Abstract: A torque wrench for applying torque to fasteners, said torque wrench comprising a fastener drive structure having a head constructed and arranged to be removably engaged with a fastener and tang structure extending rearwardly from said head.

Abstract: Improved inspection techniques are described herein for checking for the presence of and identifying surface defects on a honeycomb body. The improved inspection utilizes measurement of travel of an outer surface of the honeycomb body to collect images of the outer surface. The images are combined into a composite image showing the outer surface of the honeycomb body. The composite image is analyzed to identify surface defects.

Abstract: An optical lens device includes a lens body, an optical filter and an optical absorbance portion. The lens body has a first lens surface and a second lens surface between which to form the optical filter where is to provide the optical absorbance portion. The optical absorbance portion includes a main absorbance area having an absorbance peak portion. The main absorbance area has a first wavelength range between 420 nm and 440 nm formed as a high-energy blue UV absorbance area.

Abstract: An optical lens device includes a lens body, an optical filter and an optical absorbance portion. The lens body has a first lens surface and a second lens surface between which to form the optical filter where is to provide the optical absorbance portion. The optical absorbance portion includes a first main absorbance area having a first absorbance peak portion and a second main absorbance area having a second absorbance peak portion. The first main absorbance area has a first wavelength range between 420 nm and 440 nm formed as a high-energy blue UV absorbance area while the second main absorbance area has a second wavelength range between 580 nm and 610 nm.

Abstract: A swimming posture correction method and a swimming posture correction system, adapted for a computing apparatus to correct a swimming posture of a swimmer using at least two gravity sensors, are provided. The gravity sensors are respectively disposed at ends of at least two limbs of the swimmer performing a relative stroke action. In the method, body parameters of the swimmer are obtained and a reference index of coordination for implementing a swimming posture suitable for the body parameters is captured. A stroke of the limb is monitored using the gravity sensors to obtain a timing diagram of the limbs performing a stroke promotion action. Then, an index of coordination of the swimmer is calculated by analyzing the timing diagram and compared with the reference index of coordination so as to prompt for correcting the swimming posture according to a comparison result.

Abstract: A swimming posture correction method and a swimming posture correction system, adapted for a computing apparatus to correct a swimming posture of a swimmer using at least two gravity sensors, are provided. The gravity sensors are respectively disposed at ends of at least two limbs of the swimmer performing a relative stroke action. In the method, body parameters of the swimmer are obtained and a reference index of coordination for implementing a swimming posture suitable for the body parameters is captured. A stroke of the limb is monitored using the gravity sensors to obtain a timing diagram of the limbs performing a stroke promotion action. Then, an index of coordination of the swimmer is calculated by analyzing the timing diagram and compared with the reference index of coordination so as to prompt for correcting the swimming posture according to a comparison result.

Abstract: A multiplayer sports formation arrangement prompting method adapted to monitor, by a computing device, a formation of a plurality of athletes participating in a multiplayer sport to prompt each of the athletes to adjust a position is provided, in which at least two wind sensors and a positioning device are disposed on or around each of the athletes.

Abstract: A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

Abstract: A wrench support rack including a base, and at least one clamp assembly attached to the base and comprising a vertical stop spaced apart from a push member. The space in between the vertical stop and the push member forms a groove configured to receive a stem of a wrench. The vertical stop includes an upper ridge portion configured to engage a stem of a wrench and limit vertical movement of a wrench disposed in the groove. The push member includes an inward protrusion configured to press a stem of a wrench in to the vertical stop and limit horizontal movement of a wrench disposed in the groove.

Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.

Abstract: A physiological sensor device and system, and a correction method are provided. The physiological sensor device includes a physiological signal sensor, a first compensation sensor, and a signal processing device. The physiological signal sensor is attached to an object to be detected to sense a physiological signal value. The first compensation sensor is disposed on the physiological signal sensor. The signal processing device is coupled to the physiological signal sensor and the first compensation sensor. The signal processing device obtains through the first compensation sensor a failure region of the physiological signal sensor partially detached from the object to be detected and obtains a first failure compensation value according to the failure region, so as to compensate the physiological signal value sensed by the physiological signal sensor.

Abstract: A wrench support rack including a base, and at least one clamp assembly attached to the base and comprising a vertical stop spaced apart from a push member. The space in between the vertical stop and the push member forms a groove configured to receive a stem of a wrench. The vertical stop includes an upper ridge portion configured to engage a stem of a wrench and limit vertical movement of a wrench disposed in the groove. The push member includes an inward protrusion configured to press a stem of a wrench in to the vertical stop and limit horizontal movement of a wrench disposed in the groove.

Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.

Abstract: A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.