Abstract: The present invention provides a connector including a substrate, at least a conductive via disposed inside the substrate, a pad disposed on one surface of the substrate and electrically connected to the conductive via, a resilient flange disposed on the pad, and an anisotropic conductive adhesive interposed between the pad and the resilient flange to electrically connect the pad with the resilient flange.

Abstract: A manufacturing method of a circuit structure is provided as follows. Firstly, a base conductive layer is formed on the carrier board and a first patterned plating-resistant layer having at least one trench for exposing a part of the base conductive layer is formed on the base conductive layer. A first patterned conductive layer is then formed in the trench and a second patterned plating-resistant layer is formed which covers a part of the first patterned conductive layer and a part of the first patterned plating-resistant layer. A second patterned conductive layer is formed on the exposed first patterned conductive layer. The first and the second patterned plating-resistant layers and the base conductive layer exposed by the first patterned conductive layer are removed. Then, a patterned solder mask is formed for covering a part of the first patterned conductive layer.

Abstract: A circuit structure suitable for being disposed on a carrier board. The circuit structure comprises a first patterned conductive layer, a second patterned conductive layer, and a solder mask. The first patterned conductive layer is disposed on the carrier board. The second patterned conductive layer is disposed on a part of the first patterned conductive layer. A part of the edge of the second patterned conductive layer and a part of the edge of the first patterned conductive layer are substantially coplanar. The patterned solder mask covers a part of the first patterned conductive layer and has at least one opening for exposing the second patterned conductive layer and a part of the first patterned conductive layer adjacent to the second patterned conductive layer.

Abstract: A manufacturing method of a circuit structure is provided as follows. Firstly, a base conductive layer is formed on the carrier board and a first patterned plating-resistant layer having at least one trench for exposing a part of the base conductive layer is formed on the base conductive layer. A first patterned conductive layer is then formed in the trench and a second patterned plating-resistant layer is formed which covers a part of the first patterned conductive layer and a part of the first patterned plating-resistant layer. A second patterned conductive layer is formed on the exposed first patterned conductive layer. The first and the second patterned plating-resistant layers and the base conductive layer exposed by the first patterned conductive layer are removed. Then, a patterned solder mask is formed for covering a part of the first patterned conductive layer.