias of the predicted product in the other manufacturing tools is calculated according to the first data set and the first predicted manufacturing target bias.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: October 24, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Pu Hsu, Cheng Hsien Wei, Mei-Jen Wu
  • Publication number: 20060200265
    Abstract: Systems and methods for etching operation management. A process controller acquires a line width on a processed wafer, determines a first Critical Dimension (CD) bias by subtracting the measured width from a target width, determines an adjusted target width by providing a first and a second etching duration, determines a second CD bias by providing the adjusted target width, determines third etching duration corresponding to the second CD bias, receives an event from an etching tool, and directs the etching tool to perform etching operations on an initiated wafer for the third etching duration.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 7, 2006
    Inventors: Yen-Pu Hsu, Wei Hsien
  • Publication number: 20060111803
    Abstract: A computer implemented method for estimating manufacturing target bias for products in manufacturing tools. The method first establishes a first data set according to manufacturing target bias history based on a correlation with tools used. The manufacturing tools comprise a first manufacturing tool and other manufacturing tools. Next, a testing operation is executed for a predicted product in the first manufacturing tool to obtain a first predicted manufacturing target bias. Finally, manufacturing target bias of the predicted product in the other manufacturing tools is calculated according to the first data set and the first predicted manufacturing target bias.
    Type: Application
    Filed: November 19, 2004
    Publication date: May 25, 2006
    Inventors: Yen-Pu Hsu, Cheng Wei, Mei-Jen Wu